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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 1,261 records · Page 70
All sourcesNASA NTRSDOE OSTI
NASA NTRS1995

Electrolysis Performance Improvement Concept Study (EPICS) flight experiment phase C/D

The overall purpose of the Electrolysis Performance Improvement Concept Study flight experiment is to demonstrate and validate in a microgravity environment the Static Feed Electrolyzer concept as well as investigate the effect of microgravity on water electrolysis performance. The scope of the experiment includes variations in microstructural characteristics of electrodes and current densities in a static feed electrolysis cell configuration. The results of the flight experiment will be used to improve efficiency of the static feed electrolysis process and other electrochemical regenerative life support processes by reducing power and expanding the operational range. Specific technologies that will benefit include water electrolysis for propulsion, energy storage, life support, extravehicular activity, in-space manufacturing and in-space science in addition to other electrochemical regenerative life support technologies such as electrochemical carbon dioxide and oxygen separation, electrochemical oxygen compression and water vapor electrolysis. The Electrolysis Performance Improvement Concept Study flight experiment design incorporates two primary hardware assemblies: the Mechanical/Electrochemical Assembly and the Control/Monitor Instrumentation. The Mechanical/Electrochemical Assembly contains three separate integrated electrolysis cells along with supporting pressure and temperature control components. The Control/Monitor Instrumentation controls the operation of the experiment via the Mechanical/Electrochemical Assembly components and provides for monitoring and control of critical parameters and storage of experimental data.

Schubert, F. H.↗
NASA NTRS2008

Materials, Processes and Manufacturing in Ares 1 Upper Stage: Integration with Systems Design and Development

Ares I Crew Launch Vehicle Upper Stage is designed and developed based on sound systems engineering principles. Systems Engineering starts with Concept of Operations and Mission requirements, which in turn determine the launch system architecture and its performance requirements. The Ares I-Upper Stage is designed and developed to meet these requirements. Designers depend on the support from materials, processes and manufacturing during the design, development and verification of subsystems and components. The requirements relative to reliability, safety, operability and availability are also dependent on materials availability, characterization, process maturation and vendor support. This paper discusses the roles and responsibilities of materials and manufacturing engineering during the various phases of Ares IUS development, including design and analysis, hardware development, test and verification. Emphasis is placed how materials, processes and manufacturing support is integrated over the Upper Stage Project, both horizontally and vertically. In addition, the paper describes the approach used to ensure compliance with materials, processes, and manufacturing requirements during the project cycle, with focus on hardware systems design and development.

Bhat, Biliyar N.↗
NASA NTRS2019

Design of P-3 Nadir Port

This project details the design and analysis of a structure to replace the interface of the P-3B nadir port with an optimized interface for science installations. A new nadir port plug has been designed to replace the OEM (Original Equipment Manufacturer) plug (Lockheed PN 910169) currently used in Nadir ports 1 and 2 on the NASA P-3B aircraft. The plug consists of a milled frame that can be outfitted with customizable flat plates to meet a broad range of science needs. The frame slides into place using the existing P-3B rail system using a lever and tie-rod assembly. The seal interface will contact the Fuselage skin of the aircraft and consists of a bulb E-seal that is riveted around the perimeter of the frame. The flat plate (20 inches x 31 inches) provides a large profile that can be outfitted based on science mission goals and requirements to attach multiple instruments. This is a significant increase to the aircraft capability. Previously, the OEM plug had to be modified to hold very small plates, windows, or instruments limiting the use of the ports.There were several challenges for this project that included a constrained schedule, lack of historical references, and reverse engineering. The unusually tight schedule for design, manufacture, and install limited potential approaches. In addition, design of a new interface to replace the existing plug, on an aircraft designed in the 1960's by Lockheed for the Navy with little to no documentation, required substantial reverse engineering. In order to accomplish this, a suitable method to determine interface requirements with the aircraft had to be solved. After several iterations, the solution was to implement laser scanning techniques to scan the aircraft and the OEM plug and generate a 3D model to capture the design envelope. The structure is designed to maintain a positive margin of safety when subjected to the inertial, pressure, and aerodynamic load requirements for an external installation on the P-3B, as described in the Wallops' P-3B Design Requirements 548-RQMT-0001 Rev. A . A finite element model is created in FEMAP (Finite Element Modeling And Postprocessing) and is run through NX Nastran solver to analyze the structure. After several iterations of analysis, the structure was enveloped to hold 115 pounds evenly distributed on the plate.

Chance, Monica↗
NASA NTRSDate not supplied

Laser-Processed Condensing Heat Exchanger for Space Applications

In sizing a condensing heat exchanger for space life support systems, there is a limit to allowable pressure drop along with a required vapor recuperation rate. This sizing is performed by using known heat transfer and pressure drop correlations in a numerical model. Dimpling the surface of an air-liquid channeled heat exchanger increases the convective heat transfer rate however creates difficulties within the numerical model as the flat plate correlations are no longer accurate. To increase the fidelity of the numerical model used for sizing the heat exchanger Computational Fluid Dynamics (CFD) with an SST k-ω turbulence model was performed on a periodic portion of the heat exchanger. Through CFD modeling a heat flux and pressure drop was measured across the heat exchanger channel, this information was used to create a localized Nusselt number that was incorporated into the numerical model along with a more accurate pressure drop due to the dimpled surface. Additionally, through modeling the heat exchanger after manufacturing and assembly in Computer Aided Drafting (CAD) software there was an increase in the measurement accuracy of geometric features which was incorporated into the numerical model for further increase in fidelity.

heat exchanger↗
NASA NTRS2019

Orion Heat Shield Manufacturing Producibility Improvements for the EM-1 Flight Test Program

This paper describes how the Orion program is incorporating improvements in the heat shield design and manufacturing processes reducing programmatic risk and ensuring crew safety in support of NASA’s Exploration Missions. The Orion program successfully completed the EFT-1 flight test in 2014 and is currently developing the EM-1 spacecraft to meet the test objectives of an orbital mission to the moon and return to earth in 2019. Lessons learned from the EFT-1 manufacturing and flight test experience are being incorporated into a wide variety of vehicle systems and manufacturing processes to reduce risk to the Orion missions and flight crew. A critical contributor to crew safety is the heat shield that protects the crew capsule during re-entry through the earth’s atmosphere for return from deep space. The first flight test vehicle, EFT-1, was manufactured and tested in the Neil Armstrong Operations and Checkout (O&C) facility at KSC to demonstrate early risk reduction including the functionality of the Thermal Protection Systems (TPS) for capsule safe return to earth. The approach for the EFT-1 heat shield utilized a low risk approach using Apollo heritage design and manufacturing processes using an Avcoat TPS ablator with a honeycomb substrate to provide a one piece heat shield to meet the mission re-entry heating environments. The manufacturing processes used honeycomb cell injection guns which were redeveloped from the Apollo Lunar Program processes to build the EFT-1 heat shield. The completed heat shield was transported across the country by aircraft to the O&C at KSC for installation onto the capsule. The EFT-1 heat shield successfully performed its mission and experienced ~80% of the re-entry velocity (50% heating rate) for a lunar return for an Exploration Mission. The second flight test vehicle is the EM-1 mission which will have additional flight systems installed to fly to the moon and return. Heat shield design and producibility improvements have been incorporated in the EM-1 vehicle to meet deep space mission and programmatic requirements. The design continues to use the Avcoat material, but in a “block” configuration to enable improvements in the application processes as well as additional improvements in the carrier structure design and manufacturing operations. Incorporating flight test results and producibility improvements from EFT-1 for the heat shield system design and processes have improved the thermal protection capability, improved the producibility, and cost for EM-1 flight test.

Producibility↗
NASA NTRS1994

An acoustic charge transport imager for high definition television applications

The primary goal of this research is to develop a solid-state high definition television (HDTV) imager chip operating at a frame rate of about 170 frames/sec at 2 Megapixels per frame. This imager offers an order of magnitude improvement in speed over CCD designs and will allow for monolithic imagers operating from the IR to the UV. The technical approach of the project focuses on the development of the three basic components of the imager and their integration. The imager chip can be divided into three distinct components: (1) image capture via an array of avalanche photodiodes (APD's), (2) charge collection, storage and overflow control via a charge transfer transistor device (CTD), and (3) charge readout via an array of acoustic charge transport (ACT) channels. The use of APD's allows for front end gain at low noise and low operating voltages while the ACT readout enables concomitant high speed and high charge transfer efficiency. Currently work is progressing towards the development of manufacturable designs for each of these component devices. In addition to the development of each of the three distinct components, work towards their integration is also progressing. The component designs are considered not only to meet individual specifications but to provide overall system level performance suitable for HDTV operation upon integration. The ultimate manufacturability and reliability of the chip constrains the design as well. The progress made during this period is described in detail in Sections 2-4.

Hunt, W. D.↗
NASA NTRS2010

SCRL-Model for Human Space Flight Operations Enterprise Supply Chain

This paper will present a Supply Chain Readiness Level (SCRL) model that can be used to evaluate and configure adaptable and sustainable program and mission supply chains at an enterprise level. It will also show that using SCRL in conjunction with Technology Readiness Levels (TRLs), Manufacturing Readiness Levels (MRLs) and National Aeronautics Space Administrations (NASA s) Project Lifecycle Process will provide a more complete means of developing and evaluating a robust sustainable supply chain that encompasses the entire product, system and mission lifecycle. In addition, it will be shown that by implementing the SCRL model, NASA can additionally define supplier requirements to enable effective supply chain management (SCM). Developing and evaluating overall supply chain readiness for any product, system and mission lifecycle is critical for mission success. Readiness levels are presently being used to evaluate the maturity of technology and manufacturing capability during development and deployment phases of products and systems. For example, TRLs are used to support the assessment of the maturity of a particular technology and compare maturity of different types of technologies. MRLs are designed to assess the maturity and risk of a given technology from a manufacturing perspective. In addition, when these measurement systems are used collectively they can offer a more comprehensive view of the maturity of the system. While some aspects of the supply chain and supply chain planning are considered in these familiar metric systems, certain characteristics of an effective supply chain, when evaluated in more detail, will provide an improved insight into the readiness and risk throughout the supply chain. Therefore, a system that concentrates particularly on supply chain attributes is required to better assess enterprise supply chain readiness.

Tucker, Brian↗
NASA NTRSDate not supplied

Open-source Numerical Modeling of Solidification Cracking Susceptibility: Application to Refractory Alloy Systems

Introduction. Alloys such as aluminum, nickel-base, and austenitic stainless steels are susceptible to solidification cracking during welding and 3D printing. Compositional optimization is one method used to effectively mitigate solidification cracking of those alloy systems. With the surge in hypersonic and in-space propulsion activities, refractory metals (Nb, Mo, Ta, W, and Re) and their alloy derivatives are increasing in importance due to their extreme high melting point and retention of high-temperature strength; however, their chemistry was most typically optimized to promote ductility during mechanical operations such as drawing and forming. Welding of such alloys has been a challenge due to a number of issues including solidification cracking, atmospheric contamination (O, C, and N), as well as a shift in ductile-to-brittle transition to higher temperature following grain growth induced by welding. Compositional optimization of refractory alloys for solidification cracking resistance in particular is desirable as their usage increases with the advent of advanced manufacturing methods such as 3D printing. This work evaluates the effect of compositional variation in refractory metal systems on the solidification cracking susceptibility with the goals of optimizing existing alloys and joining process techniques, and formulating new alloys with increased solidification cracking resistance. Experimental Procedures. A python code was developed in a Jupyter notebook environment (Michael and Sowards, 2023) to facilitate the calculation of crack susceptibility index proposed by Kou (2015). Composition is entered as a single point, or as a 1-D or 2-D array. The notebook calls pycalphad (Otis and Liu, 2017 and Bocklund et al, 2020) to calculate the evolution of fraction solid as a function of temperature (under either Scheil or equilibrium assumptions) and then evaluates steepness of the fraction solid curve near the terminal stage of solidification to predict solidification cracking resistance. Open source thermodynamic databases available at online repositories are used (van de Walle). The process is setup in an automated fashion to generate plots that show variation in solidification cracking susceptibility according to composition on 1-D line plots or 2-D contour plots. The Jupyter notebook and crack susceptibility algorithm was also integrated with a widely used commercial CALPHAD code for validation and alloy exploration. Results and Discussion. The crack susceptibility model was first validated against a series of refractory alloy compositions evaluated in past work which utilized a specialized Varestraint test built inside a vacuum chamber environment (Lessman and Gold, 1971). The alloys tested in the Varestraint apparatus included T-111 (Ta-8W-2Hf), ASTAR-811C (Ta-8W-1Re-0.7Hf-0.025C), FS-85 (Nb-27Ta-10W-1Zr), T-222 (Ta-9.6W-2.4Hf-0.01C), Ta-10W, B-66 (Nb-5Mo-5V-1Zr), and SCb-291 (Nb-10W-10Ta). The initial test of the model showed a strong correlation with empirical Varestraint data, i.e., a Spearman rank correlation between model predictions and hot cracking measurements was observed to be greater than 0.8. Following the validation, a set of refractory metal binary mixtures was investigated to evaluate sensitivity of Nb, Mo, W, and Ta to C, N, and O content. A series of plots were produced that suggest ppmw ranges of C, N, and O where solidification cracking increases significantly and reaches a maximum. Also comparative ranking of each primary refractory metal to each interstitial was produced. For example C produces greater cracking response in Mo whereas O produces greater cracking response in Ta and Nb. Such compositional values have utility in setting limits on pickup of these interstitial elements during welding and printing rather than using a one-size-fits-all approach. Furthermore, the results have use in determining additive powder recycling requirements, which is especially pertinent for refractory metal powders due to their high cost compared to conventional alloys. Another application created thousands of hypothetical alloys within the nominal specified composition range of two widely used refractory alloys C103 (Nb-10Hf-1Ti) and TZM (Mo-0.5Ti-0.1Zr). The cracking index was calculated for the alloys and results were fed into machine learning regression techniques including Multiple Linear Regression, Ridge Regression, and Lasso Regression to determine relative potency each alloying element had on computed solidification cracking index. A series of linear equations were produced that relate composition of C103 and TZM to solidification cracking index. The crack susceptibility of C103 for example is described by an equation of the form: cracking index ~ O + 0.667*C + 0.635*N + 0.00037*Ta – 0.0008*Hf (in wt.%) From that equation, it is clear that O has strong propensity to induce solidification cracking. Interestingly, Hf is shown to reduce calculated cracking response. Finally, realizing the potential of this method to discover new refractory alloy formulations across the period table that have low solidification cracking sensitivity, the code was applied to new untested alloy systems including W-Zr-C, W-Ta-C, and others. Conclusions. In summary, an open source numerical method has been developed using Python code to calculate Kou’s crack susceptibility index. The method was applied to refractory metals which are inherently difficult to study from a weldability testing standpoint since inert shielding gas is not sufficient and welding is typically done in vacuum, especially in light of findings presented here where oxygen has profound influence on solidification cracking. This work revealed the effect of compositional variations on a series of refractory metals and showed the framework defined here will be useful in 1) the development of new alloys that have improved weldability and 3D printability, 2) placing compositional limits on existing alloys, and 3) ensuring adequate controls of manufacturing processes such as 3D printing where powder reuse is critical. Keywords. pycalphad; Python; refractory metals; solidification cracking. References. B. Bocklund et. al. (2020) http://doi.org/10.5281/zenodo.3630657. S. Kou. (2015) https://doi.org/10.1016/j.actamat.2015.01.034. G.G. Lessmann and R.E. Gold. Welding Journal, issue 1, pp. 1-s – 8-s (1971). F.N. Michael and J.W. Sowards. NASA/TM-20230002218 (2023). R. Otis and Z.-K. Liu. (2017) http://doi.org/10.5334/jors.140. A. Van de Wallle et. al. (2018) https://doi.org/10.1016/j.calphad.2018.04.003.

pycalphad↗
NASA NTRS1974

Implications of multiplane-multispeed balancing for future turbine engine design and cost

This paper describes several alternative approaches, provided by multiplane-multispeed balancing, to traditional gas turbine engine manufacture and assembly procedures. These alternatives, which range from addition of trim-balancing at the end of the traditional assembly process to modular design of the rotating system for assembly and balancing external to the engine, require attention by the engine designer as an integral part of the design process. Since multiplane-multispeed balancing may be incorporated at one or more of several points during manufacture-assembly, its deliberate use is expected to provide significant cost and performance (reduced vibration) benefits. Moreover, its availability provides the designer with a firm base from which he may advance, with reasonable assurance of success, into the flexible rotor dynamic regime.

Badgley, R. H.↗
NASA NTRS2004

Optimal Synthesis of Compliant Mechanisms using Subdivision and Commercial FEA (DETC2004-57497)

The field of distributed-compliance mechanisms has seen significant work in developing suitable topology optimization tools for their design. These optimal design tools have grown out of the techniques of structural optimization. This paper will build on the previous work in topology optimization and compliant mechanism design by proposing an alternative design space parameterization through control points and adding another step to the process, that of subdivision. The control points allow a specific design to be represented as a solid model during the optimization process. The process of subdivision creates an additional number of control points that help smooth the surface (for example a C(sup 2) continuous surface depending on the method of subdivision chosen) creating a manufacturable design free of some traditional numerical instabilities. Note that these additional control points do not add to the number of design parameters. This alternative parameterization and description as a solid model effectively and completely separates the design variables from the analysis variables during the optimization procedure. The motivation behind this work is to create an automated design tool from task definition to functional prototype created on a CNC or rapid-prototype machine. This paper will describe the proposed compliant mechanism design process and will demonstrate the procedure on several examples common in the literature.

Hull, Patrick V.↗
NASA NTRS1973

Greases

The characteristics and applications of greases are discussed. The basic components of greases are analyzed to show the types of additives used and the basis for grease classification. Manufacturing methods for soap base and nonsoap base greases are described. The tests which are conducted to determine the properties of greases are reported.

Mccarthy, P. R.↗
NASA NTRS1979

Transistor step stress testing program for JANTX2N2905A

The effect of power/temperature step stress when applied to the transistor JANTX2N2905A manufactured by Texas Instruments and Motorola is reported. A total of 48 samples from each manufacturer was submitted to the process outlined. In addition, two control sample units were maintained for verification of the electrical parametric testing. All test samples were subjected to the electrical tests outlined in Table 2 after completing the prior power/temperature step stress point.

Source record↗
NASA NTRS1979

Transistor step stress program for JANTX2N2432A

Power/temperature step stress was applied to the transistor JANTX2N2432A manufactured by Crystalonics and Texas Instruments. A total of 48 samples from each manufacturer were submitted to the process outlined. In addition, two control sample units were maintained for verification of the electrical parametric testing. All test samples were subjected to the electrical tests after completing the prior power/temperature step stress point.

Source record↗
NASA NTRS1979

Diode step stress program for JANTX1N5552

The effect of power/temperature step stress when applied to the switching diode JANTX1N5554 manufactured by Semtech and Micro Semiconductor was evaluated. A total of 48 samples from each manufacturer were submitted to the process outlined. In addition, two control sample units were maintained for verification of the electrical parametric testing.

Source record↗
NASA NTRS1979

Transistor step stress program for JANTX2N2219A

Power/temperature step stress was applied to the dual transistor JANTX2N2219A manufactured by Texas Instruments and National Semiconductor. A total of 48 samples from each manufacturer were submitted to the process outlined. In addition, two control sample units were maintained for verification of the electrical parametric testing. All test samples were subjected to electrical tests after completing the prior power/temperature step stress point.

Source record↗
NASA NTRS1979

Diode step stress testing program for JANTX1n5420

Data compiled for the purpose of evaluating the effect of power/temperature step stress when applied to the diode JANTX1N5420 manufactured by Unitrode and Micro-Semiconductor is presented. A total of 48 samples from each manufacturer was submitted to the processes outlined. In addition, two control sample units were maintained for verification of the electrical parametric testing.

Source record↗
NASA NTRS1982

High density Schottky barrier IRCCD sensors for SWIR applications at intermediate temperature

Monolithic 32 x 64 and 64 x 1:128 palladium silicide (Pd2Si) interline transfer infrared charge coupled devices (IRCCDs) sensitive in the 1 to 3.5 micron spectral band were developed. This silicon imager exhibits a low response nonuniformity of typically 0.2 to 1.6% rms, and was operated in the temperature range between 40 to 140 K. Spectral response measurements of test Pd2Si p-type Si devices yield quantum efficiencies of 7.9% at 1.25 microns, 5.6% at 1.65 microns 2.2% at 2.22 microns. Improvement in quantum efficiency is expected by optimizing the different structural parameters of the Pd2Si detectors. The spectral response of the Pd2Si detectors fit a modified Fowler emission model. The measured photo-electric barrier height for the Pd2Si detectors is 0.34 eV and the measured quantum efficiency coefficient, C1, is 19%/eV. The dark current level of Pd2Si Schottky barrier focal plane arrays (FPAs) is sufficiently low to enable operation at intermediate temperatures at TV frame rates. Typical dark current level measured at 120 K on the FPA is 2 nA/sq cm. The operating temperature of the Pd2Si FPA is compatible with passive cooler performance. In addition, high density Pd2Si Schottky barrier FPAs are manufactured with high yield and therefore represent an economical approach to short wavelength IR imaging. A Pd2Si Schottky barrier image sensor for push-broom multispectral imaging in the 1.25, 1.65, and 2.22 micron bands is being studied. The sensor will have two line arrays (dual band capability) of 512 detectors each, with 30 micron center-to-center detector spacing. The device will be suitable for chip-to-chip abutment, thus providing the capability to produce large, multiple chip focal planes with contiguous, in-line sensors.

Elabd, H.↗