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DOE OSTI · 2283168

Advanced Packaging Designs

Abstract

The primary deliverable for this project will be to construct a power electronics package utilizing an organic, electrically insulating substrate material and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.

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DeVoto, Douglas (ORCID:0000000348179647), Major, Joshua (ORCID:0000000194240643), Paret, Paul (ORCID:0000000312660922), Allen, Bob, Miscall, Joel, Xue, Lincoln, Herczeg, Susan, Smith, Greg. 2024-01-23. Advanced Packaging Designs. https://www.osti.gov/biblio/2283168

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