Engineering Papers⌕ Search
Home/Archive/DOE OSTI

DOE OSTI · 2305396

Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime

Paret, Paul (ORCID:0000000312660922)
View original source ↗Read source document ↗Export metadata ↓

Abstract

Advanced packaging technologies are currently being designed and developed by the power electronics industry however, the maximum operating temperature is still limited to 175 degrees Celsius for the silicon carbide devices. Bonded materials such as sintered copper and polymeric materials are potential candidates for high temperature operation, but it is critical to characterize and evaluate its reliability under harsh operating conditions. In this project, we discuss the results of the accelerated experiments conducted on sintered copper and polymeric materials. Additionally, a novel framework to develop the lifetime prediction model of bonded interfaces through employing statistical and machine learning models are described. In this task, scanning acoustic microscope images of bonded interfaces obtained under thermal cycling experiments are used as the data.

Explore related subjects

ENGINEERINGpolymeric materialsintered coppertime-series forecasting

Keep this discovery

Explore connections, maps & timelines

BibTeXRIS

Paret, Paul (ORCID:0000000312660922). 2024-02-07. Power Electronics Materials and Bonded Interfaces - Reliability and Lifetime. https://www.osti.gov/biblio/2305396

Cite the original work for its findings. Save a collection to share your selection of sources.

KEEP EXPLORING

Related reports

DOE OSTI2024

Tailoring Growth Interfaces of Virtual Substrates for Power Electronics

Power electronics materials are poised to play a critical role in fulfilling next generation energy needs, with up to 90% of future energy demand predicted to flow through power electronics at some point. AlxGa1-xN ranks high among candidate materials, having bipolar dopability, thermal and chemical stability and an ultra-wide bandgap. However, AlGaN growth is limited by a lack of lattice-matched substrates, ultimately stunting material quality at higher thicknesses needed for power electronics applications. Further, high power applications increasingly call for fully vertical device structures, necessitating a conductive substrate. Recently our group identified the (111) plane of TaC as a conductive surface lattice-matched to Al0.55Ga0.45N, taking inspiration from prior work of AlN and GaN binaries on carbide and boride substrates. In this talk we demonstrate the growth of (111)-oriented TaC by RF sputtering. We investigate the interface of TaC with sapphire and SiC substrates and identify means to suppress competing Ta2C nucleation in order to stabilize (111)-oriented TaC. Potential stacking sequences are identified with respect to crystal structure and observed twinning in the TaC films. We next assess structural changes and film recrystallization that results from face-to-face annealing of TaC thin films at high temperatures above 1500 degrees C. Changes to grain structure and domain size are assessed by x-ray diffraction and surface morphology is explored using atomic force microscopy. Figure 1 shows significant improvements to in- and out-of-plane strain following annealing along with the formation of terraced step edges at the film surface. Strain as a function of material composition and thickness is considered, as this may play a major role in future nucleation of AlGaN layers. (1) R. J. in a face-to-face configuration, as illustrated in the schematic at left. Kaplar et al 2017, ECS J. Solid State Sci. Technol. 6 Q3061; (2) D. M. Roberts et al 2022, https://arxiv.org/abs/2208.11769; (3) T. Aizawa et al 2008, J Crys Growth 310, 1 22; (4) R. Liu et al 2002, Appl. Phys. Lett. 81, 3182-3184.

ENGINEERING↗
DOE OSTI2024

Modelling a Motor Cooling System with Stator Lamination Fins

This work investigates the potential for cooling a radial permanent magnet motor by means of stator lamination fins. To form the fins, certain stator laminations have a larger external diameter. The optimal number of fins, as well as fm thickness, was determined to reach the maximal heat transfer between the motor stator and the coolant. Finite element and computational fluid dynamics modelling were used to calculate the thermal performance of the motor.

ENGINEERING↗
DOE OSTI2024

Advanced Packaging Designs

The primary deliverable for this project will be to construct a power electronics package utilizing an organic, electrically insulating substrate material and demonstrate superior thermal performance and greater reliability under thermal cycling, thermal aging, vibration, power cycling, and electrical high-potential evaluation over traditional packages.

ENGINEERING↗