Engineering Papers⌕ Search

Engineering topics

Miller, W. E.

Publications and source records attributed to Miller, W. E..

At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1988

Structural properties of bismuth-bearing semiconductor alloys

The structural properties of bismuth-bearing III-V semiconductor alloys InPBi, InAsBi, and InSbBi were studied theoretically. Bond energies, bond lengths, and strain coefficients were calculated for pure AlBi, GaBi, and InBi compounds and their alloys, and predictions were made for the mixing enthalpies, miscibility gaps, and critical metastable-to-stable material transition temperatures. Miscibility calculations indicate that InSbBi will be the most miscible, and the InPBi will be the the most difficult to mix. However, calculations of the hardness of the Bi compounds indicate that, once formed, the InPBi alloy will be harder than the other Bi alloys and substantially harder than the currently favored narrow-gap semiconductor HgCdTe.

Berding, M. A.↗
NASA NTRS1986

Quantitative thermal diffusivity measurements of composites

A remote radiometric technique for making quantitative thermal diffusivity measurements is described. The technique was designed to make assessments of the structural integrity of large composite parts, such as wings, and can be performed at field sites. In the measurement technique, a CO2 laser beam is scanned using two orthogonal servo-controlled deflecting mirrors. An infrared imager, whose scanning mirrors oscillate in the vertical and the horizontal directions, is used as the detector. The analysis technique used to extract the diffusivity from these images is based on a thin infinite plate assumption, which requires waiting a given period of time for the temperature to equilibrate throughout the thickness of the sample. The technique is shown to be accurate to within two percent for values of the order of those for composite diffusivities, and to be insensitive to convection losses.

Heath, D. M.↗
NASA NTRS1982

Photocapacitive image converter

An apparatus for converting a radiant energy image into corresponding electrical signals including an image converter is described. The image converter includes a substrate of semiconductor material, an insulating layer on the front surface of the substrate, and an electrical contact on the back surface of the substrate. A first series of parallel transparent conductive stripes is on the insulating layer with a processing circuit connected to each of the conductive stripes for detecting the modulated voltages generated thereon. In a first embodiment of the invention, a modulated light stripe perpendicular to the conductive stripes scans the image converter. In a second embodiment a second insulating layer is deposited over the conductive stripes and a second series of parallel transparent conductive stripes perpendicular to the first series is on the second insulating layer. A different frequency current signal is applied to each of the second series of conductive stripes and a modulated image is applied to the image converter.

Miller, W. E.↗
NASA NTRS1980

Photocapacitive image converter

Solid-state converters yield high sensitivity at high information-retrieval speed. Main advantages are high sensitivity of photocapacitive mechanism and inherent speed of information retrieval method. Fabrication of both devices is relatively simple and inexpensive.

Miller, W. E.↗
NASA NTRS1980

Improved characterization of the Si-SiO2 interface

Refined quasi-static and conductance methods, based on effectively thin composite insulating layers, low-carrier-concentration bulk semiconductors, and low-level illumination, have been applied to an improved characterization of the (100) Si-SiO2 interface. Accurate measurement of both the total density of interface states and its major components as a function of energy in the forbidden gap have been made over four decades (10-billion to 100-trillion states/eV sq cm) on a single sample. The normal U-shaped density of states is resolved into separate valence- and conduction-band-derived contributions as well as impurity-derived contributions corresponding to concentrations on the order of 20 ppm at the interface.

Su, P.↗
NASA NTRS1980

Improved insulator layer for MIS devices

Insulating layer of supersonic conductor such as LaF sub 3 has been shown able to impart improved electrical properties to photoconductive detectors and promises to improve other metal/insulator/semiconductor (MIS) devices, e.g., MOSFET and integrated circuits.

Miller, W. E.↗
NASA NTRS1980

Si and GaAs photocapacitive MIS infrared detectors

Improvement of the previously reported photocapacitive MIS infrared detectors has led to the development of exceptional room-temperature devices. Unoptimized peak detectivities on the order of 10 to the 13th cm sq rt Hz/W, a value which exceeds the best obtainable from existing solid-state detectors, have now been consistently obtained in Si and GaAs devices using high-capacitance LaF3 or composite LaF3/native-oxide insulating layers. The measured spectral response of representative samples is presented and discussed in detail together with a simple theory which accounts for the observed behavior. The response of an ideal MIS photocapacitor is also contrasted with that of both a conventional photoconductor and a p-i-n photodiode, and reasons for the superior performance of the MIS detectors are given. Finally, fundamental studies on the electrical, optical, and noise characteristics of the MIS structures are analyzed and discussed in the context of infrared-detector applications.

Sher, A.↗
NASA NTRS1979

Ge photocapacitive MIS infrared detectors

An undoped Ge photocapacitive detector is reported which has peak normalized detectivities at wavelengh 1.4 microns and chopping frequencies 13-1000 Hz of 9 x 10 to the 12th, 4 x 10 to the 9th cm Hz to the 1/2th/W operating respectively at temperatures 77, 195, and 295 K. The observed temperature, spectral, and frequency response of the signal and noise are explained in terms of the measured space charge and interface state properties of the device.

Binari, S. C.↗
NASA NTRS1979

LaF3 insulators for MIS structures

Thin films of LaF3 deposited on Si or GaAs substrates have been observed to form blocking contacts with very high capacitances. This results in comparatively hysteresis-free and sharp C-V (capacitance-voltage) characteristics for MIS structures. Such structures have been used to study the interface states of GaAs with increased resolution and to construct improved photocapacitive infrared detectors.

Sher, A.↗
NASA NTRS1979

Monolithic InSb imaging arrays with charge-coupled device /CCD/ readout

The paper demonstrates the detection of infrared radiation and signal readout on a monolithic InSb charge coupled infrared imaging device. The device is a 20-element linear imager with MOS detectors coupled to a four-phase, surface-channel, charge transfer structure. The charge transfer device is p-channel and has planar ion implanted diode structures for zero input and charge readout. Sensitivity measurements on the MOS infrared detectors were determined for the 20-element array. Data are presented on the operational characteristics of the 20-element linear imager under various conditions of electrical and optical inputs in both multiplexed and a time delay and integration (TDI) mode. Plans are discussed for a monolithic InSb 100-element linear imager and a 20 x 16 TDI linear imager.

Miller, W. E.↗
NASA NTRS1978

Photocapacitive MIS infrared detectors

A new class of room-temperature infrared detectors has been developed through use of metal-insulator-semiconductor (MIS) or metal-insulator-semiconductor-insulator-metal (MISIM) slabs. The detectors, which have been fabricated from Si, Ge and GaAs, rely for operation on the electrical capacitance variations induced by modulated incident radiation. The peak detectivity for a 1000-A Si MISIM detector is comparable to that of a conventional Si detector functioning in the photovoltaic mode. Optimization of the photocapacitive-mode detection sensitivity is discussed.

Sher, A.↗
NASA NTRS1978

Effects of accumulated film layers on the accuracy of quartz film thickness monitors

The effect of accumulation layers on the accuracy of quartz thin-film thickness monitors is evaluated. Use of an expanded plane wave ultrasonic propagation theory correctly accounts for observed experimental data. The magnitude of the maximum errors calculated for simply reversing the order of a series of aluminum gold deposits is on the order of 5%. If one totally neglects intervening layers, multiple film propagation and nonlinearity can produce errors greater than 50%.

Heyman, J. S.↗
NASA NTRS1975

Stopping cross sections for 0.25-3.0-MeV He-4 ions in cadmium sulfide

Stopping cross sections of He-4 ions with energies between 0.25 and 3.0 MeV have been measured for cadmium sulfide with a probable error of plus or minus 7% to 8%. The experimental method utilized the Rutherford backscattering technique and measured the energy loss of elastically scattered He-4 ions from films of cadmium sulfide sputtered on carbon substrates. The experimental data are compared with recent experimental and theoretical results.

Miller, W. E.↗
NASA NTRS1975

An investigation of RF sputter etched silicon surfaces using helium ion backscatter

The effect of RF sputter etching on the (111) surface of silicon was studied by observing backscatter spectra from a 2 MeV, He-4(+) beam oriented along the silicon 111 orientation channel. Silicon samples were RF sputter etched in an argon discharge at electrode bias potentials ranging from 0.5 to 2.5 kV. The samples were sputter etched for a time sufficient for the lattice damage to reach saturation. Analysis of these samples revealed that the thickness of this damage layer and the concentration of trapped argon increased with electrode bias potential. An annealing study of these damaged surfaces was carried out to 900 C.

Sachse, G. W.↗