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At least 1,243 records · Page 69

Analysis and evaluation in the production process and equipment area of the low-cost solar array project

The energy consumed in manufacturing silicon solar cell modules was calculated for the current process, as well as for 1982 and 1986 projected processes. In addition, energy payback times for the above three sequences are shown. The module manufacturing energy was partitioned two ways. In one way, the silicon reduction, silicon purification, sheet formation, cell fabrication, and encapsulation energies were found. In addition, the facility, equipment, processing material and direct material lost-in-process energies were appropriated in junction formation processes and full module manufacturing sequences. A brief methodology accounting for the energy of silicon wafers lost-in-processing during cell manufacturing is described.

Goldman, H.↗

Current Status of NASA's Heavy Lift Plans

Numerous studies since the Apollo Program of the 1960s have highlighted the benefits of - and the need for - a national heavy lift launch capability to support human exploration, science, national security, and commercial development of space. NASA's most recent and most refined effort to develop that heavy lift capability is the Ares V. Ares V is a key element of NASA's Constellation Program. It s overall goal s part of approved national space policy is to retire the Space Shuttle and develop its successor, complete the International Space Station, and resume human exploration beyond low Earth orbit (LEO), beginning with exploration of the Moon as a step to other destinations in the Solar System. Ares V s first role is that of cargo vehicle to carry a lunar lander into Earth orbit, rendezvous with astronauts launched on the smaller Ares I crew launch vehicle, and perform the trans lunar injection (TLI) mission to send the mated crew and lander vehicles to the Moon. The design reference missions (DRMs) envisioned for it also include direct lunar cargo flights and a human Mars mission. Although NASA's priority from the start of the Constellation Program to the present has been development of the Ares I and Orion crew vehicle to replace the retiring Shuttle fleet, the Ares team has made significant progress in understanding the performance, design trades, technology needs, mission scenarios, ground and flight operations, cost, and other factors associated with heavy lift development. The current reference configuration was selected during the Lunar Capabilities Concept Review (LCCR) in fall 2008. That design has served since then as a point of departure for further refinements and trades among five participating NASA field centers. Ares V development to date has benefited from progress on the Ares I due to commonality between the vehicles. The Ares I first stage completed a successful firing of a 5-segment solid rocket motor. The Ares I-X launch Numerous studies since the Apollo Program of the 1960s have highlighted the benefits of and the need for - a national heavy lift launch capability to support human exploration, science, national security, and commercial development of space. NASA s most recent and most refined effort to develop that heavy lift capability is the Ares V. Ares V is a key element of NASA s Constellation Program. It s overall goal s part of approved national space policy is to retire the Space Shuttle and develop its successor, complete the International Space Station, and resume human exploration beyond low Earth orbit (LEO), beginning with exploration of the Moon as a step to other destinations in the Solar System. Ares V s first role is that of cargo vehicle to carry a lunar lander into Earth orbit, rendezvous with astronauts launched on the smaller Ares I crew launch vehicle, and perform the trans lunar injection (TLI) mission to send the mated crew and lander vehicles to the Moon. The design reference missions (DRMs) envisioned for it also include direct lunar cargo flights and a human Mars mission. Although NASA s priority from the start of the Constellation Program to the present has been development of the Ares I and Orion crew vehicle to replace the retiring Shuttle fleet, the Ares team has made significant progress in understanding the performance, design trades, technology needs, mission scenarios, ground and flight operations, cost, and other factors associated with heavy lift development. The current reference configuration was selected during the Lunar Capabilities Concept Review (LCCR) in fall 2008. That design has served since then as a point of departure for further refinements and trades among five participating NASA field centers. Ares V development to date has benefited from progress on the Ares I due to commonality between the vehicles. The Ares I first stage completed a successful firing of a 5-segment solid rocket motor. The Ares I-X launch successfully demonstrated in suborbital flighhe ability to assemble, prepare, launch, control and recover the Ares I configuration and compare performance to computer models. Component tests continue on the J-2X engine, which will put both the Ares I and Ares V upper stages into orbit. In addition, more than 100,000 parts have been manufactured or on the assembly line for the first J-2X powerpack and the first two development engines, with hot fire tests to begin in 2011. This paper will further detail the progress to date on the Ares V and planned activities for the remainder of 2010. In addition, the Ares V team has continued its outreach to potential user communities in science and national security. Through the Constellation Program, NASA has amassed an enormous knowledge base in the design, technologies, and operations of heavy lift launch vehicles that will be a national asset for any future launch vehicle decision. This early phase of the design presents the best opportunity to incorporate where possible the insights and needs of other users.

Creech, Steve↗

Development of Critical Profilometers to Meet Current and Future NASA Composite Overwrapped Pressure Vessel (COPV) Inspection Needs

This project is part of a multi-center effort to develop and validate critical NDE techniques which can be implemented into current and future NASA spacecraft COPV manufacturing processes. After decades of COPV development, manufacturing variance is still high and has necessitated higher safety factors and additional mass to be flown on spacecraft (reducing overall performance). Additionally, the NASA Engineering and Safety Center (NESC) indicated that nondestructive evaluation (NDE) was not adequately implemented during Shuttle and International Space Station (ISS) COPV manufacturing and provisions were not made for on-going structural integrity and health checks during the various spacecraft programs. This project helps to provide additional data needed to help address these issues. This project seeks to develop and install internal and external laser profilometers at COPV manufacturing facilities to provide data needed to improve COPV quality and consistency. This project also investigates other scanning techniques that will enhance the system to more completely meet manufacturing needs, thus transforming the profilometer into what has been termed the "Universal Manufacturing COPV Scanner".

Saulsberry, Regor↗

Transistor step stress testing program for JANTX2N4856

The effect of power/temperature step stress when applied to a field effect transistor JANTX2N4856 manufactured by Texas Instruments and Teledyne was evaluated. A total of 48 samples from each manufacturer was submitted to the process. In addition, two control units were maintained for verification of the electrical parametric testing.

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Diode step stress program for JANTX1N2970b

Data for the purpose of evaluating the effect of power/temperature step stress was studied when applied to the zener diode JANTX1N2970B manufactured by Siemens and General Semiconductor, Inc. A total of 48 samples from each manufacturer was submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing. The tests for determining power/temperature stresses are described, and test results are discussed. Failure analyses for power stress, and temperature stress are presented.

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Diode step stress program for JANTX1N5615

The effect of power/temperature step stress when applied to the switching diode JANTX1N5615 manufactured by Semtech and Micro semiconductor was examined. A total of 48 samples from each manufacturer were submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing. All test samples were subjected to the electrical tests after completing the prior power/temperature step stress point. Results are presented.

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Diode step stress program for JANTX1N1202A

Power/temperature step stress was applied to the switching diode JANTX1N1202A manufactured by General Electric and International Rectifier. A total of 48 samples from each manufacturer was submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing. All test samples were subjected to the electrical tests after completing the prior power/temperature step stress point. Results are given.

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Transistor step stress program for JANTX2N2060

The effect of power/temperature step stress when applied to the dual transistor JANTX2N2060 manufactured by Raytheon and Motorola is reported. A total of 48 samples from each manufacturer were submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing. All test samples were subjected to the electrical tests after completing the prior power/temperature step stress point. Results are given.

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Diode step stress program for JANTX1N3893

Data for the purpose of evaluating the effect of power/temperature step stress on the diode JANTX1N3893 manufactured by Siemens and Motorola is presented. A total of 48 samples from each manufacturer were submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing.

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Diode step stress testing program for JANTX1N2989B

The effect of power/temperature step stress when applied to the zener diode JANTX2N2989 manufactured by Siemens and General Semiconductor is reported. A total of 48 samples from each manufacturer was submitted to the process. In addition, two control sample units were maintained for verification of the electrical parameteric testing.

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Diode step stress testing program for JANTX1N3016B

The effect of power/temperature step stress when applied to a variety the zener diode JANTX2N3016B manufactured by Siemens and Motorola is reported. A total of 48 samples from each manufacturer was submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing.

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Diode step stress testing program for JANTX1N3031B

The effect of power/temperature step stress when applied to the zener diode JANTX1N3031B manufactured by Siemens and Motorola is reported. A total of 48 samples from each manufacturer was submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing.

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Diode step stress testing program for JANTX1N5618

The effect of power/temperature step stress when applied to the switching diode JANTX1N5618 manufactured by Semtech and Micro Semiconductor is reported. A total of 48 samples from each manufacturer was submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing.

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Transistor step stress testing program for JANTX2N2369A

The effect is reported of power/temperature step stress when applied to the transistor JANTX2N2369A manufactured by Raytheon and National Semiconductor. A total of 48 samples from each manufacturer was submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing. The power/thermal stress tests are described, and failure analyses are presented.

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Report of the Technology and Test Panel

The state of technology relative to the Tethered Satellite System (TSS) was reviewed. The technology areas which could benefit from the TSS were defined. To support TSS design studies it is necessary to develop tether dynamic model computer codes for definition of mission and tether requirements. Present major codes are very elaborate, expensive to run, and not very user friendly. An additional technology concern was related to the manufacturing of tethers. The development of complex tethers (nonconducting-taper/double taper long 100 km, conducting-embedded conduction, fiber optics, and superconducting) and their applications to space stations requires the development of manufacturing capabilities for both Earth-based as well as space-based systems.

Siemers, P.↗

The case for Mars II

Among the topics discussed are: the political aspects of the exploration of Mars, preparatory mission scenarios in advance of manned Martian exploration, and scientific programs for a base on Mars. Consideration is also given to: mission strategies and spacecraft design for a Mars base program; concepts for the realization of a manned mission to Mars; dirigible airship applications to Martian surface exploration; and the power requirements of several Martian base designs. Additional topics include: the impact of propellant manufacturing on early manned exploration of the solar system; water supply issues for a manned Mars base; and psychological and interpersonal adaptation to life on Mars.

Mckay, C. P.↗

Engineering and operational characteristics of the extended duration orbiter

A program is being pursued to lengthen the mission duration of the Space Shuttle from 10 days to 16 days, with future plans to increase the on-orbit stay time to 28 days. Presently, the length of the mission is limited by fuel cell reactants, stowage constraints, and life-support system consumables. In December 1988, NASA gained approval to begin the design and development of the extensive modifications to OV-102 Columbia required to extend its mission duration to 16 days. Additionally, OV-105 Endeavour is now being manufactured so as not to preclude its transformation to a 28-day vehicle in the future, should that program gain subsequent approval and funding. The first extended duration orbiter (EDO) launch of Columbia is slated for March 1992 with the US microgravity laboratory (USML) as its payload. Scientific payloads such as the USML and Spacelab, which require longer periods of zero gravity or the vacuum of space, will greatly benefit from the EDO program.

Cerna, Peter J.↗

Quantum efficiency measurements of Tektronix backside thinned CCDs

Results are presented of a program in progress to produce CCDs with high stable quantum efficiency (QE). Measurements made at 253.7 nm over a six-month period showed no significant QE difference between two CCDs manufactured in 1989 and one manufactured in 1988. QE improvement by the addition of a two-layer antireflection coating is about threefold at 400 nm.

Delamere, Alan↗