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Reinforced polyimide structures are described. Reinforcing materials are impregnated with a suspension of polyimide prepolymer and bonded together by heat and pressure to form a cured, hard-reinforced, polyimide structure.
Studies were conducted to develop a structural adhesive system possessing useful properties over a 20 to 589 K temperature range. Adhesive systems based on polyimide, polyphenylquinoxaline, polyquinoxaline, polybenzothiazole and polybenzimidazole polymers first were screened for suitability. Detailed evaluation of two polyimide adhesive systems, BR34/FM34 and P4/A5F or P4A/A5FA, and one polyphenylquinoxaline adhesive system, PPQ (IMW), then was performed. Property information was generated over the full temperature range for shear strength, stressed and unstressed thermal aging, thermal shock, and coefficient of thermal expansion. Both polyimide adhesive systems were identified as being capable of providing structural adhesive joints for cryogenic/high temperature service.
Processing techniques were developed for the fabrication of both polyphenylquinoxaline and polyimide composites by the in situ polymerization of monomeric reactants directly on the graphite reinforcing fibers, rather than using previously prepared prepolymer varnishes. Void-free polyphenylquinoxaline composites were fabricated and evaluated for room and elevated flexure and shear properties. The technology of the polyimide system was advanced to the point where the material is ready for commercial exploitation. A reproducible processing cycle free of operator judgment factors was developed for fabrication of void-free composites exhibiting excellent mechanical properties and a long time isothermal life in the range of 288 C to 316 C. The effects of monomer reactant stoichiometry and process modification on resin flow were investigated. Demonstration of the utility and quality of this polyimide system was provided through the successful fabrication and evaluation of four complex high tip speed fan blades.
Degradation of high performance polyimide precursor resins was investigated by measuring the molecular weight of the polymers in solution, using a membrane osmometer. It was found that polyimide precursor resins composed of BTDA and ODPA combined with DABP and MDA were unstable in DMAC. The degradation rate was found to depend upon the chemical nature of the isomeric diamine and the geometric structure about the amide linkage. The polymers of DABP were less susceptible to degradation than those of MDA and p,p'-compounds were more stable than m,m'-compounds. These results suggest that degradation is correlated with the basicity of the diamine. That is, the rate of the degradation reaction increases with the basicity of the diamine group in the polyimide precursor resin. The presence of water and a higher temperature increased the degradation rate of the polymers.
The effects that expected space flight environment has upon the mechanical properties of epoxy and polyimide matrix composites were analyzed. Environmental phenomena covered water immersion, high temperature aging, humidity, lightning strike, galvanic action, electromagnetic interference, thermal shock, rain and sand erosion, and thermal/vacuum outgassing. The technology state-of-the-art for graphite and boron reinforced epoxy and polyimide matrix materials is summarized to determine the relative merit of using composites in the space shuttle program. Resin matrix composites generally are affected to some degree by natural environmental phenomena with polyimide resin matrix materials less affected than epoxies.
The purpose of this program was to find a fire- and rot-retardant polymer/fungicide reaction product for coating mine timbers. Fire-retardant polymers were screened as films and coatings on fir wood. Curable polyimide appeared to be flame retardant and evolved a minimum of fumes when exposed to a flame. Several organic and metal, low toxicity, fungicides were reacted with the polyimide in-situ on the wood. These coated samples were screened for fungus resistance. All formulations rated well - even the polyimide film without additives was fungicidal. The fir wood control itself resisted internal damage during the ten weeks of fungus exposure. A more severe test for fungus resistance will be required.
A structural design study was conducted to assess the relative merits of structural concepts using advanced composite materials for an advanced supersonic aircraft cruising at Mach 2.7. The configuration and structural arrangement developed during Task I and II of the study, was used as the baseline configuration. Allowable stresses and strains were established for boron and advanced graphite fibers based on projected fiber properties available in the next decade. Structural concepts were designed and analyzed using graphite polyimide and boron polyimide, applied to stiffened panels and conventional sandwich panels. The conventional sandwich panels were selected as the structural concept to be used on the wing structure. The upper and lower surface panels of the Task I arrow wing were redesigned using high-strength graphite polyimide sandwich panels over the titanium spars and ribs. The ATLAS computer system was used as the basis for stress analysis and resizing the surface panels using the loads from the Task II study, without adjustment for change in aeroelastic deformation. The flutter analysis indicated a decrease in the flutter speed compared to the baseline titanium wing design. The flutter analysis indicated a decrease in the flutter speed compared to the baseline titanium wing design. The flutter speed was increased to that of the titanium wing, with a weight penalty less than that of the metallic airplane.
Analogues of methylene dianilines were synthesized, in which the methylene group between the two aromatic nuclei was replaced by various perfluoroalkylene linkage. The hydrolytic thermal, and thermal oxidative stabilities of PMR Polyimides derived from these diamines were determined. Three types of PMR Polyimide discs were fabricated from the dimethyl ester of 3,3', 4,4'-benzophenonetetracarboxylic acid, the methyl ester of 5-norbornene-2,3-dicarboxylic acid, and one of the following three diamines: methyl dianiline, 1,3-bis(4-aminophenyl)hexafluoropropane, and 2,2-bis(4-aminophenyl)hexafluoropropane. The polyimide based on 2,2-bis(4-aminophenyl)hexafluoropropane exhibited the best hydrolytic, thermal, and thermal oxidative stability as determined by moisture uptake and thermogravimetric analysis.
Experimental polyimide resins have been developed and evaluated as potential high temperature adhesives for bonding Kapton polyimide film. Lap shear strengths of 'Kapton'/'Kapton' bonds were obtained as a function of test temperature, adherend thickness, and long term aging at 575K (575 F) in vacuum. Glass transition temperatures of the polyimide/'Kapton' bondlines were monitored by thermomechanical analysis.
A process for preparing a thermoplastic poly(imidesulfone) is disclosed. This resulting material has thermoplastic properties which are generally associated with polysulfones but not polyimides, and solvent resistance which is generally associated with polyimides but not polysulfones. This system is processable in the 250 to 350 C range for molding, adhesive and laminating applications. This unique thermoplastic poly(imidesulfone) is obtained by incorporating an aromatic sulfone moiety into the backbone of an aromatic linear polyimide by dissolving a quantity of a 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) in a solution of 3,3'-diaminodiphenylsulfone and bis(2-methoxyethyl)ether, precipitating the reactant product in water, filtering and drying the recovered poly(amide-acid sulfone) and converting it to the poly(imidesulfone) by heating.
A multilevel metal interconnection system for very large scale integration (VLSI) systems utilizing polyimides as the interlayer dielectric material is described. A complete characterization of polyimide materials is given as well as experimental methods accomplished using a double level metal test pattern. A low temperature, double exposure polyimide patterning procedure is also presented.
Partially fluorinated polyimides were prepared and molded in the form of discs and pins for test as potential apex seal materials for advanced rotary combustion engines. The polyimides were formulated from the diamine 2,2-bis 4-(4-aminophenoxy)phenyl hexafluoropropane (4-BDAF) and the dianhydrides of pyromellitic acid (PMDA) and benzophenonetetracarboxylic acid (BTDA). Tribological testing was performed at sliding speeds of 0.31 to 11.6 m/s and at temperatures of from 298K to 573K. It is shown that the carbon fiber filled polyimides, particularly the 80/20 compositions, have an excellent balance of wear/friction at 573K. The unfilled, 80/20 and 60/40 compositions indicate an unusual combination of high friction and low wear which may be advantageous in such applications as brakes and traction drives.
A process for preparing a thermoplastic poly(midesulfone) is disclosed. This resulting material has thermoplastic properties which are generally associated with polysulfones but not polyimides, and solvent resistant which is generally associated with polyimides but not polysulfones. This system is processable in the 250 to 350 C range for molding, adhesive and laminating applications. This unique thermoplastic poly(imidesulfone) is obtained by incorporating an aromatic sulfone moiety into the backbone of an aromatic linear polyimide by dissolving a quantity of a 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) in a solution of 3,3'-diaminodiphenylsulfone and bis(2-methoxyethyl)ether, precipitating the reactant product in water, filtering and drying the recovered poly(amide-acid sulfone) and converting it to the poly(imidesulfone) by heating.
Ion beam sputter-deposited thin films of Al2O3, SiO2, and a codeposited mixture of predominantly SiO2 with small amounts of a fluoropolymer were evaluated both in laboratory plasma ashing tests and in space on board shuttle flight STS-8 for effectiveness in preventing oxidation of polyimide Kapton. Measurements of mass loss and optical performance of coated and uncoated polyimide samples exposed to the low Earth orbital environment are presented. Optical techniques were used to measure loss rates of protective films exposed to atomic oxygen. Results of the analysis of the space flight exposed samples indicate that thin film metal oxide coatings are very effective in protecting the polyimide. Metal oxide coatings with a small amount of fluoropolymer codeposited have the additional benefit of great flexibility.
The polyimide from BTDA 1,6-hexanediamine and m-phenylenediamine was selected from a prior study for the present study. Methods to prepare prepreg which would provide low void composites at low molding pressures from the thermoplastic polyimide were studied. Cresol solutions of the polyimide were applied to a balanced weave carbon fabric and the cresol removed prior to composite molding. Low void composites were prepared from smoothed prepregs at high pressures (34.5 MPa) and temperatures as low as 260 C. Lower molding pressures lead to higher void composites. Need for a lower melt viscosity in the neat resin is suggested as a requirement to achieve low void composites at low pressures. Some mechanical properties are included.
An in situ diffuse reflectance-Fourier transform infrared technique was developed to determine infrared spectra of graphite fiber prepregs as they were being cured. A bismaleimide, an epoxy, and addition polyimide matrix resin prepregs were studied. An experimental polyimide adhesive was also examined. Samples were positioned on a small heater at the focal point of diffuse reflectance optics and programmed at 15 F/min while FTIR spectra were being scanned, averaged, and stored. An analysis of the resulting spectra provided basic insights into changes in matrix resin molecular structure which accompanied reactions such as imidization and crosslinking. An endo-exothermal isomerization involving reactive end-caps was confirmed for the addition polyimide prepregs. The results of this study contribute to a fundamental understanding of the processing of composites and adhesives. Such understanding will promote the development of more efficient cure cycles.
High-temperature adhesive systems are evaluated for short and long-term stability at temperatures ranging from 232C to 427C. The resins selected for characterization include: NASA Langley developed polyphenylquinoxaline (PPQ), and commercially available polyimides (PI). The primary method of bond testing is single lap shear. The PPQ candidates are evaluated on 6A1-4V titanium adherends with chromic acid anodize and phosphate fluoride etch surface preparations. The remaining adhesives are evaluated on 15-5 PH stainless steel with a sulfuric acid anodize surface preparation. Preliminary data indicate that the PPQ adhesives tested have stability to 3000 hours at 450F with chromic acid anodize surface preparation. Additional studies are continuing to attempt to improve the PPQ's high-performance by formulating adhesive films with a boron filler and utilizing the phosphate fluoride surface preparation on titanium. Evaluation of the polyimide candidates on stainless-steel adherends indicates that the FM-35 (American Cyanamid), PMR-15 (U.S. Polymeric/Ferro), TRW partially fluorinated polyimide and NR 150B2S6X (DuPont) adhesives show sufficient promise to justify additional testing.
A series of condensation polyimides based on pyromellitic dianhydride is synthesized and evaluated for potential application at 371 C. Several three-and four-ring benzenoid diamine systems containing oxygen bridging groups are investigated. Thermomechanical analysis of neat resin specimens indicate that the polyimide prepared from the dimethyl ester of pyrometallitic acid (PMDE) and 2,2-bis4-(4'-aminophenoxy) phenyl]-1,1,1,3,3,3- hexafluoropropane (BDAF) is the only resin system which has a glass transition temperature (Tg) above 371 C. The Tg of the PMDE/BDAF polyimide is found to be 390 C after a postcure air at 371 C for 24 hr. Unidirectional composites are fabricated from the PMDE/BDAF system and unsized Celion 6000 graphite fibers. Final cure temperatures in the range of 371 to 427 C with an applied pressure of 10.34 to 13.78 MPa are investigated. The void content of the composites ranges from 4.6 to 8.6 percent. Composites cured at 399 C under a pressure of 10.34 MPa and postcured in air at 371 C for 24 hr exhibit the highest 371 C interlaminar shear strength (ILSS, 40.7 MPa) and flexural strength (758 MPa). The thermo-oxidative stability of the composites is determined by subjecting specimens to isothermal exposure at 371 C in air at atmospheric pressure, as well as a pressure of 0.52 MPa. Specimens exposed at atmospheric pressure exhibit a weight loss of 12 percent after 200 hr of exposure and 88 percent retention of its original 371 C ILSS. In contrast, the specimens exposed at 0.52 MPa pressure exhibit a comparable weight loss after only 72 hr, and a 71 percent retention of its original 371 C ILSS.