Cryogenic/high temperature structural adhesives

Abstract

Studies were conducted to develop a structural adhesive system possessing useful properties over a 20 to 589 K temperature range. Adhesive systems based on polyimide, polyphenylquinoxaline, polyquinoxaline, polybenzothiazole and polybenzimidazole polymers first were screened for suitability. Detailed evaluation of two polyimide adhesive systems, BR34/FM34 and P4/A5F or P4A/A5FA, and one polyphenylquinoxaline adhesive system, PPQ (IMW), then was performed. Property information was generated over the full temperature range for shear strength, stressed and unstressed thermal aging, thermal shock, and coefficient of thermal expansion. Both polyimide adhesive systems were identified as being capable of providing structural adhesive joints for cryogenic/high temperature service.