Effect of reactor irradiation on ductile- brittle transition and stress-strain behavior of tungsten
Reactor irradiation effects on ductile brittle transition and stress-strain behavior of tungsten
Wrights, G. N.↗
SEARCH · Engineering Papers
Results for “Effective stress”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.
The effects of pin elasticity, clearance, and friction on the stresses in a pin-loaded orthotropic plate
The effects of pin elasticity, clearance, and friction on the stresses in a pin loaded orthotropic plate are studied. The effects are studied by posing the problem as a planar contact elasticity problem, the pin and the plate being two elastic bodies which interact through contact. Coulomb friction is assumed, the pin loads the plate in one of its principal material directions, and the plate is infinite in extent. A collocation scheme and interaction, in conjunction with a complex variable series solution, are used to obtain numerical results. The contact region between the plate and pin is unknown and must be solved for as part of the solution. The same is true of the region of friction induced no slip. Two pin stiffnesses, two clearance levels, two friction levels and two laminates, a (0/+ or - 45/90)s and a (02/+ or - 45)s, are studied. The effects of pin elasticity, clearance, and friction on the load capacity of the plate are assessed by comparing the load capacity of the plate with the capacity when the pin is rigid, perfectly fitting, and frictionless.
Hyer, M. W.↗
Transistor step stress testing program for JANTX2N2905A
The effect of power/temperature step stress when applied to the transistor JANTX2N2905A manufactured by Texas Instruments and Motorola is reported. A total of 48 samples from each manufacturer was submitted to the process outlined. In addition, two control sample units were maintained for verification of the electrical parametric testing. All test samples were subjected to the electrical tests outlined in Table 2 after completing the prior power/temperature step stress point.
Source record↗
Diode step stress program for JANTX1N649-1
The effect of power/temperature step stress when applied to a variety of semiconductor devices is evaluated. A total of 48 samples were submitted to be processed. Control sample units were maintained for verification of the electrical parametric testing. The test circuit was used to power all of the test devices during the power/temperature stress conditions.
Source record↗
Diode step stress testing program for JANTX1N2989B
The effect of power/temperature step stress when applied to the zener diode JANTX2N2989 manufactured by Siemens and General Semiconductor is reported. A total of 48 samples from each manufacturer was submitted to the process. In addition, two control sample units were maintained for verification of the electrical parameteric testing.
Source record↗
Diode step stress testing program for JANTX1N3016B
The effect of power/temperature step stress when applied to a variety the zener diode JANTX2N3016B manufactured by Siemens and Motorola is reported. A total of 48 samples from each manufacturer was submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing.
Source record↗
Diode step stress testing program for JANTX1N3031B
The effect of power/temperature step stress when applied to the zener diode JANTX1N3031B manufactured by Siemens and Motorola is reported. A total of 48 samples from each manufacturer was submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing.
Source record↗
Diode step stress testing program for JANTX1N5618
The effect of power/temperature step stress when applied to the switching diode JANTX1N5618 manufactured by Semtech and Micro Semiconductor is reported. A total of 48 samples from each manufacturer was submitted to the process. In addition, two control sample units were maintained for verification of the electrical parametric testing.
Source record↗
Diode step stress testing program for JANTX1N759A
The effect of power/temperature step stress when applied to a variety of voltage regulating diodes manufactured by Texas Instruments and Siemens was investigated. Test requirements are described and results are tabulated. Failure modes are discussed.
Source record↗
Transistor step stress testing program for JANTX2N2484
The effect of power/temperature step stress when applied to the transistor JANTX2N2484, manufactured by Raytheon and Teledyne was evaluated. Forty-eight samples from each manufacturer were divided equally (16 per group) into three groups and submitted to the processes outlined. In addition, two control sample units were maintained for verification of the electrical parametric testing.
Source record↗
Radiation shear-stress heating in accretion flows
The effects of radiation shear stresses acting in accretion disks and boundary layers are considered. It is demonstrated that these stresses are dynamically unimportant for nonrelativistic flows. For accretion onto a black hole or nonmagnetic neutron star, where the system is relativistic, radiation shear stresses can contribute substantially to the total luminosity of the system. The spectral and temporal signatures of this form of heating are discussed, and those features which are unique to radiative dissipation are emphasized. The results are in broad agreement with the spectra of the nonmagnetic X-ray binary systems, including Cyg X-1.
Walker, Mark A.↗
Carotid baroreflex responsiveness in heat-stressed humans
The effects of whole body heating on human baroreflex function are relatively unknown. The purpose of this project was to identify whether whole body heating reduces the maximal slope of the carotid baroreflex. In 12 subjects, carotid-vasomotor and carotid-cardiac baroreflex responsiveness were assessed in normothermia and during whole body heating. Whole body heating increased sublingual temperature (from 36.4 +/- 0.1 to 37.4 +/- 0.1 degrees C, P < 0.01) and increased heart rate (from 59 +/- 3 to 83 +/- 3 beats/min, P < 0. 01), whereas mean arterial blood pressure (MAP) was slightly decreased (from 88 +/- 2 to 83 +/- 2 mmHg, P < 0.01). Carotid-vasomotor and carotid-cardiac responsiveness were assessed by identifying the maximal gain of MAP and heart rate to R wave-triggered changes in carotid sinus transmural pressure. Whole body heating significantly decreased the responsiveness of the carotid-vasomotor baroreflex (from -0.20 +/- 0.02 to -0.13 +/- 0.02 mmHg/mmHg, P < 0.01) without altering the responsiveness of the carotid-cardiac baroreflex (from -0.40 +/- 0.05 to -0.36 +/- 0.02 beats x min(-1) x mmHg(-1), P = 0.21). Carotid-vasomotor and carotid-cardiac baroreflex curves were shifted downward and upward, respectively, to accommodate the decrease in blood pressure and increase in heart rate that accompanied the heat stress. Moreover, the operating point of the carotid-cardiac baroreflex was shifted closer to threshold (P = 0.02) by the heat stress. Reduced carotid-vasomotor baroreflex responsiveness, coupled with a reduction in the functional reserve for the carotid baroreflex to increase heart rate during a hypotensive challenge, may contribute to increased susceptibility to orthostatic intolerance during a heat stress.
NASA Discipline Cardiopulmonary↗
The effects of cognitive and behavioral control on post-stress performance
A study was designed to investigate the effects of behavioral and cognitive control on post-stress performance. Half of the subjects exposed to loud unpredictable noise bursts were given 'behavioral' control (a button which would terminate the noise), while the other half had no behavioral control. In addition, subjects were provided with one of three levels of feedback (success, failure, or no feedback) regarding their performance during the noise. It was expected that information about performance would provide subjects with an increased sense of 'cognitive' control which would affect their appraisal of stressful events and their later performance. The results indicated that subjects given feedback performed better on subsequent tasks than those given no feedback. Perceived behavioral control had little effect on performance. The causal attributions made by subjects were used to interpret these effects. These findings were viewed as supportive of Averill's (1973) notion that various types of control are related to stress in a complex fashion. The data may also support the reformulation by Abramson et al. (1978) of learned helplessness theory.
Foushee, H. C.↗
Mapping of flumioxazin tolerance in a snap bean diversity panel leads to the discovery of a master genomic region controlling multiple stress resistance genes
Effective weed management tools are crucial for maintaining the profitable production of snap bean (Phaseolus vulgaris L.). Preemergence herbicides help the crop to gain a size advantage over the weeds, but the few preemergence herbicides registered in snap bean have poor waterhemp (Amaranthus tuberculatus) control, a major pest in snap bean production. Waterhemp and other difficult-to-control weeds can be managed by flumioxazin, an herbicide that inhibits protoporphyrinogen oxidase (PPO). However, there is limited knowledge about crop tolerance to this herbicide. We aimed to quantify the degree of snap bean tolerance to flumioxazin and explore the underlying mechanisms. We investigated the genetic basis of herbicide tolerance using genome-wide association mapping approach utilizing field-collected data from a snap bean diversity panel, combined with gene expression data of cultivars with contrasting response. The response to a preemergence application of flumioxazin was measured by assessing plant population density and shoot biomass variables. Snap bean tolerance to flumioxazin is associated with a single genomic location in chromosome 02. Tolerance is influenced by several factors, including those that are indirectly affected by seed size/weight and those that directly impact the herbicide's metabolism and protect the cell from reactive oxygen species-induced damage. Transcriptional profiling and co-expression network analysis identified biological pathways likely involved in flumioxazin tolerance, including oxidoreductase processes and programmed cell death. Transcriptional regulation of genes involved in those processes is possibly orchestrated by a transcription factor located in the region identified in the GWAS analysis. Several entries belonging to the Romano class, including Bush Romano 350, Roma II, and Romano Purpiat presented high levels of tolerance in this study. The alleles identified in the diversity panel that condition snap bean tolerance to flumioxazin shed light on a novel mechanism of herbicide tolerance and can be used in crop improvement.
60 APPLIED LIFE SCIENCES↗
Shear-Sensitive Monomer/Polymer Liquid Crystal System
Report describes preliminary investigation of new monomer/polymer liquid crystal system, thin film of shear-sensitive cholesteric monomer liquid crystal (TI 511) on Xydar (STR800) (or equivalent) liquid crystal polymer substrate. Monomer/polymer liquid crystal films applied to surfaces provide quantitative indications of shear stresses caused by winds blowing along surfaces. Effects of shear stresses reversible in new coating system. System provides quantitative data on flows in wind tunnels.
Singh, Jag J.↗
Multi-parameter yield zone model for predicting spectrum crack growth
A phenomenological load interaction model referred to as the Multi-Parameter Yield Zone model is presented which accounts for crack growth retardation caused by previous overloads, acceleration due to current overloads, and underload effects. In the present model, load interaction effects are calculated utilizing a residual stress intensity concept. Crack growth retardation and acceleration are accounted for by decreasing or increasing, respectively, the effective stress ratio used in a modified Forman's (1967) crack growth equation. Results of spectrum crack growth predictions for 2219-T851 aluminum are presented.
Johnson, W. S.↗
Microstructure-based prediction of thermal aging strength reduction factors for grade 91 ferritic-martensitic steel
This study aimed to develop a microstructure-based mechanistic approach to address the long-term thermal aging effect on yield stress and ultimate tensile strength and to provide a physical basis for developing thermal aging factors for G91 for a design life of 60 years. Several heats of G91 steel were examined. Controlled aging experiments were conducted on two heats at temperatures of 550, 600, and 650 °C for times up to ~64,000 h. Specimens were also taken from archived creep-tested specimens of G91 and from a tube removed from the Kingston coal-fired power plant to obtain data that cover a wide range of temperatures and for aging times up to 155,000 h. Thermal aging caused significant subgrain recovery, coarsening of M 23 C 6 carbides at subgrain boundaries and MX carbonitrides within subgrains. The intermetallic Laves phase forms during aging and grows rapidly. The growth rate of the subgrain width and MX mean size during thermal aging were described by kinetic models. Thermal aging results in the reductions in the yield stress and the ultimate tensile strength of G91. The effects of thermal aging on the reductions in yield stress and ultimate tensile strength were well described by the microstructure-strength model that considers three superimposed strengthening mechanisms, namely, sub-boundary strengthening, MX precipitation hardening, and Mo solid solution strengthening. Furthermore, the model was independently validated by the ASME Code values and is being used by the ASME to develop the aging-induced strength reduction factors for G91 steel for a design life of 60 years.
36 MATERIALS SCIENCE↗
The effect of fiber microstructure on evolution of residual stresses in silicon carbide/titanium aluminide composites
This paper examines the effect of the morphology of the SCS6 silicon carbide fiber on the evolution of residual stresses in SiC/Ti composites. A micromechanics model based on the concentric cylinder concept is presented which is used to calculate residual stresses in a SiC/Ti composite during axisymmetric cooling by a spatially uniform temperature change. The silicon carbide fiber is modeled as a layered material with five distinct transversely isotropic and orthotropic, elastic layers, whereas the titanium matrix is taken to be isotropic, with temperature-dependent elastoplastic properties. The results arc compared with those obtained based on the assumption that the silicon carbide fiber is isotropic and homogeneous.
Pindera, Marek-Jerzy↗