Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “interconnections”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 595 records · Page 33

Piggy-back mounting would increase microcircuit packaging density

Piggy-back method of packaging integrated circuits will increase packaging density and design flexibility. It will also eliminate interconnection leads between the die and associated inductances, and thus increase the attainable frequency response of the circuit.

Gaudiano, S.↗

Journal gas bearing for curved surfaces

Optimizing bearing length and permissible axis curvature alleviates distortion of film gap of gas lubricated journal bearing in deployment mechanisms. Required bearing length is divided into two shorter bearings interconnected by links which allow satisfactory conformity with the bent, load-carrying member.

Redmon, J. W.↗

Modification to improve self-isolating transistor arrays

Fabrication process improves the size ratio and shape factor of the base region of self-isolating transistor arrays. Basic processing steps in the modified method include, sub-diffusion, epitaxial layer growth, isolation-diffusions, enhancement diffusions, aluminum interconnect deposition, and testing and packaging.

Farnsworth, D. L.↗

Digital frequency discriminator

Frequency discriminator has five integrated circuit chips interconnected to provide a divide function, exclusive OR function, phase shifting, and holding so that a single binary output signal results. The state of the binary signal indicates which one of the two input signals has a lower frequency than the other.

Reid, W. J.↗

Applications of gap welding

Gap welding of electronic interconnections yields high strength joints, is easy to use, and allows visual inspection of the welding process. It is easily adaptable to automated circuit assembly.

Adams, G. D.↗

Concept for a distributed processor computer

Future generation computer utilizes cell of single metal oxide semiconductor wafer containing general purpose processor section and small memory of approximately 512 words of 16 bits each. Cells are organized into groups and groups interconnected to form computer.

Bogue, P. N.↗