NASA NTRS · 19680000114
Piggy-back mounting would increase microcircuit packaging density
Abstract
Piggy-back method of packaging integrated circuits will increase packaging density and design flexibility. It will also eliminate interconnection leads between the die and associated inductances, and thus increase the attainable frequency response of the circuit.
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Gaudiano, S.. 1968-04-01. Piggy-back mounting would increase microcircuit packaging density. https://ntrs.nasa.gov/citations/19680000114
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