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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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A description of the deep-discharge event associated with UARS on-board batteries is given along with the immediate results of this event. The failures of 2nd UARS earth sensor in respect to battery currents, state-of-charge, battery temperatures, battery differential voltages and load bus voltage vs. time are graphically represented.
Since 1989 the US Army Construction Engineering Research Laboratories (USACERL) have been active participants in the research and development towards establishing Plasma Arc Technology (PAT) as an efficient, economical, and safe hazardous waste immobilization tool. A plasma torch capable of generating high temperatures makes this technology a viable and powerful tool for the thermal destruction of various military industrial waste streams into an innocuous ceramic material no longer requiring hazardous waste landfill disposal. The emerging plasma environmental thermal treatment process has been used to safely and efficiently meet the waste disposal needs for various demilitarized components disposal needs, such as: (1) pyrotechnic smoke assemblies, (2) thermal batteries, (3) proximity fuses, (4) cartridge actuated devices (CADs), and (5) propellant actuated devices (PADs). MSE Technology Applications, Inc., (MSE) has proposed and fabricated a Mobile Plasma Treatment System to be a technology demonstrator for pilotscale mobile plasma waste processing. The system is capable of providing small-scale waste remediation services, and conducting waste stream applicability demonstrations. The Mobile Plasma Treatment System's innovative concept provides the flexibility to treat waste streams at numerous sites and sites with only a limited quantity of waste, yet too hazardous to transport to a regional fixed facility. The system was designed to be operated as skid mounted modules; consisting of a furnace module, controls module, offgas module, and ancillary systems module. All system components have been integrated to be operated from a single control station with both semi-continuous feeding and batch slag-pouring capability.
Since 1989 the U.S. Army Construction Engineering Research Laboratories (USACERL) have been active participants in the research and development toward establishing Plasma Arc Technology (PAT) as an efficient, economical, and safe hazardous waste immobilization tool. A plasma torch capable of generating high temperatures makes this technology a viable and powerful tool for the thermal destruction of various military industrial waste streams into an innocuous ceramic material no longer requiring hazardous waste landfill (Class 1) disposal. The emerging pl asma environmental thermal treatment process, has been used to safely and efficiently meet the waste disposal needs for various demilitarized components disposal needs, such as: pyrotechnic smoke assemblies, thermal batteries, proximity fuses, cartridge actuated devices (CAD's), and propellant actuated devices (PAD's). MSE Technology Applications, Inc., (MSE) has proposed and fabricated a Mobile Plasma Treatment System to be a technology demonstrator for pilot-scale mobile plasma waste processing. The system is capable of providing small-scale waste remediation services, and conducting waste stream applicability demonstrations. The Mobile Plasma Treatment System's innovative concept provides the flexibility to treat waste streams at numerous sites and sites with only a limited quantity of waste, yet too hazardous to transport to a regional fixed facility. The system was designed to be operated as skid mounted modules; consisting of a furnace module, controls module, offgas module, and ancillary systems module. All system components have been integrated to be operated from a single control station with both semi-continuous feeding and batch slag-pouring capability.
The SAE G-11 RMSL Division and Probabilistic Methods Committee meeting during October 6-8 at the Best Western Sterling Inn, Sterling Heights (Detroit), Michigan is co-sponsored by US Army Tank-automotive & Armaments Command (TACOM). The meeting will provide an industry/government/academia forum to review RMSL technology; reliability and probabilistic technology; reliability-based design methods; software reliability; and maintainability standards. With over 100 members including members with national/international standing, the mission of the G-11's Probabilistic Methods Committee is to "enable/facilitate rapid deployment of probabilistic technology to enhance the competitiveness of our industries by better, faster, greener, smarter, affordable and reliable product development."
The intent of Bio-inspired Engineering of Exploration Systems (BEES) is to distill the principles found in successful, nature-tested mechanisms of specific crucial functions that are hard to accomplish by conventional methods, but accomplished rather deftly in nature by biological organisms.
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Both NASA and the U.S. Army have interest in developing secondary energy storage devices with improved low temperature performance to meet the demanding requirements of space missions and man-portable applications.
Both NASA and the U.S. Army have interest in developing secondary energy storage devices that are capable of meeting the demanding performance requirements of aerospace and man-portable applications. In order to meet these demanding requirements, gel-polymer electrolyte-based lithium-ion cells are being actively considered, due to their promise of providing high specific energy and enhanced safety aspects.
Original Equipment Manufacturers (OEMs), depots, and support contract ors have to be prepared to deal with an electronics supply chain that increasingly provides parts with lead-free finishes, some labeled no differently and intermingled with their SnPb counterparts. Allowance of lead-free components presents one of the greatest risks to the r eliability of military and aerospace electronics. The introduction of components with lead-free terminations, termination finishes, or cir cuit boards presents a host of concerns to customers, suppliers, and maintainers of aerospace and military electronic systems such as: 1. Electrical shorting due to tin whiskers 2. Incompatibility of lead-f ree processes and parameters (including higher melting points of lead -free alloys) with other materials in the system 3. Unknown material properties and incompatibilities that could reduce solder joint reli ability As the transition to lead-free becomes a certain reality for military and aerospace applications, it will be critical to fully un derstand the implications of reworking lead-free assemblies.
This slide presentation reviews the current state of the lead-free electronics project. It characterizes the test articles, which were built with lead-free solder and lead-free component finishes. The tests performed and reported on are: thermal cycling, combine environments testing, mechanical shock testing, vibration testing and drop testing.
Soft skills, also called "people skills," are typically hard to observe, quantify and measure. These skills have to do with how we relate to each other; communicating, listening, engaging in dialogue, giving feedback, cooperating as a team member, solving problems and resolving conflicts. Most of the soft skills training is scenario based, utilizing written or video-based scenarios. with limited or no branching, as well as quantitative feedback. This paper will outline a game-based approach to configurable, scenario-based, soft skills training. The paper will discuss the application of realistic visual behavior cues (e.g. body language, vocal inflection, facial expressions) and how these can benefit the learner. Using the concept of a "virtual vignette" this paper will discuss a prototype system intended to leach suicide prevention and provide qualitative feedback to the learner. The paper will also explore other soft skills training applications for this technology
The use of conventional tin-lead (SnPb) in circuit board manufacturing is under ever-increasing political scrutiny due to increasing regulations concerning lead. The "Restriction of Hazardous Substances" (RoHS) directive enacted by the European Union (EU) and a pact between the United States National Electronics Manufacturing Initiative (NEMI), Europe's Soldertec at Tin Technology Ltd. and the Japan Electronics and Information Technology Industries Association (JEITA) are just two examples where worldwide legislative actions and partnerships/agreements are affecting the electronics industry. As a result, many global commercial-grade electronic component suppliers are initiating efforts to transition to lead-free (Pb-free) in order to retain their worldwide market. Pb-free components are likely to find their way into the inventory of aerospace or military assembly processes under current government acquisition reform initiatives. Inventories "contaminated" by Pb-free will result in increased risks associated with the manufacturing, product reliability, and subsequent repair of aerospace and military electronic systems. Although electronics for military and aerospace applications are not included in the RoHS legislation, engineers are beginning to find that the commercial industry's move towards RoHS compliance has affected their supply chain and changed their parts. Most parts suppliers plan to phase out their non-compliant, leaded production and many have already done so. As a result, the ability to find leaded components is getting harder and harder. Some buyers are now attempting to acquire the remaining SnPb inventory, if it's not already obsolete. Original Equipment Manufacturers (OEMs), depots, and support contractors have to be prepared to deal with an electronics supply chain that increasingly provides more and more parts with Pb-free finishes-some labeled no differently than their Pb counterparts-while at the same time providing the traditional Pb parts. The longer the transition period, the greater the likelihood of Pb-free parts inadvertently being mixed with Pb parts and ending up on what are supposed to be Pb systems. As a result, OEMs, depots, and support contractors need to take action now to either abate the influx of Pb-free parts, or accept it and deal with the likely interim consequences of reduced reliability due to a wide variety of matters, such as Pb contamination, high temperature incompatibility, and tin whiskering. Allowance of Pb-free components produces one of the greatest risks to the reliability of a weapon system. This is due to new and poorly understood failure mechanisms, as well as unknown long-term reliability. If the decision is made to consciously allow Pb-free solder and component finishes into SnPb electronics, additional effort (and cost) will be required to make the significant number of changes to drawings and task order procedures. This project is a follow-on effort to the Joint Council on Aging Aircraft/Joint Group on Pollution Prevention (JCAA/JG-PP) Pb-free Solder Project which was the first group to test the reliability of Pb-free solder joints against the requirements of the aerospace and military community.
Original Equipment Manufacturers (OEMs). depots. and support contractors have to be prepared to deal with an electronics supply chain thaI increasingly provides parts with lead-free finishes. some labeled no differently and intenningled with their SnPb counterparts. Allowance oflead-free components presents one of the greatest risks to the reliability of military and aerospace electronics. The introduction of components with lead-free lenninations, tennination finishes, or circuit boards presents a host of concerns to customers. suppliers, and maintainers of aerospace and military electronic systems such as: 1. Electrical shorting due to tin whiskers; 2. Incompatibility oflead-free processes and parameters (including higher melting points of lead-free alloys) with other materials in the system; and 3. Unknown material properties and incompatibilities that could reduce solder joint re liability.
The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with lead-free alloys Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.
The primary'technical objective of this project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIPD assembled and reworked with lead-free alloys Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.