NASA NTRS · 20130012057
NASA DOD Lead Free Electronics Project
Abstract
The primary'technical objective of this project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: Packages (e.g., Thin Small Outline Package [TSOP], Ball Grid Array [BGA], Plastic Dual In-line Package [PDIPD assembled and reworked with lead-free alloys Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.
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Kessel, Kurt R.. 2008-03-17. NASA DOD Lead Free Electronics Project. https://ntrs.nasa.gov/citations/20130012057
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