NASA NTRS · 20130011655
NASA-DoD Lead-Free Electronics Project
Abstract
The primary technical objective of the project is to undertake comprehensive testing to generate information on failure modes/criteria to better understand the reliability of: Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with lead-free alloys Packages (e.g., TSOP, BGA, PDIP) assembled and reworked with mixed (lead/lead-free) alloys.
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Kessel, Kurt. 2007-06-13. NASA-DoD Lead-Free Electronics Project. https://ntrs.nasa.gov/citations/20130011655
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