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At least 55 records · Page 3

The Single Event Error (SEE) test and analysis of the CMS Endcap Timing Layer readout chip

The ETROC2, the first full size and full functionality prototype chip for the CMS Endcap Timing Layer readout, is strategically designed to meet the SEE immunity requirements of detector operation with the low power constraint. The triplicated periphery and pixel I2C configuration registers are designed with self-correction feature. The pixel readout control is centralized in the global readout and fully triplicated. The pixel readout is not triplicated, instead protected with power-efficient one-bit correction Hamming code. The TMR protection of the on-pixel threshold calibration can be turned off allowing the detection of the beam spot during the beam test by checking the bit-flips of the internal memory cells. In the initial proton beam test in January 2024, the chip readout process did not hang throughout the tests. The Hamming code correction strategy works because the error corrected TDC data were observed in the data frames. The error-injection simulation is performed to analy ze the small number of bit-flips in the configuration registers. We also performed SEE testing with a heavy ion beam in April and the data analysis is ongoing. The detailed design on the SEE immunity and the testing as well as simulation results will be presented, including follow-up SEE testing results in May and June 2024.

Gong, Datao

Shear Assisted Processing and Extrusion of Magnesium Alloy Machining Chips

The Pacific Northwest National Laboratory (PNNL) utilized Shear Assisted Processing and Extrusion (ShAPE) to convert magnesium alloy machining chips directly into wrought material. PNNL fabricated 0.25” and 0.50” round rod from cold compacted briquettes pressed from dry-machined chips by Loukus Technologies. The alloy composition is proprietary and protected by a Materials Transfer Agreement (MTA) between PNNL and Loukus. Extrusions were fabricated using the ShAPE 2.0 machine, tooling, and process. PNNL is evaluating tensile properties per ASTM E8 and microstructure for grain size, texture, and porosity using Scanning Electron Microscopy (SEM) and Electron Backscatter Diffraction (EBSD). Tensile properties and microstructure results were not available at the time of writing this document. Extruded rods have also been sent to Loukus for evaluation.

36 MATERIALS SCIENCE

Automated Detection of Qubit Structures on Quantum Chips

In this study, YOLO (You Only Look Once), a well-known object detection and image segmentation model, is used to detect qubits on a quantum chip. The model is trained by exposing it to various images of objects of interest and by setting various training parameters to allow the model to learn in unconventional conditions. We were able to provide the model with numerous images of qubits and various prominent features of note located on a qubit. We then created a simple GUI to display the model's live detections that would be integrated with the SEMs. This allowed us to create various functions such as auto-imagery of the qubits across a chip, auto-focusing, auto-contrasting, automatic staging, and directional corrections, enabling users to scan and analyze qubit surfaces in a fast and effective manner.

Perjuste, Ruth [Wellesley Coll.]

Improved method of dicing integrated circuit wafers into chips

Method employing a pressure chamber is used for dicing semiconductor single-crystal wafers, containing integrated circuits, into small chips along pre-scribed lines. Uniform bending of the scribed wafer over the convex surface of a perforated hemisphere, breaks it cleanly into individual chips without damaging the circuits.

Litant, I.

Development of chip passivated monolithic complementary MISFET circuits with beam leads

The results are presented of a program to demonstrate the processes for fabricating complementary MISFET beam-leaded circuits, which, potentially, are comparable in quality to available bipolar beam-lead chips that use silicon nitride passivation in conjunction with a platinum-titanium-gold metal system. Materials and techniques, different from the bipolar case, were used in order to be more compatible with the special requirements of fully passivated complementary MISFET devices. Two types of circuits were designed and fabricated, a D-flip-flop and a three-input NOR/NAND gate. Fifty beam-leaded chips of each type were constructed. A quality and reliability assurance program was performed to identify failure mechanisms. Sample tests and inspections (including destructive) were developed to measure the physical characteristics of the circuits.

Ragonese, L. J.

Laser scanner for testing semiconductor chips

Individual ''fingerprint'' signals are produced when system photoexcites chips. ''Fingerprints'' are analyzed for characteristics associated with defects, including many not visible to the naked eye. Electromagnetic radiation photogenerates free electrons and holes in semiconductor chip. These carriers produce electrical signals at terminals. Signals vary depending on what defects are present.

Hall, T. C.

Azimuth correlator design for IC chip

Azimuth correlator circuit synthetic-aperature radar (SAR) is designed for single integrated circuit (IC) chip. Azimuth correlator modules constructed with sets of such chips could make real-time signal processing possible. Primary advantages are realized in areas of weight and power requirement reductions.

Tyree, V. C.

Indium antimonide infrared CCD linear imaging arrays with on-chip preprocessing

A description is presented of the fabrication of a new InSb CCD chip based on an improved process which eliminates the limitations inherent with the earlier techniques. This process includes planar junction formation and an aluminum and SiO2 material system which is amenable to state-of-the-art chemical and plasma delineation techniques. Further, the new chip integrates for the first time in monolithic format InSb IR detectors with an InSb CCD. The reported experiments represent the first operation of an InSb infrared CCD array. In addition to fuller characterization of the 20-element charge-coupled infrared imaging device, several factors which influence device performance are currently being addressed. These include surface state density, the CCD output circuit, and storage time (dark current).

Thom, R. D.

Single-chip microcomputer application in high-altitude balloon orientation system

This paper describes the application of a single-chip microcomputer in a high-altitude balloon instrumentation system. The system, consisting of a magnetometer, a stepping motor, a microcomputer and a gray code shaft encoder, is used to provide an orientation reference to point a scientific instrument at an object in space. The single-chip microcomputer, Intel's 8748, consisting of a CPU, program memory, data memory and I/O ports, is used to control the orientation of the system.

Lim, T. S.

The VLSI design of a single chip Reed-Solomon encoder

A design for a single chip implementation of a Reed-Solomon encoder is presented. The architecture that leads to this single VLSI chip design makes use of a bit serial finite field multiplication algorithm.

Truong, T. K.

Programming substructure computations for elliptic problems on the CHiP system

A number of studies have been conducted with the aim to apply parallel computation to problems associated with solving finite element equations arising in structural mechanics and fluid dynamics. These studies have provided many important results. The present investigation is concerned with a set of experiments designed to test two ideas, including configurability and substructuring. The considered algorithms and tests are intended for implementation on the Configurable, Highly Parallel (CHiP) family of architecture described by Snyder (1982). The ChiP computer is composed of homogeneous processing elements (PEs) placed at regular intervals in a lattice of programmable switches. Two examples of the role of configurability and substructuring for simple iterative algorithms are considered, giving attention to conjugate gradient iterations, and tridiagonal systems of equations.

Gannon, D.

Designing Test Chips for Custom Integrated Circuits

Collection of design and testing procedures partly automates development of built-in test chips for CMOS integrated circuits. Testchip methodology intended especially for users of custom integratedcircuit wafers. Test-Chip Designs and Testing Procedures (including datareduction procedures) generated automatically by computer from programed design and testing rules and from information supplied by user.

Buehler, M. G.

High-voltage solar-cell chip

Integrated circuit technology has been successfully applied to the design and fabrication of 0.5 x 0.5-cm planar multijunction solar-cell chips. Each of these solar cells consisted of six voltage-generating unit cells monolithically connected in series and fabricated on a 75-micron-thick, p-type, single crystal, silicon substrate. A contact photolithic process employing five photomask levels together with a standard microelectronics batch-processing technique were used to construct the solar-cell chip. The open-circuit voltage increased rapidly with increasing illumination up to 5 AM1 suns where it began to saturate at the sum of the individual unit-cell voltages at a maximum of 3.0 V. A short-circuit current density per unit cell of 240 mA/sq cm was observed at 10 AM1 suns.

Kapoor, V. J.

A VLSI single chip (255,223) Reed-Solomon encoder

A description of a working single chip implementation of a Reed-Solomon encoder. The code used is the Consultative Committee on Space Data Systems (CCSDS) standard (255,223) code. The architecture that leads to this single very large scale integration chip design makes use of a bit-serial finite field multiplication algorithm of E. R. Berlekamp.

Deutsch, L. J.

Test chip assembler and test program generator

One of the major problems in working at the geometry level for the generation of either test structure or functional circuit designs is the amount of labor involved in the design phase. To reduce the amount of labor involved in both the design and test of the structures used, JPL has developed a design and test program consisting of a Test Chip Assembler (TCA) and a Test Program Generator (TPG), which creates the geometrical description of the structures and generates the necessary test information using a high-level language. This system reduces the design time for a test chip by a factor of 30. To analyze the data obtained from wafer probing, a statistical package called STMJPL was developed. Some of the capabilities of the JPL software (STMJPL) are described.

Pina, C. A.

A VLSI single chip (255,223) Reed-Solomon encoder with interleaver

A single-chip implementation of a Reed-Solomon encoder with interleaving capability is described. The code used was adapted by the CCSDS (Consulative Committee on Space Data Systems). It forms the outer code of the NASA standard concatenated coding system which includes a convolutional inner code of rate 1/2 and constraint length 7. The architecture, leading to this single VLSI chip design, makes use of a bit-serial finite field multiplication algorithm due to E.R. Berlekamp.

Hsu, I. S.

The design plan of a VLSI single chip (255, 223) Reed-Solomon decoder

The very large-scale integration (VLSI) architecture of a single chip (255, 223) Reed-Solomon decoder for decoding both errors and erasures is described. A decoding failure detection capability is also included in this system so that the decoder will recognize a failure to decode instead of introducing additional errors. This could happen whenever the received word contains too many errors and erasures for the code to correct. The number of transistors needed to implement this decoder is estimated at about 75,000 if the delay for received message is not included. This is in contrast to the older transform decoding algorithm which needs about 100,000 transistors. However, the transform decoder is simpler in architecture than the time decoder. It is therefore possible to implement a single chip (255, 223) Reed-Solomon decoder with today's VLSI technology. An implementation strategy for the decoder system is presented. This represents the first step in a plan to take advantage of advanced coding techniques to realize a 2.0 dB coding gain for future space missions.

Hsu, I. S.