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At least 433 records · Page 24
All sourcesNASA NTRSDOE OSTI
NASA NTRS1980

Mechanisms of lubrication and wear of a bonded solid-lubricant film

The tribological properties of polyimide-bonded graphite fluoride films were investigated. A pin-on-disk type of testing apparatus was used; in addition to sliding a hemispherically tipped rider, a rider with a 0.95-mm-diameter flat area was slid against the film so that a lower, less variable contact stress could be achieved. Two stages of lubrication occurred: in the first, the film supported the load and the lubricating mechanism consisted of the shear of a thin surface layer between the rider and the bulk of the film. The second occurred after the bonded film had worn to the substrate, and consisted of the shear of very thin lubricant films between the rider and flat plateaus generated on the metallic substrate asperities. The film wear mechanism was strongly dependent on contact stress.

Fusaro, R. L.↗
NASA NTRS1980

Stresses in adhesively bonded joints: A closed form solution

The plane strain of adhesively bonded structures which consist of two different orthotropic adherents is considered. Assuming that the thicknesses of the adherends are constant and are small in relation to the lateral dimensions of the bonded region, the adherends are treated as plates. The transverse shear effects in the adherends and the in-plane normal strain in the adhesive are taken into account. The problem is reduced to a system of differential equations for the adhesive stresses which is solved in closed form. A single lap joint and a stiffened plate under various loading conditions are considered as examples. To verify the basic trend of the solutions obtained from the plate theory a sample problem is solved by using the finite element method and by treating the adherends and the adhesive as elastic continua. The plate theory not only predicts the correct trend for the adhesive stresses but also gives rather surprisingly accurate results.

Delale, F.↗
NASA NTRS1981

Electrostatic bonding of thin (cycle sine 3 mil) 7070 cover glass to Ta2O5 AR-coated thin (cycle sine 2 mil) silicon wafers and solar cells

Electrostatic bonding of thin cover glass to thin solar cells was researched. Silicon solar cells, wafers, and Corning 7070 glass of from about 0.002" to about 0.003" in thickness were used in the investigation to establish optimum parameters for producing mechanically acceptable bonds while minimizing thermal stresses and resultant solar cell electrical parameter degradation.

Egelkrout, D. W.↗
NASA NTRS1980

Electrostatic bonding of thin (approximately 3 mil) 7070 cover glass to Ta2O5 AR-coated thin (approximately 2 mil) silicon wafers and solar cells

Electrostatic bonding (ESB) of thin (3 mil) Corning 7070 cover glasses to Ta2O5 AR-coated thin (2 mil) silicon wafers and solar cells is investigated. An experimental program was conducted to establish the effects of variations in pressure, voltage, temperature, time, Ta2O5 thickness, and various prebond glass treatments. Flat wafers without contact grids were used to study the basic effects for bonding to semiconductor surfaces typical of solar cells. Solar cells with three different grid patterns were used to determine additional requirements caused by the raised metallic contacts.

Egelkrout, D. W.↗
NASA NTRS1980

Increased fracture toughness of graphite-epoxy composites through intermittent interlaminar bonding

The objective of this study was to increase the fracture toughness of multilayer continuous-filament graphite-epoxy composites. The method used is intermittent interlaminar bonding which can lead to a large increase in the fracture surface area. Intermittent bonding was achieved through introduction of thin perforated Mylar between the layers of the composite. For the optimum condition, fracture toughness was increased from about 100 kJ/sq m for untreated specimens to an average of about 500 kJ/sq m, while tensile strength dropped from 500 MPa to 400 MPa, and elastic modulus remained the same at about 75 GPa. An approximate analysis is presented to explain the improvement in toughness.

Jea, L.-C.↗
NASA NTRS1981

Viscoelastic analysis of adhesively bonded joints

In this paper an adhesively bonded lap joint is analyzed by assuming that the adherends are elastic and the adhesive is linearly viscoelastic. After formulating the general problem a specific example for two identical adherends bonded through a three parameter viscoelastic solid adhesive is considered. The standard Laplace transform technique is used to solve the problem. The stress distribution in the adhesive layer is calculated for three different external loads namely, membrane loading, bending, and transverse shear loading. The results indicate that the peak value of the normal stress in the adhesive is not only consistently higher than the corresponding shear stress but also decays slower.

Delale, F.↗
NASA NTRS1981

Stresses in adhesively bonded joints - A closed-form solution

The general plane strain problem of adhesively bonded structures consisting of two different, orthotropic adherends is considered, under the assumption that adherend thicknesses are constant and small in relation to the lateral dimensions of the bonded region, so that they may be treated as plates. The problem is reduced to a system of differential equations for the adhesive stresses which is solved in closed form, with a single lap joint and a stiffened plate under various loading conditions being considered as examples. It is found that the plate theory used in the analysis not only predicts the correct trend for adhesive stresses but gives surprisingly accurate results, the solution being obtained by assuming linear stress-strain relations for the adhesive.

Delale, F.↗
NASA NTRS1983

Tool Severs Hidden Adhesive Bonds

New tool enters narrow gap between fragile materials and removes adhesively bonded filler without damage to adjacent surfaces. Reaches deep into narrow crevices to reach hidden bond lines. Tool originally developed to remove ceramic filler from between Space Shuttle surface-insulation tiles.

Keir, A. R.↗
NASA NTRS1982

Metal honeycomb to porous wireform substrate diffusion bond evaluation

Two nondestructive techniques were used to evaluate diffusion bond quality between a metal foil honeycomb and porous wireform substrate. The two techniques, cryographics and acousto-ultrasonics, are complementary in revealing variations of bond integrity and quality in shroud segments from an experimental aircraft turbine engine.

Vary, A.↗
NASA NTRS1982

Chemical bonding and charge redistribution - Valence band and core level correlations for the Ni/Si, Pd/Si, and Pt/Si systems

Via a systematic study of the correlation between the core and valence level X-ray photoemission spectra, the nature of the chemical bonding and charge redistribution for bulk transition metal silicides has been examined. Particular emphasis is placed on Pt2Si and PtSi. It is observed that the strength of the metal (d)-silicon (p) interaction increases in the order Ni2Si, Pd2Si, Pt2Si. It is also observed that both the metal and silicon core lines shift to higher binding energy as the silicides are formed. The notion of charge redistribution for metallic bonds is invoked to explain these data.

Grunthaner, P. J.↗
NASA NTRS1982

Bonding procedure for Teflon seals

Material and bonding procedures designed for use as seals at the National Transonic Facility at the NASA Langley Research Center are presented. Teflon TFE was chosen for its ability to withstand pressures of up to 130 psi and temperatures ranging from -320 to 150 F, in addition to tolerances of 0.074 in. and having a movement allowance of 0.75 in. during transient cycles. Since some of the seals are 14 in. in diameter, Teflon sheets had to be sliced and bonded together after machining to size, resulting in seals with circular, oval, straight, and rectangular cross sections. Step-by-step preparation procedures are provided, and it is noted that the scarf joints performed as predicted during tests.

Barringer, S. R.↗
NASA NTRS1984

Radiation Improves Materials Bonding

Bonds with fluorocarbons made with surface preparation. Irradiating rubber-based adhesives produce strong adhesive bond with fluorocarbons without extensive surface preparation.

Bouquet, F. L.↗
NASA NTRS1982

A critical study of the role of the surface oxide layer in titanium bonding

The molecular understanding of the role which the surface oxide layer of the adherend plays in titanium bonding is studied. The effects of Ti6-4 adherends pretreatment, bonding conditions, and thermal aging of the lap shear specimens were studied. The use of the SEM/EDAX and ESCA techniques to study surface morphology and surface composition was emphasized. In addition, contact angles and both infrared and visible reflection spectroscopy were used in ancillary studies.

Dias, S.↗
NASA NTRS1983

Viscoelastic study of an adhesively bonded joint

The plane strain problem of two dissimilar orthotropic plates bonded with an isotropic, linearly viscoelastic adhesive is considered. Both the shear and the normal stresses in the adhesive are calculated for various geometries and loading conditions. Transverse shear deformations of the adherends are taken into account, and their effect on the solution is shown in the results. All three inplane strains of the adhesive are included. Attention is given to the effect of temperature, both in the adhesive joint problem and to the heat generation in a viscoelastic material under cyclic loading. This separate study is included because heat generation and or spatially varying temperature are at present too difficult to account for in the analytical solution of the bonded joint, but whose effect can not be ignored in design.

Joseph, P. F.↗
NASA NTRS1983

Design and fabrication of realistic adhesively bonded joints

Eighteen bonded joint test specimens representing three different designs of a composite wing chordwise bonded splice were designed and fabricated using current aircraft industry practices. Three types of joints (full wing laminate penetration, two side stepped; midthickness penetration, one side stepped; and partial penetration, scarfed) were analyzed using state of the art elastic joint analysis modified for plastic behavior of the adhesive. The static tensile fail load at room temperature was predicted to be: (1) 1026 kN/m (5860 1b/in) for the two side stepped joint; (2) 925 kN/m (5287 1b/in) for the one side stepped joint; and (3) 1330 kN/m (7600 1b/in) for the scarfed joint. All joints were designed to fail in the adhesive.

Shyprykevich, P.↗
NASA NTRS1983

Surface analysis in composite bonding

X ray photoelectron spectroscopy and contact angle measurements on graphite fiber composites pretreated in a number of different ways including mechanical, chemical, and light irradiation were analyzed. Data acquired on surface contamination as a result of fabrication techniques provides answers to the strength and durability of adhesively bonded composites. These techniques were shown to provide valuable information on surface analysis of pretreated composites prior to adhesive bonding and following lap shear fracture.

Messick, D. L.↗
NASA NTRS1983

A fracture mechanics approach for designing adhesively bonded joints

An analytical and experimental investigation was undertaken to determine if the adhesive debond initiation stress could be predicted for arbitrary joint geometries. The analysis was based upon a threshold total strain-energy-release rate (Gth) concept. Two bonded systems were tested: T300/5208 graphite/epoxy adherends bonded with either EC-3445 or FM-300 adhesive. The Gth for each adhesive was determined from cracked-lap-shear (CLS) specimens by initiation tests. Finite-element analyses of various tapered CLS specimen geometries predicted the specimen stress at which the total strain-energy-release rate (GT) equaled Gth at the joint tip. Experiments verified the predictions. The approach described herein predicts the maximum stress at which an adhesive joint can be cycled yet not debond. Furthermore, total strain-energy-release rate appeared to be the driving parameter for cyclic debonding and debond initiation in structural adhesives. In addition, debond initiation and growth were found to occur with virtually no peel stress present.

Johnson, W. S.↗
NASA NTRS1983

Metal honeycomb to porous wireform substrate diffusion bond evaluation

Two nondestructive techniques were used to evaluate diffusion bond quality between a metal fail honeycomb and porous wireform substrate. The two techniques, cryographics and acousto-ultrasonics, are complementary in revealing variations of bond integrity and quality in shroud segments from an experimental aircraft turbine engine. Previously announced in STAR as N82-18612

Vary, A.↗