NASA NTRS · 19820000322
Tool Severs Hidden Adhesive Bonds
Abstract
New tool enters narrow gap between fragile materials and removes adhesively bonded filler without damage to adjacent surfaces. Reaches deep into narrow crevices to reach hidden bond lines. Tool originally developed to remove ceramic filler from between Space Shuttle surface-insulation tiles.
Keep this discovery
Explore connections, maps & timelines
Keir, A. R., Dominguez, X. A.. 1983-05-01. Tool Severs Hidden Adhesive Bonds. https://ntrs.nasa.gov/citations/19820000322
Cite the original work for its findings. Save a collection to share your selection of sources.