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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 379 records · Page 21
All sourcesNASA NTRSDOE OSTI
NASA NTRS1982

Application of In Situ Fiberization for fabrication of improved strain isolation pads and graphite epoxy composites

The feasibility of applying the in situ fiberization process to the fabrication of strain isolation pads (SIP) for the Space Shuttle and to the fabrication of graphite-epoxy composites was evaluated. The ISF process involves the formation of interconnected polymer fiber networks by agitation of dilute polymer solutions under controlled conditions. High temperature polymers suitable for SIP use were fiberized and a successful fiberization of polychloro trifluoroethylene, a relatively high melting polymer, was achieved. Attempts to fiberize polymers with greater thermal stability were unsuccessful, apparently due to characteristics caused by the presence of aromaticity in the backbone of such materials. Graphite-epoxy composites were fabricated by interconnecting two dimensional arrays of graphite fiber with polypropylene IS fibers with subsequent epoxy resin impregnation. Mechanical property tests were performed on laminated panels of this material to evaluate intralaminar and interlaminar shear strength, and thus fracture toughness. Test results were generally unpromising.

Rosser, R. W.↗
NASA NTRS1981

Low cost, high concentration ratio solar cell array for space applications

A miniaturized Cassegrainian-type concentrator solar array concept for space applications is described. In-orbit cell operating temperatures near 80 C are achieved with purely passive cell cooling and a net concentration ratio of 100. A multiplicity of miniaturized, rigid solar cell concentrator subassemblies are electrically interconnected in conventional fashion and mounted into rigid frames to form concentrator solar panel assemblies approximately 14-mm thick. A plurality of such interconnected panels forms a stowable and deployable solar cell blanket. It is projected that for 20% efficient silicon cells an array of 500 kW beginning-of-life output capability, including orbiter cradle structures, can be transported by a single shuttle orbiter flight into low earth orbit. In-orbit array specific performance is calculated to be approximately 100 W/sq m and 20 W/kg, including all stowage, deployment and array figure control equipment designed for a 30-year orbital life. Higher efficiency gallium arsenide and multiple band gap solar cells will improve these performance factors correspondingly.

Patterson, R. E.↗
NASA NTRS1982

Architecture for VLSI design of Reed-Solomon encoders

A description is given of the logic structure of the universal VLSI symbol-slice Reed-Solomon (RS) encoder chip, from a group of which an RS encoder may be constructed through cascading and proper interconnection. As a design example, it is shown that an RS encoder presently requiring approximately 40 discrete CMOS ICs may be replaced by an RS encoder consisting of four identical, interconnected VLSI RS encoder chips, offering in addition to greater compactness both a lower power requirement and greater reliability.

Liu, K. Y.↗
NASA NTRS1982

Oxidation stability of advanced reaction-bonded Si3N4 materials

Four slip-cast, injection-molded and isostatically-pressed specimens of reaction-bonded silicon nitride (RBSN) were subjected to static oxidation tests at 900 C for 10 hours. Specimens containing 8-10% interconnected open porosity of size greater than one micron exhibited a 20-30% decrease in average room temperature four-point flexure strength, while those with 10% open porosity of magnitudes much smaller than one micron as well as those with 2-4% interconnected open porosity of about one micron did not decrease in strength after 900 C exposure. It was determined that preoxidation treatment at 1350 C prevents the 20-30% strength degradation due to internal oxidation, and evidence is presented which suggests that surface pit formation in some RBSN may result from contamination by the furnace environment rather than any intrinsic material properties.

Lindberg, L. J.↗
NASA NTRS1982

Photovoltaic array reliability optimization

An overview of the photovoltaic array reliability problem is presented, and a high reliability/minimum cost approach to this problem is presented. Design areas covered are cell failure, interconnect fatigue, and electrical insulation breakdown, and three solution strategies are discussed. The first involves controlling component failures in the solar cell (cell cracking, cell interconnects) and at the module level (must be statistically treated). Second, a fault tolerant circuit is designed which reduces array degradation, improves module yield losses, and controls hot-spot heating. Third, cost optimum module replacement strategies are also effective in reducing array degradation. This can be achieved by minimizing the life-cycle energy cost of the photovoltaic system. The integration of these solutions is aimed at reducing the 0.01% failure rate.

Ross, R. G., Jr.↗
NASA NTRS1984

Processes for VLSI Circuits

Four-volume document reviews key technologies for interconnecting in very-large-scale integrated (VLSI) circuits. Document also discusses current and proposed research into novel fabrication techniques for interconnections.

Wade, T. E.↗
NASA NTRS1982

Blanket technology

It was concluded that systems requirements would force a reassessment of the conventional approach to interconnecting cells into blanket or array modules. Defense applications (hardening) were identified as the key requirement that would force a movement away from the standard method (solder) of forming array circuits. The panel also agreed that requirements associated with the impending NASA Space Station and in-bound missions would lead to alternative interconnecting approaches. It was concluded that the diverse requirements of future space missions (high temperature and extended thermal cycling) might not be met by one approach, such as parallel-gap resistance welding. The panel suggested that other options such as high temperature solders and brazing be considered for the various mission requirements that were anticipated. The panel agreed that blanket technology was potentially suitable for in-orbit annealing to temperatures of 200 C provided that conventional soldered connecting techniques were replaced by "welding".

Scott-Monck, J.↗
NASA NTRS1983

Reaction of cobalt in SO2 atmospheric at elevated temperatures

The reaction rate of cobalt in SO2 argon environments was measured at 650 C, 700 C, 750 C and 800 C. Product scales consist primarily of an interconnected sulfide phase in an oxide matrix. At 700 C to 800 C a thin sulfide layer adjacent to the metal is also observed. At all temperatures, the rapid diffusion of cobalt outward through the interconnected sulfide appears to be important. At 650 C, the reaction rate slows dramatically after five minutes due to a change in the distribution of these sulfides. At 700 C and 750 C the reaction is primarily diffusion controlled values of diffusivity of cobalt (CoS) calculated from this work show favorable agreement with values of diffusivity of cobalt (CoS) calculated from previous sulfidation work. At 800 C, a surface step becomes rate limiting.

Jacobson, N. S.↗
NASA NTRS1982

U.S. welding technology - Constraints to space implementation

U.S. and European efforts to develop welding techniques for satellite solar arrays are described. Soldering practices in the U.S. have benefitted from Mo solders, which are well fitted to Si solar cell material thermal characteristics. Analyses have indicated that welds are the preferred method for interconnections and bonds. Extensive work has been done with the parallel gap resistance method (RW), which involves process heat generated by passing a current through resistive layers. Confining the primary heat input to the interconnector/cell contact interface results in welds being formed beneath both electrodes. Pulse welding has become the dominant RW technique in Europe, while ultrasonic welding is used in the U.S.; silver is employed as the interconnect material on both continents. The bonding techniques have been developed empirically instead of theoretically. An IR inspection technique has been produced for monitoring the weld temperature.

Stella, P. M.↗
NASA NTRS1984

Space station architecture, module, berthing hub, shell assembly, berthing mechanism and utility connection channel

The geometric form of a space station is presented that includes a description of a plurality of modules and berthing hubs, joined by interconnections which are sideways connectable. The modules and hubs are fastened together in a triangular configuration in three dimensions. The interconnections include a pair of opposed, axially aligned, flanged ports and a clamp latch formed from a plurality of sections hinged along their length and extending circumferentially around the flanged ports. A hermetic seal is formed between the ports. A utilities connection channel extends between the ports. The channel has a shell with utilities connectors movable between an extended position to mating connectors in the modules and a withdrawn position. Assembly sequence and common module shell structure is detailed.

Cohen, M. M.↗
NASA NTRS1981

Development of low cost custom hybrid microcircuit technology

Selected potentially low cost, alternate packaging and interconnection techniques were developed and implemented in the manufacture of specific NASA/MSFC hardware, and the actual cost savings achieved by their use. The hardware chosen as the test bed for this evaluation ws the hybrids and modules manufactured by Rockwell International fo the MSFC Flight Accelerometer Safety Cut-Off System (FASCOS). Three potentially low cost packaging and interconnection alternates were selected for evaluation. This study was performed in three phases: hardware fabrication and testing, cost comparison, and reliability evaluation.

Perkins, K. L.↗
NASA NTRS1982

High density circuit technology, part 1

The metal (or dielectric) lift-off processes used in the semiconductor industry to fabricate high density very large scale integration (VLSI) systems were reviewed. The lift-off process consists of depositing the light-sensitive material onto the wafer and patterning first in such a manner as to form a stencil for the interconnection material. Then the interconnection layer is deposited and unwanted areas are lifted off by removing the underlying stencil. Several of these lift-off techniques were examined experimentally. The use of an auxiliary layer of polyimide to form a lift-off stencil offers considerable promise.

Wade, T. E.↗
NASA NTRS1984

Aeroelastic effects in multi-rotor vehicles with application to a hybrid heavy lift system. Part 1: Formulation of equations of motion

This report presents a set of governing coupled differential equations for a model of a hybrid aircraft. The model consists of multiple rotor systems connected by an elastic interconnecting structure, with options to add any combination of or all of the following components; i.e., thrusters, a buoyant hull, and an underslung weight. The dynamic equations are written for the individual blade with hub motions, for the rigid body motions of the whole model, and also for the flexible modes of the interconnecting structure. One of the purposes of this study is to serve as the basis of a numerical study aimed at determining the aeroelastic stability and structural response characteristics of a Hybrid Heavy Lift Airship (HHLA). It is also expected that the formulation may be applicable to analyzing stability and responses of dual rotor helicopters such as a Heavy Lift Helicopter (HLH). Futhermore, the model is capable of representing coupled rotor/body aeromechanical problems of single rotor helicopters.

Venkatesan, C.↗
NASA NTRS1983

Evolution of integrated panel structural design and interfaces for PV power plants

The evolution of integrated photovoltaic (PV) panel design at ARCO Solar is discussed. Historically, framed PV modules of about 1 x 4-ft size were individually mounted in the field on fixed support structures and interconnected electrically with cables to build higher-power arrays. When ARCO Solar saw the opportunity in 1982 to marry its PV modules with state-of-the-art heliostat trackers developed by ARCO Power Systems, it became obvious that mounting individual modules was impractical. For this project, the framed modules were factory-assembled into panels and interconnected with cables before being mounted on the trackers. Since then, ARCO Solar made considerable progress and gained substantial experience in the design and fabrication of large PV panels. Constraints and criteria considered in these design activities included static and dynamic loads; assembly and transportation equipment and logistics, structural and electrical interfaces, and safety and grounding concerns.

Arnett, J. C.↗
NASA NTRS1983

A basic design fault in ceramic flat packs

Recent moisture resistance tests of various multilayer top brazed ceramic flat packs and leaded and unleaded chip carriers has revealed a serious design defect. These packages, which utilize a tungsten interconnect system, in the presence of high humidity, suffer a galvanic corrosion which anodically consumes the tungsten. This process can continue until the package suffers an open circuit. The test results indicate that the lead plating system does not adequately seal off the interface area where the tungsten stripe egresses from the inside of the package. Leaded and leadless chip carrier packages were also subjected to the moisture resistance test. The familiar red and green corrosion products were visible after the test was completed. Careful sectioning of the chip carriers has revealed that the tungsten interconnect stripe instead of exiting under the castellations, exits at the top of the castellation and is thus vulnerable to the attack of moisture. These basic design faults severely impact the reliability of these packages.

Drotman, B.↗
NASA NTRS1984

Reaction of cobalt in SO2 atmospheres at elevated temperatures

The reaction rate of cobalt in SO2 argon environments was measured at 650 C, 700 C, 750 C and 800 C. Product scales consist primarily of an interconnected sulfide phase in an oxide matrix. At 700 C to 800 C, a thin sulfide layer adjacent to the metal is also observed. At all temperatures, the rapid diffusion of cobalt outward through the interconnected sulfide appears to be important. At 650 C, the reaction rate slows dramatically after five minutes due to a change in the distribution of these sulfides. At 700 C and 750 C, the reaction is primarily diffusion controlled; values of diffusivity of cobalt (CoS) calculated from this work show favorable agreement with values of diffusivity of cobalt (CoS) calculated from previous sulfidation work. At 800 C, a surface step becomes rate limiting. Previously announced in STAR as N83-35104

Jacobson, N. S.↗
NASA NTRS1984

The reactions of cobalt, iron and nickel in SO-2 atmospheres: Similarities and differences

The reactions of cobalt, iron and nickel in SO2 atmospheres are reviewed and compared. A mixed oxide-sulfide product layer is observed in all cases. Cobalt and nickel exhibits similar behavior. The observed rates are near the sulfidation rates, and the reaction rate is strongly influenced by the outward diffusion of metal through an interconnected sulfide network. A continuous interconnected sulfide is not observed in the oxide-sulfide scales formed on iron, and the reaction rates are more difficult to summarize. The differences and similarities among the three metals are explained in terms of the absence of scale-gas equilibrium and the ratio of the metal diffusivity in the corresponding oxide and sulfide.

Jacobson, N. S.↗
NASA NTRS1984

Studies on the hot corrosion of a nickel-base superalloy, Udimet 700

The hot corrosion of a nickel-base superalloy, Udimet 700, was studied in the temperature range of 884 to 965 C and with different amounts of Na2SO4. Two different modes of degradation were identified: (1) formation of Na2MoO4 - MoO3 melt and fluxing by this melt, and (2) formation of large interconnected sulfides. The dissolution of Cr2O3, TiO2 in the Na2SO4 melt does not play a significant role in the overall corrosion process. The conditions for the formation of massive interconnected sulfides were identified and a mechanism of degradation due to sulfide formation is described. The formation of Ns2MoO4 - MoO3 melt requires an induction period and various physiochemical processes during the induction period were identified. The factors affecting the length of the induction period were also examined. The melt penetration through the oxide appears to be the prime mode of degradation whether the degradation is due to the formation of sulfides or the formation of the Na2MoO4 - MoO3 melt.

Misra, A. K.↗