Blanket technology

Abstract

It was concluded that systems requirements would force a reassessment of the conventional approach to interconnecting cells into blanket or array modules. Defense applications (hardening) were identified as the key requirement that would force a movement away from the standard method (solder) of forming array circuits. The panel also agreed that requirements associated with the impending NASA Space Station and in-bound missions would lead to alternative interconnecting approaches. It was concluded that the diverse requirements of future space missions (high temperature and extended thermal cycling) might not be met by one approach, such as parallel-gap resistance welding. The panel suggested that other options such as high temperature solders and brazing be considered for the various mission requirements that were anticipated. The panel agreed that blanket technology was potentially suitable for in-orbit annealing to temperatures of 200 C provided that conventional soldered connecting techniques were replaced by "welding".