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At least 37 records · Page 2

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NASA NTRS1972

Energy pulse bonding

To eliminate many of the present termination problems a technique called energy pulse bonding (EPB) was developed. The process demonstrated the capability of: (1) joining conductors without prior removal of insulations, (2) joining conductors without danger of brittle intermetallics, (3) increased joint temperature capability, (4) simultaneous formation of several bonds, (5) capability of higher joint density, and (6) a production oriented process. The following metals were successfully bonded in the solid state: copper, beryllium copper, phosphor bronze, aluminum, brass, and Kovar.

Smith, G. C.↗

NASA NTRS1973

Application of diffusion bonding to electronic interconnection of flatpack leads

Diffusion-bonded joints between gold-plated Kovar leads and indium-plated copper circuit pads offer some advantages for electronic circuit packaging. Test results show that consistent high strength bonds stronger than the copper circuit foil are achieved by parallel-gap bonding at relatively low power settings. The bonds are basically formed by the alloying of the gold, indium and copper at the bond interface. Other low melting metals such as tin can also be used; however, tin does not offer the ease of bonding that results in consistent separation of the copper foil during pull testing. The investigation was conducted in three parts consisting of: (1) an evaluation of the physical strength of resulting bonds at ambient and elevated temperature, (2) a metallurgical analysis of bonds using scanning electron microscopy and nondispersive X-ray analysis, and (3) evaluation and development of various schemes for multiple lead flatpack bonding.

Korb, R. W.↗

NASA NTRS1972

Indium sealing techniques.

Gold films are used as an alloying flux to form 5-micron-thick indium film seals at temperatures below 300 C. Pyrex was sealed to quartz, ULE, CER-VIT, Irtran 2, Ge, GaAs, Invar, Kovar, Al, and Cu. The seals can also be used as current feedthroughs and graded seals.

Hochuli, U.↗

NASA NTRS1975

Thermoelastic analysis of solar cell arrays and their material properties

Announced report discusses experimental test program in which five different solar cell array designs were evaluated by subjecting them to 60 thermal cycles from minus 190 deg to 0.0 deg. Results indicate that solder-coated cells combined with Kovar n-interconnectors and p-interconnectors are more durable under thermal loading than other configurations.

Salama, M. A.↗

NASA NTRS1974

Properties criteria for components and materials used in lightweight solar arrays

The present work describes the characteristics and design criteria for components and materials used in lightweight substrate solar arrays. This includes descriptions of wraparound-electrode solar cells, cell covers, and cell interconnects. Cell cover systems briefly discussed are fused silica, cerium stabilized glass, microsheet, FEP (tape, heat laminated, and spray on), and ESB 7070 glass integral covers. The majority of solar arrays orbited have used either silver, Kovar, copper, or molybdenum as interconnect metals. Data are presented comparing the Young's modulus E, ultimate tensile strength, coefficient of expansion, thermal conductivity, and percent elongation of these and other interconnect candidate materials. Guidelines for the use of end tab wraparound cells are listed.

Lott, D. R.↗

NASA NTRS1974

Solar cell welded interconnection development program

Parallel gap welding and ultrasonic bonding techniques were developed for joining selected interconnect materials (silver, aluminum, copper, silver plated molybdenum and Kovar) to silver-titanium and aluminum contact cells. All process variables have been evaluated leading to establishment of optimum solar cell, interconnect, electrodes and equipment criteria for obtainment of consistent high quality welds. Applicability of nondestructive testing of solar cell welds has been studied. A pre-weld monitoring system is being built and will be utilized in the numerically controlled parallel gap weld station.

Katzeff, J. S.↗

NASA NTRS1976

Solar cell electrical connections

Study was conducted to find best methods of attaching pure silver and silver plated Kovar (trademark) interconnect ribbons to silicon solar cells with titanium-silver solderless contacts. Investigations include thermocompression bonding, parallel-gap welding, and ultrasonic welding.

Rauschenbach, H. S.↗

NASA NTRS1976

A parylene coating process for hybrid circuits

The parylene coating process developed during this program consists of (1) obtaining a hybrid cover with a hole in it, (2) sealing of the circuit with a hole in the cover, (3) parylene coating through the hole with the external leads protected from parylene by appropriate fixturing, and (4) sealing of the hole by soldering a pretinned kovar tab. Development of the above process required optimization of the parylene coater parameters to obtain a uniform consistent coating which could offer adequate protection to the circuits, fixture design for packages of various types, determination of the size of the deposition hole, and the amount of dimer charge per run, a process to hermetically seal the deposition holes and establishment of quality control techniques or acceptance criteria for the deposited film.

Source record↗

NASA NTRS1976

Device/packaging reliability problems of solid-state devices for space applications

This paper presents data that has been generated within NASA, especially the Marshall Space Flight Center, concerning several failure mechanisms that have occurred with microelectronic packages. The types of packages that will be discussed are primarily flat packs with 14-24 exit leads that are composed of Kovar electro-deposited nickel and finally gold plated.

Villella, F.↗

NASA NTRS1977

Investigation of package sealing using organic adhesives

A systematic study was performed to evaluate the suitability of adhesives for sealing hybrid packages. Selected adhesives were screened on the basis of their ability to seal gold-plated Kovar butterfly-type packages that retain their seal integrity after individual exposures to increasingly severe temperature-humidity environments. Tests were also run using thermal shock, temperature cycling, mechanical shock and temperature aging. The four best adhesives were determined and further tested in a 60 C/98% RH environment and continuously monitored in regard to moisture content. Results are given, however, none of the tested adhesives passed all the tests.

Perkins, K. L.↗

NASA NTRS1977

A hermetic sealing process for large irregularly shaped hybrid microcircuit enclosures

A system for sealing vacuum baked hybrids in a dry inert atmosphere using an overlapping spot resistance weld is described. A unique electrode configuration and fixturing that permits sealing of large and irregularly shaped gold plated Kovar packages to the hermeticity requirements of MIL-STD-883 was discussed. Metallurgical considerations and comparisons to laser sealing were made. Problems encountered during the development and optimization of the process were highlighted. Solutions to plating, fixturing, warpage, weld splatter and cracked bead problems are presented.

Stahler, M. R.↗

NASA NTRS1978

Development of low cost, high reliability sealing techniques for hybrid microcircuit packages. Phase 2, supplement 1: Moisture permeation of adhesive-sealed hybrid microcircuit packages

The susceptibility of adhesive-sealed ceramic packages to moisture permeation was investigated. The two adhesives, Ablebond 789-1 and Epo-Tek H77, were evaluated as package sealants. These adhesives were previously selected as the most promising candidates for this application from a group of ten adhesives. Ceramic packages sealed with these adhesives were exposed to temperature-humidity conditions of 25 C/98 percent RH, 50 C/60 percent RH, 50 C/98 percent RH, and 85 C/85 percent RH and their moisture contents using were monitored solid state moisture sensors sealed inside them. Five packages were tested at each of these exposures - two ceramic packages sealed with each of the two adhesives and one seam-sealed gold-plated Kovar package. This latter package was included to serve as a control. The results showed that the adhesive-sealed packages were not hermetic to moisture. The rates at which moisture entered the packages increased with the severity of the exposure environments (i.e., higher temperatures and higher moisture vapor pressures) with greater dependence on temperature than on moisture vapor pressure.

Perkins, K. L.↗

NASA NTRS1979

Investigation into the effect of plasma pretreatment on the adhesion of parylene to various substrates

A procedure is described for using argon and oxygen plasmas to promote adhesion of parylene coatings upon many difficult-to-bond substrates. Substrates investigated were gold, nickel, kovar, teflon (FEP), kapton, silicon, tantalum, titanium, and tungsten. Without plasma treatment, 180 deg peel tests yield a few g/cm (oz/in) strengths. With dc plasma treatment in the deposition chamber, followed by coating, peel strengths are increased by one to two orders of magnitude.

Riley, T.↗

NASA NTRS1980

Investigation into the effect of plasma pretreatment on the adhesion of parylene to various substrates

An experimental effort has been undertaken to examine the effect of plasma pretreatment of various substrate materials coated with a polymer in the parylene family. This report describes the procedure and discusses initial data which indicate using plasmas of argon and oxygen to promote adhesion of parylene coatings upon many difficult-to-bond substrates. Substrates investigated were gold, nickel, kovar, teflon (FEP), kapton, silicon, tantalum, titanium, and tungsten. Without plasma treatment, 180 deg peel tests yield a few g/cm (oz/in) strengths. With dc plasma treatment in the deposition chamber, followed by coating, peel strengths are increased by one to two orders of magnitude.

Riley, T.↗

NASA NTRS1983

Low-Cost Alternatives in Hybrid Microcircuit Packaging

Adhesive sealing, nickel plating, and multiwire boards evaluated. Based on study involving fully developed hardware, report considers adhesive packaging instead of seam welding, nickel-plated Kovar (commercial Fe/NI/Co alloy) packages instead of gold plates ones, and multiwire circuit boards instead of multilayer boards as alternatives for reducing cost of hardware without reducing reliability.

Caruso, S. V.↗

NASA NTRS1987

Method for forming hermetic seals

The firmly adherent film of bondable metal, such as silver, is applied to the surface of glass or other substrate by decomposing a layer of solution of a thermally decomposable metallo-organic deposition (MOD) compound such as silver neodecanoate in xylene. The MOD compound thermally decomposes into metal and gaseous by-products. Sealing is accomplished by depositing a layer of bonding metal, such as solder or a brazing alloy, on the metal film and then forming an assembly with another high melting point metal surface such as a layer of Kovar. When the assembly is heated above the temperature of the solder, the solder flows, wets the adjacent surfaces and forms a hermetic seal between the metal film and metal surface when the assembly cools.

Gallagher, Brian D.↗

NASA NTRS1988

Tool For Tinning Integrated-Circuit Leads

As many as eight flatpacks held. Tool made of fiberglass boards. Clamps row of flatpacks by their leads so leads on opposite side of packages dipped. After dipping, nuts on boards loosened, flatpacks turned around, nuts retightened, and untinned leads dipped. Strips of magnetic material grip leads of flatpacks (made of Kovar, magnetic iron/nickel/cobalt alloy) while boards repositioned. Micrometerlike screw used to adjust exposed width of magnetic strip to suit dimensions of flatpacks. Holds flatpack integrated circuits so leads tinned. Accommodates several flatpacks for simultaneous dipping of leads in molten solder. Adjusts to accept flatpacks in range of sizes.

Prosser, Gregory N.↗

NASA NTRS1988

Development of the RAIDS extreme ultraviolet wedge and strip detector

In the next few years the Remote Atmospheric and Ionospheric Detector System (RAIDS) package will be flown on a Tiros spacecraft. The EUV spectrometer experiment contains a position-sensitive detector based on wedge and strip anode technology. A detector design has been implemented in brazed alumina and kovar to provide a rugged bakeable housing and anode. A stack of three 80:1 microchannel plates is operated at 3500-4100 V. to achieve a gain of about 10 to the 7th. The top MCP is to be coated with MgF for increased quantum efficiency in the range of 50-115 nm. A summary of fabrication techniques and detector performance characteristics is presented.

Kayser, D. C.↗