NASA NTRS · 19770044821
Device/packaging reliability problems of solid-state devices for space applications
Abstract
This paper presents data that has been generated within NASA, especially the Marshall Space Flight Center, concerning several failure mechanisms that have occurred with microelectronic packages. The types of packages that will be discussed are primarily flat packs with 14-24 exit leads that are composed of Kovar electro-deposited nickel and finally gold plated.
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Villella, F., Nowakowski, M. F.. 1976-01-01. Device/packaging reliability problems of solid-state devices for space applications. https://ntrs.nasa.gov/citations/19770044821
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