Cleaving machine for hard crystals

Abstract

Hard crystalline materials such as lithium fluoride (LiF) are cleaved in thin sections by semiautomatic machine. Yield of undistorted LiF crystals is almost 100 percent, even when cleaved section is only 1/32 inch thick. Machine contains spring-activated hammer that limits penetration of blade and controls shock that cleaves crystal. Fixture with spring-loaded clamps precisely locates and holds crystal, restraining it in ideal position for cleaving. Crystal then splays apart.