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Hallberg, F.

Publications and source records attributed to Hallberg, F..

Cleaving machine for hard crystals

Hard crystalline materials such as lithium fluoride (LiF) are cleaved in thin sections by semiautomatic machine. Yield of undistorted LiF crystals is almost 100 percent, even when cleaved section is only 1/32 inch thick. Machine contains spring-activated hammer that limits penetration of blade and controls shock that cleaves crystal. Fixture with spring-loaded clamps precisely locates and holds crystal, restraining it in ideal position for cleaving. Crystal then splays apart.

Benedicto, J. S. J.

Precision cleaver for "soft" crystals

"Soft" crystals are cleaved as thin 0.005 inch with special cleaver. Thin slices of soft crystalline materials are used in X-ray spectrometers. Slices are usually cut by hand with wire or blade. Wire tends to scratch surface and to produce slices of nonuniform thickness. Device will rapidly cut soft crystals in smooth, thin, uniform slices.

Benedicto, J. S. J.