Engineering topics

Benedicto, J. S. J.

Publications and source records attributed to Benedicto, J. S. J..

4 records

NASA NTRS1982

Crystal cleaving machine

A machine is disclosed for cleaving hard crystals. A typical example of which is lithium fluoride, with prcision and uniformity and includes vertical axis positioning control means for an adjustable spring tension guided hammer mechanism employed to strike an anvil. A crystal cleaving shock wave transmitted to a cleaving blade is generated having an angulated cleaving edge in contact with one corner of the crystal. Connection between the anvil and the blade is by means of a pair of vertical shafts held in substantially friction free engagement by two pairs of adjustable linear bearings. An underlying crystal holding fixture with horizontal position control means includes a zero reference stop face for the crystal and opposing spring-loaded clamping and vertical positioning elements which are precisely guided.

Hallberg, F. C.↗

NASA NTRS1981

Cleaving machine for hard crystals

Hard crystalline materials such as lithium fluoride (LiF) are cleaved in thin sections by semiautomatic machine. Yield of undistorted LiF crystals is almost 100 percent, even when cleaved section is only 1/32 inch thick. Machine contains spring-activated hammer that limits penetration of blade and controls shock that cleaves crystal. Fixture with spring-loaded clamps precisely locates and holds crystal, restraining it in ideal position for cleaving. Crystal then splays apart.

Benedicto, J. S. J.↗

NASA NTRS1980

Method and apparatus for slicing crystals

The crystal slicing method is described as follows. A crystal is sliced in a plane parallel to flat, opposed parallel end faces of the crystal. The end faces of the crystal are gripped by a pair of opposed, perforated platens of a pair of vacuum chambers, one of which is translatable relative to the other. A blade cuts the crystal through the desired plane. A spring biases one of the vacuum chambers away from the other vacuum chamber while both of the faces are gripped by the vacuum chambers and the blade is cleaving the crystal. A sliced portion of the crystal gripped by one of the vacuum chambers is pulled away from the remainder of the crystal gripped by the second vacuum chamber when the crystal was cleaved by the blade through the plane.

Benedicto, J. S. J.↗

NASA NTRS1979

Precision cleaver for "soft" crystals

"Soft" crystals are cleaved as thin 0.005 inch with special cleaver. Thin slices of soft crystalline materials are used in X-ray spectrometers. Slices are usually cut by hand with wire or blade. Wire tends to scratch surface and to produce slices of nonuniform thickness. Device will rapidly cut soft crystals in smooth, thin, uniform slices.

Benedicto, J. S. J.↗