Engineering topics

Sheppard, C. H.

Publications and source records attributed to Sheppard, C. H..

22 records · Page 2

NASA NTRS1974

Development of autoclavable addition type polyimides

Two highly promising approaches to yield autoclavable addition-type polyimides were identified and evaluated in the program. Conditions were established for autoclave preparation of Hercules HMS graphite fiber reinforced composites in the temperature range of 473 K to 505 K under an applied pressure of 0.7 MN/m2 (100 psi) for time durations up to four hours. Upon oven postcure in air at 589 K, composite samples demonstrated high mechanical property retention at 561 K after isothermal aging in air for 1000 hours. Promise was shown for shorter term mechanical property retention at 589 K upon exposure in air at this temperature.

Jones, R. J.↗

NASA NTRS1974

Cryogenic/high temperature structural adhesives

Results are described of the work performed to develop a structural adhesive system which possesses useful properties over a 20K (-423 F) to 589 K (600 F) temperature range. Adhesives systems based on polyimide, polyphenylquinoxaline polyquinoxaline, polybenzothiazole and polybenzimidazole polymers first were screened for suitability. Detailed evaluation of two polyimide adhesive sytems, Br34/FM34 and P4/A5F or P4A/A5FA, and one polyphenylquinoxaline adhesive system, PPQ II (IMW), then was performed. Property information was generated over the full temperature range for shear strength, stressed and unstressed thermal aging, thermal shock and coefficient of thermal expansion. Both polyimide adhesive systems were identified as being capable of providing structural adhesive joints for cryogenic/high temperature service.

Vaughan, R. W.↗

NASA NTRS1974

Cryogenic/high temperature structural adhesives

Studies were conducted to develop a structural adhesive system possessing useful properties over a 20 to 589 K temperature range. Adhesive systems based on polyimide, polyphenylquinoxaline, polyquinoxaline, polybenzothiazole and polybenzimidazole polymers first were screened for suitability. Detailed evaluation of two polyimide adhesive systems, BR34/FM34 and P4/A5F or P4A/A5FA, and one polyphenylquinoxaline adhesive system, PPQ (IMW), then was performed. Property information was generated over the full temperature range for shear strength, stressed and unstressed thermal aging, thermal shock, and coefficient of thermal expansion. Both polyimide adhesive systems were identified as being capable of providing structural adhesive joints for cryogenic/high temperature service.

Vaughan, R. W.↗

NASA NTRS1971

Development of a low void polyimide resin for autoclave processing of glass and graphite reinforced composites.

Experimental studies are described in which new A-type polyimide prepolymer chemical modifications were investigated with the aim of increasing the melt phase duration and temperature range permitting autoclave processing, yet retaining the addition-type cure mechanism required for low-void content composites. Several modification candidates were examined, and one specific formulation was selected for detailed investigation. This A-type polyimide prepolymer formulation is shown to possess the desired characteristics.

Vaughan, R. W.↗