Perfromance Characterization of the Sunpower Cryocooler
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cryocooler sunpower cryocooler↗
Engineering topics
Ross, R. G., Jr.
Publications and source records attributed to Ross, R. G., Jr..
Thermal Performance of Stirling Cycle Cryocolers: A Comparison of JPL-Tested Coolers
Spacecraft cryocoolers continue to attract interest n the space science community. To date, many Stirlling cycle cryocoolers have been characterized by JPL in a number of performance areas including thermal performance.
cryocooler Stirling cryocooler Stirling spacecraft↗
Performance Characterization of the Sunpower Cryocooler
The Sunpower 140K cryocooler is an integral in-line single compressor/single displacer configuration that features the use of low friciton gas bearings on all running surfaces. The design is vey compact, simple, and light-weight. This type of cryocooler was originally intended for use in the electronics industry.
cryocooler Sunpower 140K cryocooler↗
STRV Cryocooler Tip Motion Suppression
The Space Technology Research Vehicle (STRV-1b) scheduled to fly at the beginning of June 1994, has a cryocooler vibration suppression experiment aboard doing motion suppression of the tip of the coldfinger. STRV-1b is a bread box sized satellite to be launched on the next flight of the Ariane-4.
STRV piezo-electric translators applique ceramic a↗
Cryocooler Coldfinger Heat Interceptor
Spacecraft instruments requiring cryocoolers in their design struggle to keep overall power requirements in line with feasible solar array dimensions and launch vehicle lift capacities. Intermediate temperature (150 K to 200 K) radiators to cool radiation shields or optics on spacecraft instruments provide an as yet untapped resource for reducing the cryocooler power requirments.
Cryogenic Temperature↗
Solder Creep-Fatigue Interactions with Flexible Leaded Part
In most electronic packaging applications it is not a single high stress event that breaks a component solder joint; rather it is repeated or prolonged load applications that result in fatigue or creep failure of the solder. The principal strain in solder joints is caused by differential expansion between the part and its mounting environment due to hanges in temperature (thermal cycles) and/or due to temperature gradients between the part and the board.
creep effects↗
Solder creep-fatigue interactions with flexible leaded parts
With flexible leaded parts, the solder-joint failure process involves a complex interplay of creep and fatigue mechanisms. To better understand the role of creep in typical multi-hour cyclic loading conditions, a specialized non-linear finite-element creep simulation computer program has been formulated. The numerical algorithm includes the complete part-lead-solder-PWB system, accounting for strain-rate dependence of creep on applied stress and temperature, and the role of the part-lead dimensions and flexibility that determine the total creep deflection (solder strain range) during stress relaxation. The computer program has been used to explore the effects of various solder creep-fatigue parameters such as lead height and stiffness, thermal-cycle test profile, and part/board differential thermal expansion properties. One of the most interesting findings is the strong presence of unidirectional creep-ratcheting that occurs during thermal cycling due to temperature dominated strain-rate effects. To corroborate the solder fatigue model predictions, a number of carefully controlled thermal-cycle tests have been conducted using special bimetallic test boards.
Ross, R. G., Jr.↗
Calorimetric thermal-vacuum performance characterization of the BAe 80 K space cryocooler
A comprehensive characterization program is underway at JPL to generate test data on long-life, miniature Stirling-cycle cryocoolers for space application. The key focus of this paper is on the thermal performance of the British Aerospace (BAe) 80 K split-Stirling-cycle cryocooler as measured in a unique calorimetric thermal-vacuum test chamber that accurately simulates the heat-transfer interfaces of space. Two separate cooling fluid loops provide precise individual control of the compressor and displacer heatsink temperatures. In addition, heatflow transducers enable calorimetric measurements of the heat rejected separately by the compressor and displacer. Cooler thermal performance has been mapped for coldtip temperatures ranging from below 45 K to above 150 K, for heatsink temperatures ranging from 280 K to 320 K, and for a wide variety of operational variables including compressor-displacer phase, compressor-displacer stroke, drive frequency, and piston-displacer dc offset.
Kotsubo, V. Y.↗
A systems approach to solder joint fatigue in spacecraft electronic packaging
Differential expansion induced fatigue resulting from temperature cycling is a leading cause of solder joint failures in spacecraft. Achieving high reliability flight hardware requires that each element of the fatigue issue be addressed carefully. This includes defining the complete thermal-cycle environment to be experienced by the hardware, developing electronic packaging concepts that are consistent with the defined environments, and validating the completed designs with a thorough qualification and acceptance test program. This paper describes a useful systems approach to solder fatigue based principally on the fundamental log-strain versus log-cycles-to-failure behavior of fatigue. This fundamental behavior has been useful to integrate diverse ground test and flight operational thermal-cycle environments into a unified electronics design approach. Each element of the approach reflects both the mechanism physics that control solder fatigue, as well as the practical realities of the hardware build, test, delivery, and application cycle.
Ross, R. G., Jr.↗
Vibration characterization and control of miniature Stirling-cycle cryocoolers for space application
This paper provides a summary overview of the vibration characteristics of split Stirling cryocoolers of the Oxford type and describes means being developed to achieve vibration levels consistent with the exacting requirements of sensitive infrared spectrometer instruments currently under development for NASA applications. A key emphasis of the paper is on exploring both active and passive means of reducing the residual upper harmonics of the drive frequency that remain with nulled back-to-back compressor and displacer units. Vibration supression results, measured with JPL's unique six-DOF force dynamometer, are presented for an 80 K Stirling cooler.
Ross, R. G., Jr.↗
Cold-tip off-state conduction loss of miniature Stirling cycle cryocoolers
For redundant miniature Stirling-cycle cryocoolers in space applications, the off-state heat conduction down the coldfinger of one cooler is a parasitic heat load on the other coolers. At JPL, a heat flow transducer specifically designed to measure this load has been developed, and measurements have been performed on the coldfinger of a British Aerospace 80 K Stirling cooler with the tip temperature ranging between 40 and 170 K. Measurements have also been made using a transient warmup technique, where the warmup rates of the coldtip under various applied heat loads are used to determine the static conduction load. There is a difference between the results of these two methods, and these differences are discussed with regard to the applicability of the transient warmup method to a nonoperating coldfinger.
Kotsubo, V.↗
Design and application of gas-gap heat switches
Gas-gap heat switches can serve as an effective means of thermally disconnecting a standby cryocooler when the primary (operating) cooler is connected and vice versa. The final phase of the development and test of a cryogenic heat switch designed for loads ranging from 2 watts at 8 K, to 100 watts at 80 K are described. Achieved heat-switch on/off conductance ratio ranged from 11,000 at 8 K to 2200 at 80 K. A particularly challenging element of heat-switch design is achieving satisfactory operation when large temperatures differentials exist across the switch. A special series of tests and analyses was conducted and used in this Phase-2 activity to evaluate the developed switches for temperature differentials ranging up to 200 K. Problems encountered at the maximum levels are described and analyzed, and means of avoiding the problems in the future are presented. A comprehensive summary of the overall heat-switch design methodology is also presented with special emphasis on lessons learned over the course of the 4-year development effort.
Chan, C. K.↗
Requirements for long-life mechanical cryocoolers for space applications
The growing demand for long wavelength infrared and submillimeter imaging instruments for space observational applications, together with the emergence of the multiyear life Oxford University Stirling cycle cooler, has led to a rapidly expanding near term commitment to mechanical cryocoolers throughout the subkelvin to 150 K temperature range for long-life space missions. To satisfy this growing commitment, emerging cryocoolers must successfully address not only the input power, cooling power, and mass constraints of the spacecraft and instruments, but also the broad array of complex interface requirements that critically affect successful integration to the sensitive instrument detectors. Generic requirements are presented for each of the cryocooler requirement areas, which are then contrasted with the projected capabilities of emerging space cryocoolers. The degree of match is used to highlight both the strengths of existing technologies and the areas in need of increased development.
Ross, R. G., Jr.↗
Hotspot Endurance Of Solar-Cell Modules
Procedure for evaluating modules for use with concentrators now available. Solar simulator illuminates photovoltaic cells through Fresnel lens of concentrator module. Module and test cells inspected visually at 24-h intervals during test and again when test completed. After test, electrical characteristics of module measured for comparison with pretest characteristics.
Gonzalez, C. C.↗
Electrical isolation design and electrochemical corrosion in thin-film photovoltaic modules
The development of a proposed wet insulation-resistance qualification test specification for production-line modules is presented. Laboratory research directed toward understanding and eliminating problems associated with electrical isolation of thin-film photovoltaic module circuitry is presented. Test results serve to measure module field life as limited by electrochemical corrosion degradation mechanisms. Current module-level research covering encapsulant voltage withstand capability is also described, and suggestions for improving module electrical isolation are offered.
Sugimura, R. S.↗
Recent achievements in module reliability research
After 10 years of extensive research on crystalline-silicon flat-plate photovoltaic modules, the emphasis of recent reliability research has shifted to the emerging first-generation thin-film amorphous-silicon modules. These modules share much in common with their crystalline precursors, but also include many materials and processes that demand the development of reliability technologies. Key research thrusts include light-induced effects, cell corrosion, thermal diffusion, hot-spot heating, and electrical isolation of the cells from the module exterior. Research goals and recent achievements are described in each of these areas.
Ross, R. G., Jr.↗
Corrosion of a-Si cells and modules
The authors report on corrosion/erosion phonemena observed in exposing a-Si cells, modules, and specially designed test structures to natural and accelerated test environments. Relevant cell and module I-V curve data used for monitoring degradation are presented. The causes of the observed degradation, methods of mitigation, and consequences for fielded modules are discussed.
Mon, G. R.↗
Hot-spot qualification testing of concentrator modules
Results of a study to determine the hot-spot susceptibility of concentrator cells, to provide a hot-spot qualification test for concentrator modules, and to provide guidelines for reducing hot-spot susceptibility are presented. Hot-spot heating occurs in a photovoltaic module when the short-circuit current of a cell is lower than the string operating current, forcing the cell into reverse bias with a concurrent power dissipation. Although the basis for the concentrator-module hot-spot qualification test is the test developed for flat-plate modules, issues such as providing cell illumination introduce additional complexities into the testing procedure. The results indicate that the same general guidelines apply to protecting concentrator modules from hot-spot stressing as apply to flat-plate modules, and recommendations are made on the number of bypass diodes required per given number of series cells per module or source circuit. A method for determining the cell temperature in the laboratory or in the field is discussed.
Gonzalez, C. C.↗