Results for “partial discharge (PD)”

NASA NTRS1982

Partial discharge testing under direct voltage conditions

DC partial discharge (PD) (corona) testing is performed using a multichannel analyzer for pulse storing, and data is collected during increase of voltage and at quiescent voltage levels. Thus high voltage ceramic disk capacitors were evaluated by obtaining PD data interspersed during an accelerated life test. Increased PD activity was found early in samples that later failed catastrophically. By this technique, trends of insulation behavior are revealed sensitively and nondestructively in high voltage dc components.

Bever, R. S.↗

NASA NTRS1985

Ramp technique for dc partial discharge testing

The partial discharge (PD) data presently obtained by means of a stepwise ramp technique, for the cases of high voltage (HV) components and such resin-packaged HV devices as the Space Telescope's Faint Object Camera, is acquired separately on part-way ramps to rated voltage and on the intermediate voltage plateaus. For test specimens intended for dc service, this ramp method yields more data on insulation integrity than quiescent dc measurements, especially in the case of specimens of high resistivity which causes the discharge frequency to be deceptively low at constant dc voltage. During upward ramping the voltage distribution is capacitive, and the PD behavior resembles that of an ac test. Many more pulses are obtained in the voids without the heat otherwise generated by the application of 60-Hz ac. PD histograms are presented for various materials, with and without intentional defects.

Bever, R. S.↗

NASA NTRS2018

Lightweight, Durable, and Multifunctional Electrical Insulation Material Systems for High Voltage Applications

Newly developed multilayer structures of well-known polymer insulation materials significantly improved dielectric breakdown voltage, VB, or dielectric strength, K, if well-bonded, when compared to those of single material insulations or the commercial SOA systems, such as Teflon-Kapton-Teflon (TKT), at the same overall thickness. To date, the greatest improvement of the new structures from a few candidate materials, including various types of Kapton PIs and PFA or PET as bond layer (BL), was about 61% higher than that of the Kapton PI alone films, 40.1 vs. 24.9 kV, which was translated to 86.3% decrease in insulation thickness, thus significant volume and weight reduction of the final system. However, it was of interest to note that most improvements of the multilayer structures occurred at thicker overall thicknesses, above ~ 0.15 mm. Extensive analyses also showed that K of the multilayer structures increased with (i) decreasing individual layer thickness regardless of material type, (ii) increasing total accumulated thickness of PI or overall PI/BL ratio, and (iii) increasing number of interface or total number of layers, but only above the aforementioned overall thickness limit. Increases in VB of the multilayer structures were directly correlated with damage evolution and failure mode. With further material-design-process optimizations of the multilayer structures, it was expected to achieve other multifunctionalities, such as high partial discharge (PD) resistance, improved durability, EMI shielding, and high thermal dissipation in addition to high dielectric strength. These new structures can be used in various high voltage and high temperature applications, such as future hybrid or all electric aircraft wiring and power transmission as well as many other non-aerospace high power cables, electronic parts and components, printed circuit board, and so forth. The multilayer insulation system can be easily processed and manufactured with various conductor types via calendaring, compression-molding, stamping, laminating, vacuum-bagging and autoclaving, or 3D printing, even for complex 3-D components. Based on their unique structural configurations and potential capabilities, the new insulation system was identified as micro-multilayer multifunctional electrical insulation (MMEI). Patent application of the MMEI concept and current design configurations was filed for a 1-year provisional application (OAI-58834, Serial No.: 62/659,234), pending conversion to a U.S. utility application. This paper presents details of the MMEI structures, their dielectric performance analyses, potential mechanisms, and commercial scaleup feasibility assessment.

Electric aircrafts↗

NASA NTRS2018

Lightweight, Durable, and Multifunctional Electrical Insulation Material Systems for High Voltage Applications

Newly developed multilayer structures of well-known polymer insulation materials significantly improved dielectric breakdown voltage, VB, or dielectric strength, K, if well-bonded, when compared to those of single material insulations or the commercial SOA systems, such as Teflon-Kapton-Teflon (TKT), at the same overall thickness. To date, the greatest improvement of the new structures from a few candidate materials, including various types of Kapton PIs and PFA or PET as bond layer (BL), was about 61% higher than that of the Kapton PI alone films, 40.1 vs. 24.9 kV, which was translated to 86.3% decrease in insulation thickness, thus significant volume and weight reduction of the final system. However, it was of interest to note that most improvements of the multilayer structures occurred at thicker overall thicknesses, above ~ 0.15 mm. Extensive analyses also showed that K of the multilayer structures increased with (i) decreasing individual layer thickness regardless of material type, (ii) increasing total accumulated thickness of PI or overall PI/BL ratio, and (iii) increasing number of interface or total number of layers, but only above the aforementioned overall thickness limit. Increases in VB of the multilayer structures were directly correlated with damage evolution and failure mode. With further material-design-process optimizations of the multilayer structures, it was expected to achieve other multifunctionalities, such as high partial discharge (PD) resistance, improved durability, EMI shielding, and high thermal dissipation in addition to high dielectric strength. These new structures can be used in various high voltage and high temperature applications, such as future hybrid or all electric aircraft wiring and power transmission as well as many other non-aerospace high power cables, electronic parts and components, printed circuit board, and so forth. The multilayer insulation system can be easily processed and manufactured with various conductor types via calendaring, compression-molding, stamping, laminating, vacuum-bagging and autoclaving, or 3D printing, even for complex 3-D components. Based on their unique structural configurations and potential capabilities, the new insulation system was identified as micro-multilayer multifunctional electrical insulation (MMEI). Patent application of the MMEI concept and current design configurations was filed for a 1-year provisional application (OAI-58834, Serial No.: 62/659,234), pending conversion to a U.S. utility application. This paper presents details of the MMEI structures, their dielectric performance analyses, potential mechanisms, and commercial scaleup feasibility assessment.

Multifunctional↗

NASA NTRSDate not supplied

Progresses in Developing Micro-Multilayer Multifunctional Electrical Insulation (MMEI) System for High Voltage Applications

Development of the novel patented high voltage insulation system, namely micro-multilayer multifunctional electrical insulation (MMEI) was continued particularly for the future hybrid or all electric aircraft applications. Initially, the concept and feasibility of the MMEI system were successfully demonstrated with its exceptionally high dielectric breakdown voltage via optimizing the multilayer structures of the Kapton® PI films and binder layers such as PFA in terms of individual film thickness and layer configuration. Overall, MMEI structures outperformed most of the state-of-the-art (SOA) polymer insulation materials or structures. Since then, further optimizations and improvement of the system were pursued with specific emphasis on multifunctionalities such as moisture blocking, partial discharge (PD) resistance, durability, etc. Efforts have been also continued to identify the controlling mechanisms for the major improvement in dielectric strength of the MMEI structures via 3-dimensional dielectric failure mode analysis. At the same time, significant progress has been made in scaling up the MMEI structures and assessing their commercial applicability and manufacturability by developing full-scale prototypes of electrical components, such as power cable and bus bar. Overall progresses on the MMEI development to date will be presented in this paper.

Novel Electrical Insulation↗

NASA NTRSDate not supplied

Feasibility of Micro-Multilayer Multifunctional Electrical Insulation (MMEI) System for High Voltage Applications

The newly patented micro-multilayer multifunctional electrical insulation (MMEI) system was developed for future electric aircraft applications which critically require lightweight but high voltage (HV), high temperature, and corona or partial discharge (PD) resistant insulation. During the initial development stages, the concept and practicability of the MMEI system were successfully validated with its exceptionally high dielectric breakdown voltages. The multilayer structures were optimized in terms of material type, individual layer thickness, and overall layer configuration along with potential mechanisms identified for its superior performance. Subsequently, scalability, manufacturability, and commercial applicability of the MMEI system were demonstrated with the 1 meter long, 3-phase HV, high power (HP) bus bar prototypes. Two prototypes, one with the conventional SOA insulation system including Mica sheet and the other with an optimized MMEI, were designed, fabricated, and tested successfully. Both prototypes passed both HiPot and PD tests up to the highest test voltage available, 15 kVAC, although the latter showed a slight increase in PD activities at 12.5 kV. However, the prototype with MMEI was 15% lighter or 12% thinner than the other one. Current efforts to significantly enhance the PD resistance of the MMEI system by employing semiconductive shielding layers, which can be also multifunctional, e.g., electromagnetic interference shielding, moisture blocking, heat dissipation, for various HV applications are also discussed in this paper.

Novel Electrical Insulation↗

NASA NTRSDate not supplied

Feasibility of Micro-Multilayer Multifunctional Electrical Insulation (MMEI) System for High Voltage Applications

The newly patented micro-multilayer multifunctional electrical insulation (MMEI) system was developed for future electric aircraft applications which critically require lightweight but high voltage (HV), high temperature, and corona or partial discharge (PD) resistant insulation. During the initial development stages, the concept and practicability of the MMEI system were successfully validated with its exceptionally high dielectric breakdown voltages. The multilayer structures were optimized in terms of material type, individual layer thickness, and overall layer configuration along with potential mechanisms identified for its superior performance. Subsequently, scalability, manufacturability, and commercial applicability of the MMEI system were demonstrated with the 1 meter long, 3-phase HV, high power (HP) bus bar prototypes. Two prototypes, one with the conventional SOA insulation system including Mica sheet and the other with an optimized MMEI, were designed, fabricated, and tested successfully. Both prototypes passed both HiPot and PD tests up to the highest test voltage available, 15 kVAC, although the latter showed a slight increase in PD activities at 12.5 kV. However, the prototype with MMEI was 15% lighter or 12% thinner than the other one. Current efforts to significantly enhance the PD resistance of the MMEI system by employing semiconductive shielding layers, which can be also multifunctional, e.g., electromagnetic interference shielding, moisture blocking, heat dissipation, for various HV applications are also discussed in this paper.

Novel Electrical Insulation↗