Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “circuits”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 1,783 records · Page 99

Calculations of the displacement damage and short-circuit current degradation in proton irradiated (AlGa)As-GaAs solar cells

A theoretical model for computing the displacement damage defect density and the short-circuit current (I sub sc) degradation in proton-irradiated (AlGa)As-GaAs p-n junction solar cells is presented. Assumptions were made with justification that the radiation induced displacement defects form an effective recombination center which controls the electron and hole lifetimes in the junction space charge region and in the n-GaAs active layer of the irradiated GaAs p-n junction cells. The degradation of I sub sc in the (AlGa)As layer was found to be negligible compared to the total degradation. In order to determine the I sub sc degradation, the displacement defect density, path length, range, reduced energy after penetrating a distance x, and the average number of displacements formed by one proton scattering event were first calculated. The I sub sc degradation was calculated by using the electron capture cross section in the p-diffused layer and the hole capture cross section in the n-base layer as well as the wavelength dependent absorption coefficients. Excellent agreement was found between the researchers calculated values and the measured I sub sc in the proton irradiated GaAs solar cells for proton energies of 100 KeV to 10 MeV and fluences from 10 to the 10th power p/square cm to 10 to the 12th power p/square cm.

Yeh, C. S.↗

Rupture testing for the quality control of electrodeposited copper interconnections in high-speed, high-density circuits

Printed Wiring Multilayer Board (PWMLB) structures for high speed, high density circuits are prone to failure due to the microcracking of electrolytic copper interconnections. The failure can occur in the foil that makes up the inner layer traces or in the plated through holes (PTH) deposit that forms the layer to layer interconnections. It is shown that there are some distinctive differences in the quality of Type E copper and that these differences can be detected before its use in a PWMLB. It is suggested that the strength of some Type E copper can be very low when the material is hot and that it is the use of this poor quality material in a PWMLB that results in PTH and inner layer microcracking. Since the PWMLB failure in question are induced by a thermal stress, and since the poorer grades of Type E materials used in these structures are susceptible to premature failure under thermal stress, the use of elevated temperature rupture and creep rupture testing is proposed as a means for screening copper foil, or its PTH equivalent, in order to eliminate the problem of Type E copper microcracking in advanced PWMLBs.

Zakraysek, Louis↗

A design concept for an MMIC (Monolithic Microwave Integrated Circuit) microstrip phased array

A conceptual design for a microstrip phased array with monolithic microwave integrated circuit (MMIC) amplitude and phase controls is described. The MMIC devices used are 20 GHz variable power amplifiers and variable phase shifters recently developed by NASA contractors for applications in future Ka proposed design, which concept is for a general NxN element array of rectangular lattice geometry. Subarray excitation is incorporated in the MMIC phased array design to reduce the complexity of the beam forming network and the number of MMIC components required.

Lee, Richard Q.↗

Simulation of double layers in a model auroral circuit with nonlinear impedance

A reduced circuit description of the U-shaped potential structure of a discrete auroral arc, consisting of the flank transmission line plus parallel-electric-field region, is used to provide the boundary condition for one-dimensional simulations of the double-layer evolution. The model yields asymptotic scalings of the double-layer potential, as a function of an anomalous transport coefficient alpha and of the perpendicular length scale l(a) of the arc. The arc potential phi(DL) scales approximately linearly with alpha, and for alpha fixed phi (DL) about l(a) to the z power. Using parameters appropriate to the auroral zone acceleration region, potentials of phi (DPL) 10 kV scale to projected ionospheric dimensions of about 1 km, with power flows of the order of magnitude of substorm dissipation rates.

Smith, R. A.↗

Preflare energy build-up in a filament circuit

The May 16, 1981 flare observed at Debrecen is studied by extending to a fully three-dimensional model the two-dimensional Van Tend and Kuperus (1978) scenario for preflare energy build-up. It is shown that there are 10 to the 33rd ergs of free energy available to explain the subsequent large two-ribbon flare. As a result of the three-dimensional character of the present model, this estimate is an order of magnitude larger than that made by Van Tend. It is confirmed that the global form of the preflare circuit is highly important in determining the amount of energy stored in the preflare configuration. The present model gives correct predictions for the independently observed photospheric flow velocity and current strength in filaments.

Martens, P. C. H.↗

Anomalous transport in discrete arcs and simulation of double layers in a model auroral circuit

The evolution and long-time stability of a double layer in a discrete auroral arc requires that the parallel current in the arc, which may be considered uniform at the source, be diverted within the arc to charge the flanks of the U-shaped double-layer potential structure. A simple model is presented in which this current re-distribution is effected by anomalous transport based on electrostatic lower hybrid waves driven by the flank structure itself. This process provides the limiting constraint on the double-layer potential. The flank charging may be represented as that of a nonlinear transmission. A simplified model circuit, in which the transmission line is represented by a nonlinear impedance in parallel with a variable resistor, is incorporated in a 1-d simulation model to give the current density at the DL boundaries. Results are presented for the scaling of the DL potential as a function of the width of the arc and the saturation efficiency of the lower hybrid instability mechanism.

Smith, Robert A.↗

Integrated Circuit For Simulation Of Neural Network

Ballast resistors deposited on top of circuit structure. Cascadable, programmable binary connection matrix fabricated in VLSI form as basic building block for assembly of like units into content-addressable electronic memory matrices operating somewhat like networks of neurons. Connections formed during storage of data, and data recalled from memory by prompting matrix with approximate or partly erroneous signals. Redundancy in pattern of connections causes matrix to respond with correct stored data.

Thakoor, Anilkumar P.↗

Redundant Grounding Circuit For Arc Welding

Arc burns at loose ground connections prevented. Protective grounding scheme for arc-welding power supply includes four ground leads to workpiece and circuit that automatically turns off welding current if one or two ground leads becomes disconnected. Prevents burns and inadvertent welding occuring where full welding current passes through single loose ground contact.

Burley, Richard K.↗

Tool For Tinning Integrated-Circuit Leads

As many as eight flatpacks held. Tool made of fiberglass boards. Clamps row of flatpacks by their leads so leads on opposite side of packages dipped. After dipping, nuts on boards loosened, flatpacks turned around, nuts retightened, and untinned leads dipped. Strips of magnetic material grip leads of flatpacks (made of Kovar, magnetic iron/nickel/cobalt alloy) while boards repositioned. Micrometerlike screw used to adjust exposed width of magnetic strip to suit dimensions of flatpacks. Holds flatpack integrated circuits so leads tinned. Accommodates several flatpacks for simultaneous dipping of leads in molten solder. Adjusts to accept flatpacks in range of sizes.

Prosser, Gregory N.↗

Monolithic microwave integrated circuit technology for advanced space communication

Future Space Communications subsystems will utilize GaAs Monolithic Microwave Integrated Circuits (MMIC's) to reduce volume, weight, and cost and to enhance system reliability. Recent advances in GaAs MMIC technology have led to high-performance devices which show promise for insertion into these next generation systems. The status and development of a number of these devices operating from Ku through Ka band will be discussed along with anticipated potential applications.

Ponchak, George E.↗

Arcjet power supply and start circuit

A dc power supply for spacecraft arcjet thrusters has an integral automatic starting circuit and an output averaging inductor. The output averaging inductor, in series with the load, provides instantaneous current control, and ignition pulse and an isolated signal proportional to the arc voltage. A pulse width modulated converter, close loop configured, is also incorporated to give fast response output current control.

Gruber, Robert P.↗

Variations in the electrical short-circuit current decay for recombination lifetime and velocity measurements

An improved measurement system for electrical short-circuit current decay is presented that extends applicability of the method to silicon solar cells having an effective lifetime as low as 1 microsec. The system uses metal/oxide/semiconductor transistors as voltage-controlled switches. Advances in theory developed here increase precision and sensitivity in the determination of the minority-carrier recombination lifetime and recombination velocity. A variation of the method, which exploits measurements made on related back-surface field and back-ohmic contact devices, further improves precision and sensitivity. The improvements are illustrated by application to 15 different silicon solar cells.

Jung, Tae-Won↗

Development of a two-dimensional skin friction balance nulling circuit using multivariable control theory

Measurement of planar skin friction forces in aerodynamic testing currently requires installation of two perpendicularly mounted, single-axis balances; consequently, force components must be sensed at two distinct locations. A two-axis instrument developed at the Langley Research Center to overcome this disadvantage allows measurement of a two-dimensional force at one location. This paper describes a feedback-controlled nulling circuit developed for the NASA two-axis balance which, without external compensation, is inherently unstable because of its low friction mechanical design. Linear multivariable control theory is applied to an experimentally validated mathematical model of the balance to synthesize a state-variable feedback control law. Pole placement techniques and computer simulation studies are employed to select eigenvalues which provide ideal transient response with decoupled sensing dynamics.

Tripp, John S.↗

Testing Fixture For Microwave Integrated Circuits

Testing fixture facilitates radio-frequency characterization of microwave and millimeter-wave integrated circuits. Includes base onto which two cosine-tapered ridge waveguide-to-microstrip transitions fastened. Length and profile of taper determined analytically to provide maximum bandwidth and minimum insertion loss. Each cosine taper provides transformation from high impedance of waveguide to characteristic impedance of microstrip. Used in conjunction with automatic network analyzer to provide user with deembedded scattering parameters of device under test. Operates from 26.5 to 40.0 GHz, but operation extends to much higher frequencies.

Romanofsky, Robert↗

Integrated-Circuit Broadband Infrared Sources

Microscopic devices consume less power, run hotter, and are more reliable. Simple, compact, lightweight, rapidly-responding reference sources of broadband infrared radiation made available by integrated-circuit technology. Intended primarily for use in calibration of remote-sensing infrared instruments, devices eventually replace conventional infrared sources. New devices also replace present generation of miniature infrared sources. Self-passivating nature of poly-crystalline silicon adds to reliability of devices. Maximum operating temperature is 1,000 K, and power dissipation is only one-fourth that of prior devices.

Lamb, G.↗

Automatic Parametric Testing Of Integrated Circuits

Computer program for parametric testing saves time and effort in research and development of integrated circuits. Software system automatically assembles various types of test structures and lays them out on silicon chip, generates sequency of test instructions, and interprets test data. Employs self-programming software; needs minimum of human intervention. Adapted to needs of different laboratories and readily accommodates new test structures. Program codes designed to be adaptable to most computers and test equipment now in use. Written in high-level languages to enhance transportability.

Jennings, Glenn A.↗

Healing Voids In Interconnections In Integrated Circuits

Unusual heat treatment heals voids in aluminum interconnections on integrated circuits (IC's). Treatment consists of heating IC to temperature between 200 degrees C and 400 degrees C, holding it at that temperature, and then plunging IC immediately into liquid nitrogen. Typical holding time at evaluated temperature is 30 minutes.

Cuddihy, Edward F.↗

Variable-Resistivity Material For Memory Circuits

Nonvolatile memory elements packed densely. Electrically-erasable, programmable, read-only memory matrices made with newly-synthesized organic material of variable electrical resistivity. Material, polypyrrole doped with tetracyanoquinhydrone (TCNQ), changes reversibly between insulating or higher-resistivity state and conducting or low-resistivity state. Thin film of conductive polymer separates layer of row conductors from layer of column conductors. Resistivity of film at each intersection and, therefore, resistance of memory element defined by row and column, increased or decreased by application of suitable switching voltage. Matrix circuits made with this material useful for experiments in associative electronic memories based on models of neural networks.

Nagasubramanian, Ganesan↗