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At least 1,765 records · Page 98

System architecture of MMIC-based large aperture arrays for space application

The persistent trend to use millimeter-wave frequencies for satellite communications presents the challenge to design large-aperture phased arrays for space applications. These arrays, which comprise 100 to 10,000 elements, are now possible due to the advent of lightwave technology and the availability of monolithic microwave integrated circuits. In this paper, system aspects of optically controlled array design are studied. In particular, two architectures for a 40 GHz array are outlined, and the main system-related issues are examined: power budget, synchronization in frequency and phase, and stochastic effects.

Herczfeld, P. R.↗

The coupled dynamics of fluids and spacecraft in low gravity and low gravity fluid measurement

The very large mass fraction of liquids stored on broad current and future generation spacecraft has made critical the technologies of describing the fluid-spacecraft dynamics and measuring or gauging the fluid. Combined efforts in these areas are described, and preliminary results are presented. The coupled dynamics of fluids and spacecraft in low gravity study is characterizing the parametric behavior of fluid-spacecraft systems in which interaction between the fluid and spacecraft dynamics is encountered. Particular emphasis is given to the importance of nonlinear fluid free surface phenomena to the coupled dynamics. An experimental apparatus has been developed for demonstrating a coupled fluid-spacecraft system. In these experiments, slosh force signals are fed back to a model tank actuator through a tunable analog second order integration circuit. In this manner, the tank motion is coupled to the resulting slosh force. Results are being obtained in 1-g and in low-g (on the NASA KC-135) using dynamic systems nondimensionally identical except for the Bond numbers.

Hansman, R. John↗

Ion beam sputter etching

An ion beam etching process which forms extremely high aspect ratio surface microstructures using thin sputter masks is utilized in the fabrication of integrated circuits. A carbon rich sputter mask together with unmasked portions of a substrate is bombarded with inert gas ions while simultaneous carbon deposition occurs. The arrival of the carbon deposit is adjusted to enable the sputter mask to have a near zero or even slightly positive increase in thickness with time while the unmasked portions have a high net sputter etch rate.

Banks, Bruce A.↗

RF characterization of monolithic microwave and mm-wave ICs

A number of fixturing techniques compatible with automatic network analysis are presented. The fixtures are capable of characterizing GaAs Monolithic Microwave Integrated Circuits (MMICs) at K and Ka band. Several different transitions are used to couple the RF test port to microstrip. Fixtures which provide chip level de-embedding are included. In addition, two advanced characterization techniques are assessed.

Romanofsky, R. R.↗

Measurement science and manufacturing science research

The research program of Semiconductor Research Corp. is managed as three overlapping areas: Manufacturing Sciences, Design Sciences and Microstructure Sciences. A total of 40 universities are participating in the performance of over 200 research tasks. The goals and direction of Manufacturing Sciences research became more clearly focused through the efforts of the Manufacturing Sciences Committee of the SRC Technical Advisory Board (TAB). The mission of the SRC Manufacturing Research is the quantification, control, and understanding of semiconductor manufacturing process necessary to achieve a predictable and profitable product output in the competitive environment of the next decade. The 1994 integrated circuit factory must demonstrate a three level hierarchy of control: (1) operation control, (2) process control, and (3) process design. These levels of control are briefly discussed.

Phillips, D. Howard↗

Surface inspection: Research and development

Surface inspection techniques are used for process learning, quality verification, and postmortem analysis in manufacturing for a spectrum of disciplines. First, trends in surface analysis are summarized for integrated circuits, high density interconnection boards, and magnetic disks, emphasizing on-line applications as opposed to off-line or development techniques. Then, a closer look is taken at microcontamination detection from both a patterned defect and a particulate inspection point of view.

Batchelder, J. S.↗

Swept frequency technique for dispersion measurement of microstrip lines

Microstrip lines used in microwave integrated circuits are dispersive. Because a microstrip line is an open structure, the dispersion can not be derived with pure TEM, TE, or TM mode analysis. Dispersion analysis has commonly been done using a spectral domain approach, and dispersion measurement has been made with high Q microstrip ring resonators. Since the dispersion of a microstrip line is fully characterized by the frequency dependent phase velocity of the line, dispersion measurement of microstrip lines requires the measurement of the line wavelength as a function of frequency. In this paper, a swept frequency technique for dispersion measurement is described.

Lee, Richard Q.↗

Progress in knowledge representation research

Brief descriptions are given of research being carried out in the field of knowledge representation. Dynamic simulation and modelling of planning systems with real-time sensor inputs; development of domain-independent knowledge representation tools which can be used in the development of application-specific expert and planning systems; and development of a space-borne very high speed integrated circuit processor are among the projects discussed.

Lum, Henry↗

The split-cross-bridge resistor for measuring the sheet resistance, linewidth, and line spacing of conducting layers

A new test structure was developed for evaluating the line spacing between conductors on the same layer using an electrical measurement technique. This compact structure can also be used to measure the sheet resistance, linewidth, and line pitch of the conducting layer. Using an integrated-circuit fabrication process, this structure was fabricated in diffused polycrystalline silicon and metal layers and measured optically and electrically. For the techniques used, the optical measurements were typically one-quarter micron greater than the electrical measurements. Most electrically measured line pitch values were within 2 percent of the designed value. A small difference between the measured and designed line pitch is used to validate sheet resistance, linewidth, and line spacing values.

Buehler, M. G.↗

Empirical modeling of Single-Event Upset (SEU) in NMOS depletion-mode-load static RAM (SRAM) chips

A detailed experimental investigation of single-event upset (SEU) in static RAM (SRAM) chips fabricated using a family of high-performance NMOS (HMOS) depletion-mode-load process technologies, has been done. Empirical SEU models have been developed with the aid of heavy-ion data obtained with a three-stage tandem van de Graaff accelerator. The results of this work demonstrate a method by which SEU may be empirically modeled in NMOS integrated circuits.

Zoutendyk, J. A.↗

A 30-GHz monolithic receiver

Several monolithic integrated circuits have been developed to make a 30-GHz receiver. The receiver components include a low-noise amplifier (LNA), an IF amplifier, a mixer, and a phase shifter. The LNA has a 7-dB noise figure with over 17 dB of associated gain. The IF amplifier has a 13-dB gain with a 30-dB control range. The mixer has a conversion loss of 10.5 dB. The phase shifter has a 180-deg phase shift control and a minimum insertion loss of 1.6 dB.

Liu, Louis C. T.↗

DSP-based non-coherent dual detector demodulator for land mobile radio channels

This paper outlines the development of a digital demodulator suitable for the non-coherent detection of various modulation formats including: Phase Shift Keying (PSK), Continuous Phase Frequency Shift Keying (CPFSK) and Frequency Modulation (FM). The demodulator design concept has been derived with a view towards a single integrated circuit (IC) implementation. Two detectors, one non-coherent and one differentially coherent, operate concurrently, providing data detection and automatic frequency control (AFC). Bit error rate results are provided which illustrate the receiver performance in white Gaussian noise.

Saulnier, Gary J.↗

20-GHz phased-array-fed antennas utilizing distributed MMIC modules

The feasibility of phased-array-fed dual-reflector systems with distributed power and phase control, and utilizing monolithic microwave integrated circuit modules, is demonstrated. Secondary radiation patterns for various antenna configurations, calculated using a method in which the phased array for each scanning direction is simulated by a fictitious point source, are computed to determine the achievable EIRP levels, sidelobe isolation, and cross-polarization isolation. The focal-region-fed Cassegrain reflector was found to be best suited for fixed multiple beam applications, while the phased-array-fed dual-reflector configuration was selected for multiple scanning beams. Key elements of the phased-array design including a radiating square horn and a square orthomode transducer were fabricated and tested.

Sorbello, R. M.↗

System architecture of a gallium arsenide one-gigahertz digital IC tester

The design for a 1-GHz digital integrated circuit tester for the evaluation of custom GaAs chips and subsystems is discussed. Technology-related problems affecting the design of a GaAs computer are discussed, with emphasis on the problems introduced by long printed-circuit-board interconnect. High-speed interface modules provide a link between the low-speed microprocessor and the chip under test. Memory-multiplexer and memory-shift register architectures for the storage of test vectors are described in addition to an architecture for local data storage consisting of a long chain of GaAs shift registers. The tester is constructed around a VME system card cage and backplane, and very little high-speed interconnect exists between boards. The tester has a three part self-test consisting of a CPU board confidence test, a main memory confidence test, and a high-speed interface module functional test.

Fouts, Douglas J.↗

Public-Facilities Locator For The Blind

Proposed optoelectronic system guides blind people to important locations in public buildings, With system, sightless person easily determines directions and distances of restrooms, water fountains, stairways, emergency exits, and elevators. Circuitry uncomplicated and inexpensive, in both transmitter and receiver. Readily-available light-emitting diodes, photodiodes, and integrated-circuit chips used to build locator aid for the blind.

Moore, Kevin D.↗

Electron Beam "Writes" Silicon On Sapphire

Method of growing silicon on sapphire substrate uses beam of electrons to aid growth of semiconductor material. Silicon forms as epitaxial film in precisely localized areas in micron-wide lines. Promising fabrication method for fast, densely-packed integrated circuits. Silicon deposited preferentially in contaminated substrate zones and in clean zone irradiated by electron beam. Electron beam, like surface contamination, appears to stimulate decomposition of silane atmosphere.

Heinemann, Klaus↗

Noninterlaced-To-Interlaced Television-Scan Converter

Computer text and ordinary images displayed together without text jitter. Scan converter enables superposition of alphanumerical text generated by computer-driven video generator on National Television System Committee (NTSC) standard interlaced-scan image. Made of commercially available integrated circuits and operates in conjunction with NTSC synchronizing-signal generator. Standard television picture transmitted in two interlaced fields. Without scan converter, text image moves up and down by one line as fields change. With scan converter, text image stands still.

Morales, Sergio↗