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Recent developments in semiconductor research

Recent findings drawn from various laboratories focused toward a new understanding of the nature of crystal growth and how impurities are incorporated or excluded from the lattice were considered. From these findings a heuristic approach is given for improving the uniformity and charge carrier concentration of thin semiconductor films. Such improvement is considered essential to achieve respectable yield on large scale integrated circuits. A tentative conclusion is drawn which indicates that if the host compound crystal reactants are provided to the growing crystal surface in a reasonably stoichiometric manner, it is virtually impossible to include impurities into a growing crystal surface held at a sufficiently low temperature; impurities are incorporated into the crystal by gettering action of crystal defects located one and two monlayers beneath the growing surface. Devices in 3-5 semiconductors based on heterojunctions and two dimensional electron gases are noted and reliability concerns are voiced. Alternatives and novel device structures such as truly single crystal high quality silicon on insulator and beta silicon carbide devices are presented.

Yoder, M. N.↗

Electron lithography STAR design guidelines. Part 1: The STAR user design manual

The STAR system developed by NASA enables any user with a logic diagram to design a semicustom digital MOS integrated circuit. The system is comprised of a library of standard logic cells and computer programs to place, route, and display designs implemented with cells from the library. Library cells of the CMOS metal gate and CMOS silicon gate technologies were simulated using SPICE, and the results are shown and compared.

Trotter, J. D.↗

Electron lithography STAR design guidelines. Part 2: The design of a STAR for space applications

The STAR design system developed by NASA enables any user with a logic diagram to design a semicustom digital MOS integrated circuit. The system is comprised of a library of standard logic cells and computr programs to place, route, and display designs implemented with cells from the library. Also described is the development of a radiation-hard array designed for the STAR system. The design is based on the CMOS silicon gate technology developed by SANDIA National Laboratories. The design rules used are given as well as the model parameters developed for the basic array element. Library cells of the CMOS metal gate and CMOS silicon gate technologies were simulated using SPICE, and the results are shown and compared.

Trotter, J. D.↗

Practical preventive reliability using matrix forms

This paper describes a practical new tool to improve the reliability of equipment. It uses a matrix form to help monitor anticipated component faults precisely. The tool provides the practical measures necessary to generate matrix tables that accurately display all causes of failure and all planned programmatic analyses, tests, processes, and inspections. When completed, the matrix tables give users in-depth visibility of the degree of protection against component failure that is provided by the program's preventive measure plans. The matrix form is an excellent technique for tracking, and thereby influencing, the reliability of nonelectronic spacecraft subsystems or components. No electronic applications have been tried, but the procedure can be useful in the electronics field, e.g., in integrated circuit production planning, and perhaps in process control, inspection or test lines for other electronic components. The drawing of forms, and the recording/manipulation of the data can be computerized.

Johnson, S. A.↗

High-density Schottky barrier IRCCD sensors for remote sensing applications

It is pointed out that the ambitious goals envisaged for the next generation of space-borne sensors challenge the state-of-the-art in solid-state imaging technology. Studies are being conducted with the aim to provide focal plane array technology suitable for use in future Multispectral Linear Array (MLA) earth resource instruments. An important new technology for IR-image sensors involves the use of monolithic Schottky barrier infrared charge-coupled device arrays. This technology is suitable for earth sensing applications in which moderate quantum efficiency and intermediate operating temperatures are required. This IR sensor can be fabricated by using standard integrated circuit (IC) processing techniques, and it is possible to employ commercial IC grade silicon. For this reason, it is feasible to construct Schottky barrier area and line arrays with large numbers of elements and high-density designs. A Pd2Si Schottky barrier sensor for multispectral imaging in the 1 to 3.5 micron band is under development.

Elabd, H.↗

Annual Conference on Nuclear and Space Radiation Effects, 21st, Colorado Springs, CO, July 23-25, 1984, Proceedings

Radiation effects on electronic systems and devices (particularly spacecraft systems) are examined with attention given to such topics as radiation transport, energy deposition, and charge collection; single-event phenomena; basic mechanisms of radiation effects in structures and materials; and EMP phenomena. Also considered are radiation effects in integrated circuits, spacecraft charging and space radiation effects, hardness assurance for devices and systems, and SGEMP/IEMP phenomena.

Winokur, P. S.↗

High-voltage solar-cell chip

Integrated circuit technology has been successfully applied to the design and fabrication of 0.5 x 0.5-cm planar multijunction solar-cell chips. Each of these solar cells consisted of six voltage-generating unit cells monolithically connected in series and fabricated on a 75-micron-thick, p-type, single crystal, silicon substrate. A contact photolithic process employing five photomask levels together with a standard microelectronics batch-processing technique were used to construct the solar-cell chip. The open-circuit voltage increased rapidly with increasing illumination up to 5 AM1 suns where it began to saturate at the sum of the individual unit-cell voltages at a maximum of 3.0 V. A short-circuit current density per unit cell of 240 mA/sq cm was observed at 10 AM1 suns.

Kapoor, V. J.↗

Partial-Transmission Scintillation Detector for Ions

Only outer portion of ion beam sampled to prevent unnecessary energy losses. Measurement device allows only periphery of beam to pass through scintillation material. Total flux in uniform beam inferred from peripheral flux. Device provides readings without reducing energy of ions in middle of beam. Measurement device developed for ion beams used in studies of how fast heavy ions affect integrated-circuit chips.

Malone, C. J.↗

Phase-Measuring System

System developed and used at Langley Research Center measures phase between two signals of same frequency or between two signals, one of which is harmonic multiple of other. Simple and inexpensive device combines digital and analog components to give accurate phase measurements. One signal at frequency f fed to pulse shaper, produces negative pulse at time t4. Pulse applied to control input of sample-and-hold module 1. Second signal, at frequency nf, fed to zero-crossover amplifier, producing square wave at time t. Signal drives first one-shot producing narrow negative pulse at t1. Signal then drives second one-shot producing narrow positive pulse at time t2. This pulse used to turn on solid-state switch and reset integrator circuit to zero.

Davis, W. T.↗

Radiation Hardening of Computers

Single-event upsets reduced by use of oversize transistors. Computers made less susceptible to ionizing radiation by replacing bipolar integrated circuits with properly designed, complementary metaloxide-semiconductor (CMOS) circuits. CMOS circuit chips made highly resistant to single-event upset (SEU), especially when certain feedback resistors are incorporated. Redesigned chips also consume less power than original chips.

Nichols, D. K.↗

Masking Technique for Ion-Beam Sputter Etching

Improved process for fabrication of integrated circuits developed. Technique utilizes simultaneous ion-beam sputter etching and carbon sputter deposition in conjunction with carbon sputter mask or organic mask decomposed to produce carbon-rich sputter-mask surface. Sputter etching process replenishes sputter mask with carbon to prevent premature mask loss.

Banks, B. A.↗

GaAs Semi-Insulating Layer for a GaAs Device

Improved design for GaAs electronic device or integrated circuit designed to operate at cryogenic temperatures, customary SiO2 insulating layer replaced by semi-insulating layer of GaAs. Thermal expansions of device and covering layer therefore match closely, and thermal stresses caused by immersion in cryogenic chamber nearly eliminated.

Sherrill, G.↗

Monolithic 20-GHz Transmitting Module

20-GHz monolithic microwave/millimeter-wave integrated circuit (MMIC) with amplification and phase-shift (time-delay) capabilities developed. Use of MMIC module technology promises to make feasible development of weight- and cost-effective phased-array antenna systems, identified as major factor in achieving minimum cost and efficient use of frequency and orbital resources of future generations of communication satellite systems. Use of MMIC transmitting modules provides for relatively simple method for phase-shift control of many separate radio-frequency (RF) signals required for phased-array antenna systems.

Kascak, T.↗

A dual frequency microstrip antenna for Ka band

For fixed satellite communication systems at Ka band with downlink at 17.7 to 20.2 GHz and uplink at 27.5 to 30.0 GHz, the focused optics and the unfocused optics configurations with monolithic phased array feeds have often been used to provide multiple fixed and multiple scanning spot beam coverages. It appears that a dual frequency microstrip antenna capable of transmitting and receiving simultaneously is highly desirable as an array feed element. This paper describes some early efforts on the development and experimental testing of a dual frequency annular microstrip antenna. The antenna has potential application for use in conjunction with a monolithic microwave integrated circuit device as an active radiating element in a phased array of phased array feeds. The antenna is designed to resonate at TM sub 12 and TM sub 13 modes and tuned with a circumferential microstrip ring to vary the frequency ratio. Radiation characteristics at both the high and low frequencies are examined. Experimental results including radiating patterns and swept frequency measurements are presented.

Lee, R. Q.↗

Characterization of MMIC devices for active array antennas

Certain aspects of monlithic microwave integrated circuit (MMIC) interconnectivity were investigated. Considerations that lead to preserving the inherently reproducible characteristics of the MMIC are proposed. It is shown that at radio frequencies (RF) greater than 20 GHz, the transition from the MMIC device to other transmission media must be an accurate RF match. It is proposed that the RF match is sufficiently critical to include the transition as part of the delivered MMIC package. The model to analyze several transitions is presented. This model consists of a succession of abrupt discontinuities in printed circuit transmission lines. The analysis of these discontinuities is achieved by the Spectral Galerkin technique, to establish the modes and mode that special effects should be coordinated by the active array antenna industry toward standardization of MMIC packaging and characterization.

Smetana, J.↗

Crystalline-silicon reliability lessons for thin-film modules

The reliability of crystalline silicon modules has been brought to a high level with lifetimes approaching 20 years, and excellent industry credibility and user satisfaction. The transition from crystalline modules to thin film modules is comparable to the transition from discrete transistors to integrated circuits. New cell materials and monolithic structures will require new device processing techniques, but the package function and design will evolve to a lesser extent. Although there will be new encapsulants optimized to take advantage of the mechanical flexibility and low temperature processing features of thin films, the reliability and life degradation stresses and mechanisms will remain mostly unchanged. Key reliability technologies in common between crystalline and thin film modules include hot spot heating, galvanic and electrochemical corrosion, hail impact stresses, glass breakage, mechanical fatigue, photothermal degradation of encapsulants, operating temperature, moisture sorption, circuit design strategies, product safety issues, and the process required to achieve a reliable product from a laboratory prototype.

Ross, R. G., Jr.↗

Compensation of reflector surface distortions using conjugate field matching

The feasibility of compensating for reflector surface distortions has been investigated. The performance characteristics (gain, sidelobe level, null location, beamwidth, etc.) of space communication reflector antenna systems degrade as the reflector surface distorts due to thermal effects from a varying solar flux. The technique reported here will maintain the design radiation performance independently of thermal effects on the reflector surface. With the advent of monolithic microwave integrated circuits (MMIC), a greater flexibility in array-fed reflector system design can be achieved. MMIC arrays provides independent control of amplitude and phase for each of many radiating elements of the feed array. The conjugate field matching technique provide a basis for obtaining the required element excitations under surface distortion for maintaining the design radiation performance. It is assumed that the surface characteristics (x, y, z, first derivatives, and second derivatives) under distortion are known.

Acosta, R. J.↗

Technology achievements and projections for communication satellites of the future

Multibeam systems of the future using monolithic microwave integrated circuits to provide phase control and power gain are contrasted with discrete microwave power amplifiers from 10 to 75 W and their associated waveguide feeds, phase shifters and power splitters. Challenging new enabling technology areas include advanced electrooptical control and signal feeds. Large scale MMIC's will be used incorporating on chip control interfaces, latching, and phase and amplitude control with power levels of a few watts each. Beam forming algorithms for 80 to 90 deg. wide angle scanning and precise beam forming under wide ranging environments will be required. Satelllite systems using these dynamically reconfigured multibeam antenna systems will demand greater degrees of beam interconnectivity. Multiband and multiservice users will be interconnected through the same space platform. Monolithic switching arrays operating over a wide range of RF and IF frequencies are contrasted with current IF switch technology implemented discretely. Size, weight, and performance improvements by an order of magnitude are projected.

Bagwell, J. W.↗