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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 163 records · Page 9
All sourcesNASA NTRSDOE OSTI
NASA NTRS2003

164-GHz MMIC HEMT Frequency Doubler

A monolithic microwave integrated circuit (MMIC) that includes a high-electron-mobility transistor (HEMT) has been developed as a prototype of improved frequency doublers for generating signals at frequencies greater than 100 GHz. Signal sources that operate in this frequency range are needed for a variety of applications, notably including general radiometry and, more specifically, radiometric remote sensing of the atmosphere. Heretofore, it has been common practice to use passive (diode-based) frequency multipliers to obtain frequencies greater than 100 GHz. Unfortunately, diode-based frequency multipliers are plagued by high DC power consumption and low conversion efficiency. Moreover, multiplier diodes are not easily integrated with such other multiplier-circuit components as amplifiers and oscillators. The goals of developing the present MMIC HEMT frequency doubler were (1) to utilize the HEMT as an amplifier to increase conversion efficiency (more precisely, to reduce conversion loss), thereby increasing the output power for a given DC power consumption or, equivalently, reducing the DC power consumption for a given output power; and (2) to provide for the integration of amplifier and oscillator components on the same chip. The MMIC frequency doubler (see Figure 1) contains an AlInAs/GaInAs/InP HEMT biased at pinch-off to make it function as a class-B amplifier (meaning that it conducts in half-cycle pulses). Grounded coplanar waveguides (GCPWs) are used as impedance-matching transmission lines. Air bridges are placed at discontinuities to suppress undesired slot electromagnetic modes. Another combination of GCPWs also serves both as a low-pass filter to suppress undesired oscillations at frequencies below 60 GHz and as a DC blocker. Large decoupling capacitors and epitaxial resistors are added in the drain and gate lines to suppress bias oscillations. At the output terminal, the fundamental frequency is suppressed by a quarter-wave open stub, which presents a short circuit at the fundamental frequency and an open circuit at the second harmonic. At an input power of 7 mW, the output power and conversion loss at an output frequency of 164 GHz were found to be 5 dBm (approximately equal to 3.2 mW) and 2 dB, respectively, with a 3-dB output-power bandwidth of 14 GHz. This is the best performance reported to date for an MMIC HEMT frequency doubler above 100 GHz.

Samoska, Lorene↗
NASA NTRS1983

Microwave monolithic integrated circuit development for future spaceborne phased array antennas

The development of fully monolithic gallium arsenide (GaAs) receive and transmit modules suitable for phased array antenna applications in the 30/20 gigahertz bands is presented. Specifications and various design approaches to achieve the design goals are described. Initial design and performance of submodules and associated active and passive components are presented. A tradeoff study summary is presented highlighting the advantages of distributed amplifier approach compared to the conventional single power source designs.

Anzic, G.↗
NASA NTRS1984

Microwave monolithic integrated circuit development for future spaceborne phased array antennas

The development of fully monolithic gallium arsenide (GaAs) receive and transmit modules suitable for phased array antenna applications in the 30/20 gigahertz bands is presented. Specifications and various design approaches to achieve the design goals are described. Initial design and performance of submodules and associated active and passive components are presented. A tradeoff study summary is presented, highlighting the advantages of a distributed amplifier approach compared to the conventional single power source designs. Previously announced in STAR as N84-13399

Anzic, G.↗
NASA NTRS1977

Report on phase 1 of the Microprocessor Seminar

Proceedings of a seminar on microprocessors and associated large scale integrated (LSI) circuits are presented. The potential for commonality of device requirements, candidate processes and mechanisms for qualifying candidate LSI technologies for high reliability applications, and specifications for testing and testability were among the topics discussed. Various programs and tentative plans of the participating organizations in the development of high reliability LSI circuits are given.

Source record↗
NASA NTRS1980

Photomask and pattern programs

Package of computer programs helps designers with layout and graphics of photomasks. Photomasks are specifically useful to applications involving fine reproducibility, repetition, and fabrication on planar surfaces of materials, items fabricated from photomasks include circuit boards, magnetic bubble devices and integrated optic circuits.

Kirschman, R. K.↗
NASA NTRSDate not supplied

Signal and Power Integrity Design Methodology for High-Performance Flight Computing Systems

Computing capabilities of space systems have in-creased onboard performance by orders of magnitude with the use of radiation-tolerant field-programmable gate arrays (FPGA)and processors. The incorporation of signal and power integrity analysis with printed circuit board (PCB) design in reliable computing architectures for space systems has become critical to enable future mission capabilities. Developers launch high-performance processors into a breadth of orbits and missions, running varying applications that create challenges for designing reliable computing hardware. Specifically, for these designs, academic and industry research has focused on component radiation performance, fault mitigation, and reliable architectures. How-ever, other design parameters including electromagnetic interference (EMI), PCB stackup, signal integrity (SI), voltage regulator module (VRM) design, and power distribution network (PDN)are often deprioritized or disregarded as the design matures. Since these characteristics are becoming more significant in high-performance processor designs, this research presents a hardware design and analysis methodology for high-performance, space-computing systems that focuses on a holistic design approach and PDN reliability. While these challenges exist across all space hardware, the reduced PCB dimensions imposed by SmallSats and CubeSats introduce additional hurdles, specifically to VRM and decoupling design. By examining the relationship between the PDN and radiation performance, an analytical relationship is developed that incorporates Total Ionizing Dose and Single-Event Transients to ensure reliability throughout the mission duration. The presented design methodology is applied to the SpaceCube v3.0 Mini, an FPGA-based on-board science data processing system developed at NASA Goddard Space Flight Center.

Advanced avionics↗
NASA NTRS1977

Microprocessor Seminar, phase 2

Workshop sessions and papers were devoted to various aspects of microprocessor and large scale integrated circuit technology. Presentations were made on advanced LSI developments for high reliability military and NASA applications. Microprocessor testing techniques were discussed, and test data were presented. High reliability procurement specifications were also discussed.

Scott, W. R.↗
NASA NTRS1990

Using advanced microelectronic test chips to qualify ASIC's for space

Qualification procedures for complex integrated circuits are being developed under a U.S. government program known as Qualified Manufacturing Lines (QML). This effort is focused on circuits designed by IC manufacturers and has not addressed application specific IC's (ASIC's) designed at system houses. The qualification procedures described here are intended to be responsive to the needs of system houses who design their own ASIC's and have them fabricated at Silicon foundries. A particular focus of this presentation will be the use of the TID (total Ionizing Dose) Chip to evaluate CMOS foundry processes and to provide parameters for circuit simulators. This chip is under development as a standard chip for qualifying the total dose aspects of ASIC's. The benefits of standardization are that the results will be well understood and easy to interpret. Data is presented and compared for 1.6 micron and 3.0 micron CMOS. The data shows that 1.6 micron CMOS is significantly harder than 3.0 micron CMOS. Two failure modes are explored: (1) the radiation-induced degradation of timing delays; and (2) radiation-induced leakage currents.

Buehler, M. G.↗
NASA NTRS1993

Solid-state Isotopic Power Source for Computer Memory Chips

Recent developments in materials technology now make it possible to fabricate nonthermal thin-film radioisotopic energy converters (REC) with a specific power of 24 W/kg and a 10 year working life at 5 to 10 watts. This creates applications never before possible, such as placing the power supply directly on integrated circuit chips. The efficiency of the REC is about 25 percent which is two to three times greater than the 6 to 8 percent capabilities of current thermoelectric systems. Radio isotopic energy converters have the potential to meet many future space power requirements for a wide variety of applications with less mass, better efficiency, and less total area than other power conversion options. These benefits result in significant dollar savings over the projected mission lifetime.

Brown, Paul M.↗
NASA NTRS2016

Photonic Integrated Circuit (PIC) Device Structures: Background, Fabrication Ecosystem, Relevance to Space Systems Applications, and Discussion of Related Radiation Effects

Electronic integrated circuits are considered one of the most significant technological advances of the 20th century, with demonstrated impact in their ability to incorporate successively higher numbers transistors and construct electronic devices onto a single CMOS chip. Photonic integrated circuits (PICs) exist as the optical analog to integrated circuits; however, in place of transistors, PICs consist of numerous scaled optical components, including such "building-block" structures as waveguides, MMIs, lasers, and optical ring resonators. The ability to construct electronic and photonic components on a single microsystems platform offers transformative potential for the development of technologies in fields including communications, biomedical device development, autonomous navigation, and chemical and atmospheric sensing. Developing on-chip systems that provide new avenues for integration and replacement of bulk optical and electro-optic components also reduces size, weight, power and cost (SWaP-C) limitations, which are important in the selection of instrumentation for specific flight projects. The number of applications currently emerging for complex photonics systems-particularly in data communications-warrants additional investigations when considering reliability for space systems development. This Body of Knowledge document seeks to provide an overview of existing integrated photonics architectures; the current state of design, development, and fabrication ecosystems in the United States and Europe; and potential space applications, with emphasis given to associated radiation effects and reliability.

Body of Knowledge (BOK)↗
NASA NTRS1995

The Impact on Space Radiation Requirements and Effects on ASIMS

The evolution of highly miniaturized electronic and mechanical systems will be accompanied by new problems and issues regarding the radiation response of these systems in the space environment. In this paper we discuss some of the more prominent radiation problems brought about by miniaturization. For example, autonomous micro-spacecraft will require large amounts of high density memory, most likely in the form of stacked, multichip modules of DRAM's, that must tolerate the radiation environment. However, advanced DRAM's (16 to 256 Mbit) are quite susceptible to radiation, particularly single event effects, and even exhibit new radiation phenomena that were not a problem for older, less dense memory chips. Another important trend in micro-spacecraft electronics is toward the use of low-voltage microelectronic systems that consume less power. However, the reduction in operating voltage also caries with it an increased susceptibility to radiation. In the case of application specific integrated microcircuits (ASIM's), advanced devices of this type, such as high density field programmable gate arrays (FPGA's) exhibit new single event effects (SEE), such as single particle reprogramming of anti-fuse links. New advanced bipolar circuits have been shown recently to degrade more rapidly in the low dose rate space environment than in the typical laboratory total dose radiation test used to qualify such devices. Thus total dose testing of these parts is no longer an appropriately conservative measure to be used for hardness assurance. We also note that the functionality of micromechanical Si-based devices may be altered due to the radiation-induced deposition of charge in the oxide passivation layers.

Barnes, C.↗
NASA NTRS1982

Application of MMIC modules in future multiple beam satellite antenna systems

Multiple beam antenna systems for advanced communication satellites operating in the 30/20 GHz frequency bands (30 GHz uplink, 20 GHz downlink) were developed. Up to twenty 0.3 deg HPBW fixed spot beams and six 0.3 deg HPBW scanning spot beams will be required. Array-fed dual reflector antenna systems in which monolithic microwave integrated circuit (MMIC) phase shift and amplifier modules are used with each radiating element of the feed array for beam pointing and power gain were developed. The feasibility of distributed power amplification and beam pointing with MMIC modules in the elements of an array and to develop a data base for future development were demonstrated. The technical discussion centers around the potential advantages of ""monolithic'' antennas for specific applications as compared to systems using high powered TWT's. These include: reduced losses in the beam forming network; advantage of space combining and graceful degradation; dynamic control of beam pointing and illumination contour; and possibilities for cost and weight reduction.

Smetana, J.↗
NASA NTRS2006

Single Event Effects Test Results for Advanced Field Programmable Gate Arrays

Reconfigurable Field Programmable Gate Arrays (FPGAs) from Altera and Actel and an FPGA-based quick-turnApplication Specific Integrated Circuit (ASIC) from Altera were subjected to single-event testing using heavy ions. Both Altera devices (Stratix II and HardCopy II) exhibited a low latchup threshold (below an LET of 3 MeV-cm2/mg) and thus are not recommended for applications in the space radiation environment. The flash-based Actel ProASIC Plus device did not exhibit latchup to an effective LET of 75 MeV-cm2/mg at room temperature. In addition, these tests did not show flash cell charge loss (upset) or retention damage. Upset characterization of the design-level flip-flops yielded an LET threshold below 10 MeV-cm2/mg and a high LET cross section of about lxlO-6 cm2/bit for storing ones and about lxl0-7 cm2/bit for storing zeros . Thus, the ProASIC device may be suitable for critical flight applications with appropriate triple modular redundancy mitigation techniques.

Field Programmable Gate Arrays↗
NASA NTRS1996

Compiled Data On Single-Event Effects Caused By Heavy Ions

Report presents test data on susceptibility of new set of digital integrated circuits and other semiconductor products to single-event effects (soft errors and latchups) caused by heavy ions incident at high energies. Data used to develop generalizations for protecting electronic equipment from single-event effects. In some cases, tested parts selected as candidates for use in specific applications.

Nichols, Donald K.↗
NASA NTRS2003

Microbatteries for Combinatorial Studies of Conventional Lithium-Ion Batteries

Integrated arrays of microscopic solid-state batteries have been demonstrated in a continuing effort to develop microscopic sources of power and of voltage reference circuits to be incorporated into low-power integrated circuits. Perhaps even more importantly, arrays of microscopic batteries can be fabricated and tested in combinatorial experiments directed toward optimization and discovery of battery materials. The value of the combinatorial approach to optimization and discovery has been proven in the optoelectronic, pharmaceutical, and bioengineering industries. Depending on the specific application, the combinatorial approach can involve the investigation of hundreds or even thousands of different combinations; hence, it is time-consuming and expensive to attempt to implement the combinatorial approach by building and testing full-size, discrete cells and batteries. The conception of microbattery arrays makes it practical to bring the advantages of the combinatorial approach to the development of batteries.

West, William↗
NASA NTRS1996

Micromachined Ion Accelerators

Proposed ion accelerators made by micromachining techniques. Advantages include small size and weight, modularity, and compatibility with integrated circuits. Used as sources of ion beams for industrial processes. Ion accelerator of this type combined with integrated electronic control and power circuitry, plus similarly miniaturized valves and other mechanisms for regulating flow of gas used to generate ions - all micromachined on single chip. Provides flexibility for tailoring characteristics of ion sources for specific applications; for example, construct array of many such devices to obtain large ion source or position multiple devices to obtain desired ion-beam pattern in processing chamber.

Brophy, John↗
NASA NTRS1993

Testing self-timed circuits using scan paths

Testing is an essential part of any digital system design and one that can be made much easier if testing is considered during the design process rather than after the system is complete. There are a number of techniques for integrating testability into system design, but many of these traditional testing methods used for synchronous circuits are not directly applicable to non-clocked asynchronous circuits. As a result, many asynchronous circuits do not employ design for testability techniques. A method of using the familiar model of scan paths modified to test self-timed systems are presented. Specifically, circuits designed using a library of self-timed modules to assemble systems with two-phase transition control and bundled data paths are considered. The method involves modifying these self-timed modules such that circuits designed from them have a built-in scan path.

Khoche, Ajay↗
NASA NTRS2016

Command and Data Handling Branch Internship

Modular Integrated Stackable Layers (MISL) is a computer system designed for simple, fast, and cost effective flexible reconfiguration in space environments such as the ISS and Orion projects for various uses. Existing applications include wireless and wired communications, data acquisition and instrumentation, and camera systems, and potential applications include bus protocol converters and subsystem control. MISL is based on Texas Instruments (TI)' MSP430 16-bit ultra-low-power microcontroller device. The purpose of my project was to integrate the MISL system with a liquid crystal display (LCD) touchscreen. The LCD, manufactured by Crystalfontz and part number CFAF320240F-035T-TS, is a 320 by 240 RGB resistive color screen including an optional carrier board. The vast majority of the project was done with Altium Designer, a tool for printed circuit board (PCB) schematic capture, 3D design, and FPGA (Field Programmable Gate Array) development. The new PCB was to allow the LCD to directly stack to the rest of MISL. Research was done with datasheets for the TI microcontroller and touchscreen display in order to meet desired hardware specifications. Documentation on prior MISL projects was also utilized. The initial step was to create a schematic for the LCD, power bus, and data bus connections between components. A layout was then designed with the required physical dimensions, routed traces and vias, power and ground planes, layer stacks, and other specified design rules such as plane clearance and hole size. Multiple consultation sessions were held with Hester Yim, the technical discipline lead for the Command and Data Handling Branch, and Christy Herring, the lead PCB layout designer in the Electronic Design and Manufacturing Branch in order to ensure proper configuration. At the moment, the PCB is awaiting revision by the latter-mentioned branch. Afterwards, the board will begin to undergo the manufacturing and testing process. Throughout the internship at Johnson Space Center, I gained several technical and professional skills. I gained proficiency in Altium Designer and experience using subversion clients, as well as knowledge in PSpice with OrCAD and battery design for spaceflight from on-site. I also gained networking, organization, and communication skills throughout meetings with coworkers and other interns. This internship at Johnson Space Center has impacted my future aspirations by further inspiring me to follow a career path into space rated engineering technology and human spaceflight applications. After graduation, I plan to attend graduate Modular Integrated Stackable Layers (MISL) is a computer system designed for simple, fast, and cost effective flexible reconfiguration in space environments such as the ISS and Orion projects for various uses. Existing applications include wireless and wired communications, data acquisition and instrumentation, and camera systems, and potential applications include bus protocol converters and subsystem control. MISL is based on Texas Instruments’ MSP430 16 bit ultra-low power microcontroller device. The purpose of my project was to integrate the MISL system with a liquid crystal display touchscreen. The LCD, manufactured by Crystalfontz and part number CFAF320240F-035T-TS, is a 320x240 RGB resistive color screen including an optional carrier board.The vast majority of the project was done with Altium Designer, a tool for printed circuit board (PCB) schematic capture, 3D design, and FPGA development. The new PCB was to allow the LCD to directly stack to the rest of MISL. Research was done with datasheets for the TI microcontroller and touchscreen display in order to meet desired hardware specifications. Documentation on prior MISL projects was also utilized. The initial step was to create a schematic for the LCD, power bus, and data bus connections between components. A layout was then designed with the required physical dimensions, routed traces and vias, power and ground planes, layer stacks, and other specified design rules such as plane clearance and hole size. Multiple consultation sessions were held with Hester Yim, the technical discipline lead for the Command and Data Handling Branch, and Christy Herring, the lead PCB layout designer in the Electronic Design and Manufacturing Branch in order to ensure proper configuration. At themoment, the PCB is awaiting revision by the latter-mentioned branch. Afterwards, the board will begin to undergo the manufacturing and testing process.Throughout the internship at Johnson Space Center, I gained several technical and professional skills. I gained proficiency in Altium Designer and experience using subversion clients, as well as knowledge in PSpice with OrCAD and battery design for spaceflight from on-site. I also gained networking, organization, and communication skills throughout meetings with coworkers and other interns. This internship at Johnson Space Center has impacted my future aspirations by further inspiring me to follow a career path into space rated engineering technology and human spaceflight applications. After graduation, I plan to attend graduate school for a master's or doctorate degree in electrical or computer engineering.

Billings, Rachel Mae↗