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NASA NTRS2008

MEMS Microshutter Array System for James Webb Space Telescope

A complex MEMS microshutter array system has been developed at NASA Goddard Space Flight Center (GSFC) for use as a multi-object aperture array for a Near-Infrared Spectrometer (NIRSpec). The NIRSpec is one of the four major instruments carried by the James Webb Space Telescope (JWST), the next generation of space telescope after the Hubble Space Telescope retires. The microshutter arrays (MSAs) are designed for the selective transmission of light with high efficiency and high contrast. It is demonstrated in Figure 1 how a MSA is used as a multiple object selector in deep space. The MSAs empower the NIRSpec instrument simultaneously collect spectra from more than 100 targets therefore increases the instrument efficiency 100 times or more. The MSA assembly is one of three major innovations on JWST and the first major MEMS devices serving observation missions in space. The MSA system developed at NASA GSFC is assembled with four quadrant fully addressable 365x171 shutter arrays that are actuated magnetically, latched and addressed electrostatically. As shown in Figure 2, each MSA is fabricated out of a 4' silicon-on-insulator (SOI) wafer using MEMS bulk-micromachining technology. Individual shutters are close-packed silicon nitride membranes with a pixel size close to 100x200 pm (Figure 3). Shutters are patterned with a torsion flexure permitting shutters to open 90 degrees with a minimized mechanical stress concentration. In order to prevent light leak, light shields are made on to the surrounding frame of each shutter to cover the gaps between the shutters and the Game (Figure 4). Micro-ribs and sub-micron bumps are tailored on hack walls and light shields, respectively, to prevent sticktion, shown in Figures 4 and 5. JWST instruments are required to operate at cryogenic temperatures as low as 35K, though they are to be subjected to various levels of ground tests at room temperature. The shutters should therefore maintain nearly flat in the entire temperature range between 35K and 300K. Through intensive numerical simulations and experimental studies, an optically opaque and electrically conductive metal-nitride thin film was selected as a coating material deposited on the shutters with the best thermal-expansion match to silicon nitride - the shutter blade thin film material. A shutter image shown in Figure 6 was taken at room temperature, presenting shutters slightly bowing down as expected. Shutters become flat when the temperature decreases to 35K. The MSAs are then bonded to silicon substrates that are fabricated out of 6" single-silicon wafers in the thickness of 2mm. The bonding is conducted using a novel single-sided indium flip-chip bonding technology. Indium bumps fabricated on a substrate are shown in Figure 7. There are 180,000 indium bumps for bonding a flight format MSA array to its substrate. Besides a MSA, each substrate houses five customer-designed ASIC (Application Specific Integrated Circuit) multiplexer/address chips for 2-dimensional addressing, twenty capacitors, two temperature sensors, numbers of resistors and all necessary interconnects, as shown in Figure 8. Complete MSA quadrant assemblies have been successfully manufactured and fully functionally tested. The assemblies have passed a series of critical reviews required by JWST in satisfying all the design specifications. The qualification tests cover programmable 2-D addressing, life tests, optical contrast tests, and environmental tests including radiation, vibration, and acoustic tests. A 2-D addressing pattern with 'ESA' letters programmed in a MSA is shown in Figure 9. The MSAs passed 1 million cycle life tests and achieved high optical contrast over 10,000. MSA teams are now making progress in final fabrication, testing and assembly (Figure 10). The delivery of flight-format MSA system is scheduled at the end of 2008 for being integrated to the focal plane of the NIRSpec detectors.

Li, Mary J.↗
NASA NTRS2007

Detector Arrays for the James Webb Space Telescope Near-Infrared Spectrograph

The James Webb Space Telescope's (JWST) Near Infrared Spectrograph (NIRSpec) incorporates two 5 micron cutoff (lambda(sub co) = 5 microns) 2048x2048 pixel Teledyne HgCdTe HAWAII-2RG sensor chip assemblies. These detector arrays, and the two Teledyne SIDECAR application specific integrated circuits that control them, are operated in space at T approx. 37 K. In this article, we provide a brief introduction to NIRSpec, its detector subsystem (DS), detector readout in the space radiation environment, and present a snapshot of the developmental status of the NIRSpec DS as integration and testing of the engineering test unit begins.

Rauscher, Bernard J.↗
NASA NTRS2008

James Webb Space Telescope Near-Infrared Spectrograph: Dark Performance of the First Flight Candidate Detector Arrays

The James Webb Space Telescope (JWST) Near Infrared Spectrograph (NIRSpec) incorporates two 5 micron cutoff (lambda(sub co) = 5 micron) 2048x2048 pixel Teledyne HgCdTe HAWAII-2RG sensor chip assemblies. These detector arrays, and the two Teledyne SIDECAR application specific integrated circuits that control them, are operated in space at T approx. 37 K. This article focuses on the measured performance of the first flight-candidate, and near-flight candidate, detector arrays. These are the first flight-packaged detector arrays that meet NIRSpec's challenging 6 e(-) rms total noise requirement.

Rauscher, Bernard J.↗
NASA NTRS2008

Replication of Space-Shuttle Computers in FPGAs and ASICs

A document discusses the replication of the functionality of the onboard space-shuttle general-purpose computers (GPCs) in field-programmable gate arrays (FPGAs) and application-specific integrated circuits (ASICs). The purpose of the replication effort is to enable utilization of proven space-shuttle flight software and software-development facilities to the extent possible during development of software for flight computers for a new generation of launch vehicles derived from the space shuttles. The replication involves specifying the instruction set of the central processing unit and the input/output processor (IOP) of the space-shuttle GPC in a hardware description language (HDL). The HDL is synthesized to form a "core" processor in an FPGA or, less preferably, in an ASIC. The core processor can be used to create a flight-control card to be inserted into a new avionics computer. The IOP of the GPC as implemented in the core processor could be designed to support data-bus protocols other than that of a multiplexer interface adapter (MIA) used in the space shuttle. Hence, a computer containing the core processor could be tailored to communicate via the space-shuttle GPC bus and/or one or more other buses.

Ferguson, Roscoe C.↗
NASA NTRS2008

Fault-Tolerant Coding for State Machines

Two reliable fault-tolerant coding schemes have been proposed for state machines that are used in field-programmable gate arrays and application-specific integrated circuits to implement sequential logic functions. The schemes apply to strings of bits in state registers, which are typically implemented in practice as assemblies of flip-flop circuits. If a single-event upset (SEU, a radiation-induced change in the bit in one flip-flop) occurs in a state register, the state machine that contains the register could go into an erroneous state or could hang, by which is meant that the machine could remain in undefined states indefinitely. The proposed fault-tolerant coding schemes are intended to prevent the state machine from going into an erroneous or hang state when an SEU occurs. To ensure reliability of the state machine, the coding scheme for bits in the state register must satisfy the following criteria: 1. All possible states are defined. 2. An SEU brings the state machine to a known state. 3. There is no possibility of a hang state. 4. No false state is entered. 5. An SEU exerts no effect on the state machine. Fault-tolerant coding schemes that have been commonly used include binary encoding and "one-hot" encoding. Binary encoding is the simplest state machine encoding and satisfies criteria 1 through 3 if all possible states are defined. Binary encoding is a binary count of the state machine number in sequence; the table represents an eight-state example. In one-hot encoding, N bits are used to represent N states: All except one of the bits in a string are 0, and the position of the 1 in the string represents the state. With proper circuit design, one-hot encoding can satisfy criteria 1 through 4. Unfortunately, the requirement to use N bits to represent N states makes one-hot coding inefficient.

Naegle, Stephanie Taft↗
NASA NTRS2007

Advanced High-Definition Video Cameras

A product line of high-definition color video cameras, now under development, offers a superior combination of desirable characteristics, including high frame rates, high resolutions, low power consumption, and compactness. Several of the cameras feature a 3,840 2,160-pixel format with progressive scanning at 30 frames per second. The power consumption of one of these cameras is about 25 W. The size of the camera, excluding the lens assembly, is 2 by 5 by 7 in. (about 5.1 by 12.7 by 17.8 cm). The aforementioned desirable characteristics are attained at relatively low cost, largely by utilizing digital processing in advanced field-programmable gate arrays (FPGAs) to perform all of the many functions (for example, color balance and contrast adjustments) of a professional color video camera. The processing is programmed in VHDL so that application-specific integrated circuits (ASICs) can be fabricated directly from the program. ["VHDL" signifies VHSIC Hardware Description Language C, a computing language used by the United States Department of Defense for describing, designing, and simulating very-high-speed integrated circuits (VHSICs).] The image-sensor and FPGA clock frequencies in these cameras have generally been much higher than those used in video cameras designed and manufactured elsewhere. Frequently, the outputs of these cameras are converted to other video-camera formats by use of pre- and post-filters.

Glenn, William↗
NASA NTRS2007

Improved On-Chip Measurement of Delay in an FPGA or ASIC

An improved design has been devised for on-chip-circuitry for measuring the delay through a chain of combinational logic elements in a field-programmable gate array (FPGA) or application-specific integrated circuit (ASIC). In the improved design, the delay chain does not include input and output buffers and is not configured as an oscillator. Instead, the delay chain is made part of the signal chain of an on-chip pulse generator. The duration of the pulse is measured on-chip and taken to equal the delay.

Chen, Yuan↗
NASA NTRS2010

Radiation-Hardened Solid-State Drive

A method is provided for a radiationhardened (rad-hard) solid-state drive for space mission memory applications by combining rad-hard and commercial off-the-shelf (COTS) non-volatile memories (NVMs) into a hybrid architecture. The architecture is controlled by a rad-hard ASIC (application specific integrated circuit) or a FPGA (field programmable gate array). Specific error handling and data management protocols are developed for use in a rad-hard environment. The rad-hard memories are smaller in overall memory density, but are used to control and manage radiation-induced errors in the main, and much larger density, non-rad-hard COTS memory devices. Small amounts of rad-hard memory are used as error buffers and temporary caches for radiation-induced errors in the large COTS memories. The rad-hard ASIC/FPGA implements a variety of error-handling protocols to manage these radiation-induced errors. The large COTS memory is triplicated for protection, and CRC-based counters are calculated for sub-areas in each COTS NVM array. These counters are stored in the rad-hard non-volatile memory. Through monitoring, rewriting, regeneration, triplication, and long-term storage, radiation-induced errors in the large NV memory are managed. The rad-hard ASIC/FPGA also interfaces with the external computer buses.

Sheldon, Douglas J.↗
NASA NTRS2010

Reconfigurable Hardware for Compressing Hyperspectral Image Data

High-speed, low-power, reconfigurable electronic hardware has been developed to implement ICER-3D, an algorithm for compressing hyperspectral-image data. The algorithm and parts thereof have been the topics of several NASA Tech Briefs articles, including Context Modeler for Wavelet Compression of Hyperspectral Images (NPO-43239) and ICER-3D Hyperspectral Image Compression Software (NPO-43238), which appear elsewhere in this issue of NASA Tech Briefs. As described in more detail in those articles, the algorithm includes three main subalgorithms: one for computing wavelet transforms, one for context modeling, and one for entropy encoding. For the purpose of designing the hardware, these subalgorithms are treated as modules to be implemented efficiently in field-programmable gate arrays (FPGAs). The design takes advantage of industry- standard, commercially available FPGAs. The implementation targets the Xilinx Virtex II pro architecture, which has embedded PowerPC processor cores with flexible on-chip bus architecture. It incorporates an efficient parallel and pipelined architecture to compress the three-dimensional image data. The design provides for internal buffering to minimize intensive input/output operations while making efficient use of offchip memory. The design is scalable in that the subalgorithms are implemented as independent hardware modules that can be combined in parallel to increase throughput. The on-chip processor manages the overall operation of the compression system, including execution of the top-level control functions as well as scheduling, initiating, and monitoring processes. The design prototype has been demonstrated to be capable of compressing hyperspectral data at a rate of 4.5 megasamples per second at a conservative clock frequency of 50 MHz, with a potential for substantially greater throughput at a higher clock frequency. The power consumption of the prototype is less than 6.5 W. The reconfigurability (by means of reprogramming) of the FPGAs makes it possible to effectively alter the design to some extent to satisfy different requirements without adding hardware. The implementation could be easily propagated to future FPGA generations and/or to custom application-specific integrated circuits.

Aranki, Nazeeh↗
NASA NTRS2009

Optimization of digital designs

An application specific integrated circuit is optimized by translating a first representation of its digital design to a second representation. The second representation includes multiple syntactic expressions that admit a representation of a higher-order function of base Boolean values. The syntactic expressions are manipulated to form a third representation of the digital design.

Whitaker, Sterling R.↗
NASA NTRS2006

Neuro-Prosthetic Implants With Adjustable Electrode Arrays

Brushlike arrays of electrodes packaged with application-specific integrated circuits (ASICs) are undergoing development for use as electronic implants especially as neuro-prosthetic devices that might be implanted in brains to detect weak electrical signals generated by neurons. These implants partly resemble the ones reported in Integrated Electrode Arrays for Neuro-Prosthetic Implants (NPO-21198), NASA Tech Briefs, Vol. 27, No. 2 (February 2003), page 48. The basic idea underlying both the present and previously reported implants is that the electrodes would pick up signals from neurons and the ASICs would amplify and otherwise preprocess the signals for monitoring by external equipment. The figure presents a simplified and partly schematic view of an implant according to the present concept. Whereas the electrodes in an implant according to the previously reported concept would be microscopic wires, the electrodes according to the present concept are in the form of microscopic needles. An even more important difference would be that, unlike the previously reported concept, the present concept calls for the inclusion of microelectromechanical actuators for adjusting the depth of penetration of the electrodes into brain tissue. The prototype implant now under construction includes an array of 100 electrodes and corresponding array of electrode contact pads formed on opposite faces of a plate fabricated by techniques that are established in the art of microelectromechanical systems (MEMS). A mixed-signal ASIC under construction at the time of reporting the information for this article will include 100 analog amplifier channels (one amplifier per electrode). On one face of the mixed-signal ASIC there will be a solder-bump/micro-pad array that will have the same pitch as that of the electrode array, and that will be used to make the electrical and mechanical connections between the electrode array and the ASIC. Once the electrode array and the ASIC are soldered together, the remaining empty space between them will be filled with a biocompatible epoxy, the remaining exposed portions of the ASIC will be covered with micromachined plates for protection against corrosive bodily fluids, and then the ASIC and its covering micromachined plates will be coated with parylene

Whitacre, Jay↗
NASA NTRS2011

RATIR: Reionization and Transients Infra-Red Camera. A New Instrument to Identify High Red-Shift GRBs

We are currently constructing the cryogenic infrared portion of the RATIR instrument at NASA's Goddard Space Flight Center (GSFC) in collaboration with University of California, Berkeley (UCB) and The University of Mexico (UNAM). The infrared instrument will consist of two 2048x2048 Hawaii 2RG detectors, one on axis and one off axis using diachronic. The detectors will be operated using state-of-the-art Teledyne SIDECAR (System Image, Digitizing, Enhancing, Controlling, And Retrieving) ASICs (Application- Specific Integrated Circuits) similar to NIRSpec on JWST. The visible portion of the instrument is currently being developed at UCB consisting of two CCD imagining cameras. Once completed, the two sections will be integrated into the RATIR instrument. Mounted on a dedicated, fully-automated 1.5-m telescope, the instrument will provide rapid (<10 min) identification of VHR GRBs allowing high-resolution spectroscopic follow-up observations with large aperture telescopes possible. The hosting Observatorio Astronomico Nacional of the Universidad Nacional Autonoma de Mexico (UNAM), located on the Sierra de San Pedro Martir in Baja California, Mexico, provides great seeing (-1 aresec), good weather, dark skies, and significant sky coverage so that RATIR will detect a significant number of Swift afterglows. While not all GRBs will be at high red shifts, the resulting light curves, combined with X-ray/UV observations, will address several open questions, including the nature of both "dark GRBs" and the GRB emission mechanism.

Rapchun, David A.↗
NASA NTRS2011

Small Microprocessor for ASIC or FPGA Implementation

A small microprocessor, suitable for use in applications in which high reliability is required, was designed to be implemented in either an application-specific integrated circuit (ASIC) or a field-programmable gate array (FPGA). The design is based on commercial microprocessor architecture, making it possible to use available software development tools and thereby to implement the microprocessor at relatively low cost. The design features enhancements, including trapping during execution of illegal instructions. The internal structure of the design yields relatively high performance, with a significant decrease, relative to other microprocessors that perform the same functions, in the number of microcycles needed to execute macroinstructions. The problem meant to be solved in designing this microprocessor was to provide a modest level of computational capability in a general-purpose processor while adding as little as possible to the power demand, size, and weight of a system into which the microprocessor would be incorporated. As designed, this microprocessor consumes very little power and occupies only a small portion of a typical modern ASIC or FPGA. The microprocessor operates at a rate of about 4 million instructions per second with clock frequency of 20 MHz.

Kleyner, Igor↗
NASA NTRS2005

CdZnTe Image Detectors for Hard-X-Ray Telescopes

Arrays of CdZnTe photodetectors and associated electronic circuitry have been built and tested in a continuing effort to develop focal-plane image sensor systems for hard-x-ray telescopes. Each array contains 24 by 44 pixels at a pitch of 498 m. The detector designs are optimized to obtain low power demand with high spectral resolution in the photon- energy range of 5 to 100 keV. More precisely, each detector array is a hybrid of a CdZnTe photodetector array and an application-specific integrated circuit (ASIC) containing an array of amplifiers in the same pixel pattern as that of the detectors. The array is fabricated on a single crystal of CdZnTe having dimensions of 23.6 by 12.9 by 2 mm. The detector-array cathode is a monolithic platinum contact. On the anode plane, the contact metal is patterned into the aforementioned pixel array, surrounded by a guard ring that is 1 mm wide on three sides and is 0.1 mm wide on the fourth side so that two such detector arrays can be placed side-by-side to form a roughly square sensor area with minimal dead area between them. Figure 1 shows two anode patterns. One pattern features larger pixel anode contacts, with a 30-m gap between them. The other pattern features smaller pixel anode contacts plus a contact for a shaping electrode in the form of a grid that separates all the pixels. In operation, the grid is held at a potential intermediate between the cathode and anode potentials to steer electric charges toward the anode in order to reduce the loss of charges in the inter-anode gaps. The CdZnTe photodetector array is mechanically and electrically connected to the ASIC (see Figure 2), either by use of indium bump bonds or by use of conductive epoxy bumps on the CdZnTe array joined to gold bumps on the ASIC. Hence, the output of each pixel detector is fed to its own amplifier chain.

Chen, C. M. Hubert↗
NASA NTRS2004

Parallel-Processing Equalizers for Multi-Gbps Communications

Architectures have been proposed for the design of frequency-domain least-mean-square complex equalizers that would be integral parts of parallel- processing digital receivers of multi-gigahertz radio signals and other quadrature-phase-shift-keying (QPSK) or 16-quadrature-amplitude-modulation (16-QAM) of data signals at rates of multiple gigabits per second. Equalizers as used here denotes receiver subsystems that compensate for distortions in the phase and frequency responses of the broad-band radio-frequency channels typically used to convey such signals. The proposed architectures are suitable for realization in very-large-scale integrated (VLSI) circuitry and, in particular, complementary metal oxide semiconductor (CMOS) application- specific integrated circuits (ASICs) operating at frequencies lower than modulation symbol rates. A digital receiver of the type to which the proposed architecture applies (see Figure 1) would include an analog-to-digital converter (A/D) operating at a rate, fs, of 4 samples per symbol period. To obtain the high speed necessary for sampling, the A/D and a 1:16 demultiplexer immediately following it would be constructed as GaAs integrated circuits. The parallel-processing circuitry downstream of the demultiplexer, including a demodulator followed by an equalizer, would operate at a rate of only fs/16 (in other words, at 1/4 of the symbol rate). The output from the equalizer would be four parallel streams of in-phase (I) and quadrature (Q) samples.

Gray, Andrew↗
NASA NTRS2003

Computer Program Recognizes Patterns in Time-Series Data

A computer program recognizes selected patterns in time-series data like digitized samples of seismic or electrophysiological signals. The program implements an artificial neural network (ANN) and a set of N clocks for the purpose of determining whether N or more instances of a certain waveform, W, occur within a given time interval, T. The ANN must be trained to recognize W in the incoming stream of data. The first time the ANN recognizes W, it sets clock 1 to count down from T to zero; the second time it recognizes W, it sets clock 2 to count down from T to zero, and so forth through the Nth instance. On the N + 1st instance, the cycle is repeated, starting with clock 1. If any clock has not reached zero when it is reset, then N instances of W have been detected within time T, and the program so indicates. The program can readily be encoded in a field-programmable gate array or an application-specific integrated circuit that could be used, for example, to detect electroencephalographic or electrocardiographic waveforms indicative of epileptic seizures or heart attacks, respectively.

Hand, Charles↗
NASA NTRS2003

Improved Autoassociative Neural Networks

Improved autoassociative neural networks, denoted nexi, have been proposed for use in controlling autonomous robots, including mobile exploratory robots of the biomorphic type. In comparison with conventional autoassociative neural networks, nexi would be more complex but more capable in that they could be trained to do more complex tasks. A nexus would use bit weights and simple arithmetic in a manner that would enable training and operation without a central processing unit, programs, weight registers, or large amounts of memory. Only a relatively small amount of memory (to hold the bit weights) and a simple logic application- specific integrated circuit would be needed. A description of autoassociative neural networks is prerequisite to a meaningful description of a nexus. An autoassociative network is a set of neurons that are completely connected in the sense that each neuron receives input from, and sends output to, all the other neurons. (In some instantiations, a neuron could also send output back to its own input terminal.) The state of a neuron is completely determined by the inner product of its inputs with weights associated with its input channel. Setting the weights sets the behavior of the network. The neurons of an autoassociative network are usually regarded as comprising a row or vector. Time is a quantized phenomenon for most autoassociative networks in the sense that time proceeds in discrete steps. At each time step, the row of neurons forms a pattern: some neurons are firing, some are not. Hence, the current state of an autoassociative network can be described with a single binary vector. As time goes by, the network changes the vector. Autoassociative networks move vectors over hyperspace landscapes of possibilities.

Hand, Charles↗
NASA NTRS2003

Command Interface ASIC - Analog Interface ASIC Chip Set

A command interface application-specific integrated circuit (ASIC) and an analog interface ASIC have been developed as a chip set for remote actuation and monitoring of a collection of switches, which can be used to control generic loads, pyrotechnic devices, and valves in a high-radiation environment. The command interface ASIC (CIA) can be used alone or in combination with the analog interface ASIC (AIA). Designed primarily for incorporation into spacecraft control systems, they are also suitable for use in high-radiation terrestrial environments (e.g., in nuclear power plants and facilities that process radioactive materials). The primary role of the CIA within a spacecraft or other power system is to provide a reconfigurable means of regulating the power bus, actuating all valves, firing all pyrotechnic devices, and controlling the switching of power to all switchable loads. The CIA is a mixed-signal (analog and digital) ASIC that includes an embedded microcontroller with supporting fault-tolerant switch control and monitoring circuitry that is capable of connecting to a redundant set of interintegrated circuit (I(sup 2)C) buses. Commands and telemetry requests are communicated to the CIA. Adherence to the I(sup 2)C bus standard helps to reduce development costs by facilitating the use of previously developed, commercially available components. The AIA is a mixed-signal ASIC that includes the analog circuitry needed to connect the CIA to a custom higher powered version of the I(sup 2)C bus. The higher-powered version is designed to enable operation with bus cables longer than those contemplated in the I(sup 2)C standard. If there are multiple higher-power I(sup 2)C-like buses, then there must an AIA between the CIA and each such bus. The AIA includes two identical interface blocks: one for the side-A I(sup 2)C clock and data buses and the other for the side B buses. All the AIAs on each side are powered from a common power converter module (PCM). Sides A and B of the I(sup 2)C buses are electrically isolated from each other (see figure). They are also isolated from the CIA by use of transformer coupling of signals between the AIA blocks and the CIA.

Ruiz, Baldes↗