Graphite Microstructural Characterization
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An absorber or desorber contains one or more micro-channels that have a 3-D structured heat-exchanging surface and a membrane on the microchannel situated distal to the 3-D structured heat-exchanging surface, where the membrane is permeable to a solvent of a solution employed in the absorber or desorber. The 3-D structured surface promotes mixing of hot and cold solution between the 3-D structured heat-exchanging surface and a vapor-exchanging surface proximal to the membrane. The mixing reduces the differences in concentration and temperature of the bulk solution and the solution at the vapor-exchanging surface to enhance the efficiency and rate of absorption or desorption of the solvent.
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According to one embodiment, a product includes an array of three dimensional structures, a cavity region between each of the three dimensional structures, and a first material in contact with at least one surface of each of the three dimensional structures. In addition, each of the three dimensional structures includes a semiconductor material, where at least one dimension of each of the three dimensional structures is in a range of about 0.5 microns to about 10 microns. Moreover, the first material is configured to provide high energy particle and/or ray emissions.
In a method of printing a transferable component, a stamp including an elastomeric post having three-dimensional relief features protruding from a surface thereof is pressed against a component on a donor substrate with a first pressure that is sufficient to mechanically deform the relief features and a region of the post between the relief features to contact the component over a first contact area. The stamp is retracted from the donor substrate such that the component is adhered to the stamp. The stamp including the component adhered thereto is pressed against a receiving substrate with a second pressure that is less than the first pressure to contact the component over a second contact area that is smaller than the first contact area. The stamp is then retracted from the receiving substrate to delaminate the component from the stamp and print the component onto the receiving substrate. Related apparatus and stamps are also discussed.
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Presented by LRST at PRiME 2020, 10/4
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