Results for “device operation” — Page 73

NASA NTRS2018

Low Power Radioisotope Conversion Technology and Performance Summary

This work presents a summary of low-power radioisotope-based power sources. This includes systems that use direct energy conversion from radioactive decay such as betavoltaics and systems that convert heat generated by the isotope decay. These types of power systems have terrestrial and space-based applications. Their main application is to provide low levels of power in remote environments where long life and reliability are the main objectives. This work looked at the potential performance of these types of systems and the range of output power they can achieve. Also considered was the amount of power that could be achieved from these different conversion technologies, while remaining under the critical limit acceptable for space flight without the need for special handling and controls. This is of interest for space missions where low power levels can be used for operating sensors or other devices, but the expense associated with the incorporation of radioactive material above this critical level would be cost prohibitive.

Colozza, Anthony J.↗

NASA NTRS2018

State of the Art: Small Spacecraft Technology

This report provides an overview of the current state-of-the-art of small spacecraft technology, with particular emphasis placed on the state-of-the-art of CubeSat-related technology. It was first commissioned by NASA’s Small Spacecraft Technology Program (SSTP) in mid-2013 in response to the rapid growth in interest in using small spacecraft for many types of missions in Earth orbit and beyond, and was revised in mid-2015 and 2018. This work was funded by the Space Technology Mission Directorate (STMD). For the sake of this assessment, small spacecraft are defined to be spacecraft with a mass less than 180 kg. This report provides a summary of the state-of-the-art for each of the following small spacecraft technology domains: Complete Spacecraft, Power, Propulsion, Guidance Navigation and Control, Structures, Materials and Mechanisms, Thermal Control, Command and Data Handling, Communications, Integration, Launch and Deployment, Ground Data Systems and Operations, and Passive Deorbit Devices.

Weston, Sasha↗

NASA NTRSDate not supplied

Mitigations Against Counterfeit Electronic Parts in NASA Missions

Traditionally, electronics used in NASA missions, especially ones that have a very low risk tolerance, have been restricted to using parts produced by manufacturers certified as “space qualified” by the Defense Logistics Agency (DLA). The numerous benefits of this requirement include a standard part numbering system, strict traceability requirements, the designing, manufacturing and testing of devices to ensure reliable operation, and a government agency to independently certify that all requirements are met. This system also has shortcomings that compel the use of commercial electronics, which in turn have their own benefits and shortcomings. Dr. Majewicz will give his perspective on risks due to the use of commercial electronics in flight hardware, specifically in relation to the counterfeit threat, and NASA programmatic requirements that reduce this risk.

counterfeit↗

NASA NTRSDate not supplied

Fluid & Thermal Analysis of a Manifold Microchannel Heat Sink

A three-dimensional (3-D) numerical model has been developed to study the fluid flow and heat transfer through a manifold-microchannel (MMC) heat sink, a microfluidic cooling system designed as a heat dissipation solution for compact, high-powered electronic systems. An MMC consists of a 3-D manifold structure that distributes working fluid through alternating inlet and outlet manifold channels that guide the fluid to and from the microchannels, shortening the flow length and thereby, reducing the pressure drop across the system. Wide bandgap semiconductors such as silicon carbide (SiC) are increasingly utilized due to their ability to enable smaller electronic devices and components to operate more efficiently at higher frequencies. These semiconductors can greatly benefit from the MMC, which can extract all the heat produced by compact, high-powered electronics, enabling them to achieve optimal performance. The MMC also utilizes an embedded cooling approach which allows for fabrication directly within SiC-based electronics, resulting in significant mass and weight savings and lower thermal resistance than conventional heat sink designs. This paper outlines the methods used to conduct fluid and thermal analysis of different MMC configurations for flow parameters such as flow rate and inlet flow conditions. This study involves both steady state and transient thermal analysis as a gradually increasing heat flux is applied to the system over time, which is representative of the heat dissipation from the electronics over a given period. Results from the analysis show that the MMC is capable of effectively dissipating heat flux of ~100 W/cm2 while maintaining considerably low pressure drop (< 1 kPa) and thermal resistance (< 1 K/W) for certain single-phase working fluids.

manifold microchannel↗

NASA NTRSDate not supplied

Fluid & Thermal Analysis of a Manifold Microchannel Heat Sink

A three-dimensional (3-D) numerical model has been developed to study the fluid flow and heat transfer through a manifold-microchannel (MMC) heat sink, a microfluidic cooling system designed as a heat dissipation solution for compact, high-powered electronic systems. An MMC consists of a 3-D manifold structure that distributes working fluid through alternating inlet and outlet manifold channels that guide the fluid to and from the microchannels, shortening the flow length and thereby, reducing the pressure drop across the system. Wide bandgap semiconductors such as silicon carbide (SiC) are increasingly utilized due to their ability to enable smaller electronic devices and components to operate more efficiently at higher frequencies. These semiconductors can greatly benefit from the MMC, which can extract all the heat produced by compact, high-powered electronics, enabling them to achieve optimal performance. The MMC also utilizes an embedded cooling approach which allows for fabrication directly within SiC-based electronics, resulting in significant mass and weight savings and lower thermal resistance than conventional heat sink designs. This paper outlines the methods used to conduct fluid and thermal analysis of different MMC configurations for flow parameters such as flow rate and inlet flow conditions. This study involves both steady state and transient thermal analysis as a gradually increasing heat flux is applied to the system over time, which is representative of the heat dissipation from the electronics over a given period. Results from the analysis show that the MMC is capable of effectively dissipating heat flux of ~100 W/cm2 while maintaining considerably low pressure drop (< 1 kPa) and thermal resistance (< 1 K/W) for certain single-phase working fluids.

manifold microchannel↗

DOE OSTI2020

Device for controlling additive manufacturing machinery

A computing device for controlling the operation of an additive manufacturing machine comprises a memory element and a processing element. The memory element is configured to store a three-dimensional model of a part to be manufactured, wherein the three-dimensional model defines a plurality of cross sections of the part. The processing element is in communication with the memory element. The processing element is configured to receive the three-dimensional model, determine a plurality of paths, each path including a plurality of parallel lines, determine a radiation beam power for each line, such that the radiation beam power varies non-linearly according to a length of the line, and determine a radiation beam scan speed for each line, such that the radiation beam scan speed is a function of a temperature of a material used to manufacture the part, the length of the line, and the radiation beam power for the line.

Barr, Christian↗

DOE OSTI2020

Device for controlling additive manufacturing machinery

A computing device for controlling the operation of an additive manufacturing machine comprises a memory element and a processing element. The memory element is configured to store a three-dimensional model of a part to be manufactured, wherein the three-dimensional model defines a plurality of cross sections of the part. The processing element is in communication with the memory element. The processing element is configured to receive the three-dimensional model, determine a path across a surface of each cross section, wherein the path includes a plurality of parallel lines, calculate a power for a radiation beam to scan each of the lines, such that the power varies from line to line non-linearly according to a length of the line, and calculate a scan speed for the radiation beam for each of the lines, such that the scan speed varies line to line non-linearly according to the power of the radiation beam.

Barr, Christian↗

DOE OSTI2020

Device for controlling additive manufacturing machinery

A computing device for controlling the operation of an additive manufacturing machine comprises a memory element and a processing element. The memory element is configured to store a three-dimensional model of a part to be manufactured, wherein the three-dimensional model defines a plurality of cross sections of the part. The processing element is in communication with the memory element. The processing element is configured to receive the three-dimensional model, determine a plurality of paths, each path including a plurality of parallel lines, determine a radiation beam power for each line, such that the radiation beam power varies non-linearly according to a length of the line, and determine a radiation beam scan speed for each line, such that the radiation beam scan speed is a function of a temperature of a material used to manufacture the part, the length of the line, and the radiation beam power for the line.

Barr, Christian↗

DOE OSTI2021

Development of Mission Profiles for Humidity Models in the Reliability Testing of PV Inverters: Preprint

To understand the impacts of humidity on PV inverters, mission profiles were developed to accurately describe the different processes and rates based on the environmental factors of temperature, relative humidity, and irradiance. The operating environment of the device introduces stress factors dependent on component temperature, relative humidity, and component voltage. The development of profiles started from looking at historical climate conditions at Cocoa, Florida, a hot and humid location. The profile developed from field location was compared with existing humidity test profiles in industrial and military standards to determine acceleration factors. Prior to the evaluation of the mission profiles, critical components in the PV inverter were identified based on vendor discussions along with failure modes of interest. The profiles considered in this study was demonstrated using a 4-kVA string inverter. The measurements from the devices were substituted in device manufacturer specified equation to determine the severity of each test. The severity of each test was compared against the severity of the 24-hour result to determine the acceleration factor of each test. The acceleration factors were determined to be over a range of 1.2-6 for the existing humidity tests from standards, when compared against the mission profile developed from field data. This optimal humidity/thermal profile will be passed to the IEC standards development for inverter qualification testing.

humidity models↗

DOE OSTI2021

SENSEI: Characterization of Single-Electron Events Using a Skipper-CCD

We use a science-grade Skipper Charge Coupled Device (Skipper-CCD) operating in a low-radiation background environment to develop a semi-empirical model that characterizes the origin of single-electron events in CCDs. We identify, separate, and quantify three independent contributions to the single-electron events, which were previously bundled together and classified as ``dark counts'': dark current, amplifier light, and spurious charge. We measure a dark current, which depends on exposure, of (5.89+-0.77)x10^-4 e-/pix/day, and an unprecedentedly low spurious charge contribution of (1.52+-0.07)x10^-4 e-/pix, which is exposure-independent. In addition, we provide a technique to study events produced by light emitted from the amplifier, which allows the detector's operation to be optimized to minimize this effect to a level below the dark-current contribution. Our accurate characterization of the single-electron events allows one to greatly extend the sensitivity of experiments searching for dark matter or coherent neutrino scattering. Moreover, an accurate understanding of the origin of single-electron events is critical to further progress in ongoing R&D efforts of Skipper and conventional CCDs.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

DOE OSTI2022

Achieving American Leadership in the Semiconductors Supply Chain Factsheet

Semiconductors are a keystone technology that are essential for the operation of every electronic device, including those that are critical to a clean energy economy. The semiconductor industry has a complex, competitive, and highly integrated international supply chain in which the United States has historically enjoyed a dominant position, but where this position has been eroding over time. In 1995, 26% of global semiconductor manufacturing capacity was located in the United States; this had decreased to 10% by 2020. Investments in key semiconductor manufacturing technologies such as high-voltage power electronics, energy-efficient conventional devices, and advanced packaging point the way to secure a strong domestic semiconductor industrial base.

Source record↗

DOE OSTI2022

Two-junction photovoltaic devices

The present disclosure relates to a photovoltaic (PV) device that includes a first junction constructed with a first alloy and having a bandgap between about 1.0 eV and about 1.5 eV, and a second junction constructed with a second alloy and having a bandgap between about 0.9 eV and about 1.3 eV, where the first alloy includes III-V elements, the second alloy includes III-V elements, and the PV device is configured to operate in a thermophotovoltaic system having an operating temperature between about 1500° C. and about 3000° C.

Steiner, Myles Aaron↗

DOE OSTI2023

Physical layer Authentication of Wired Networks (PAWN) Final Technical Report

Explore the source record for details and available documents.

97 MATHEMATICS AND COMPUTING↗

DOE OSTI2023

Two-junction photovoltaic devices

The present disclosure relates to a photovoltaic (PV) device that includes a first junction constructed with a first alloy and having a bandgap between about 1.0 eV and about 1.5 eV, and a second junction constructed with a second alloy and having a bandgap between about 0.9 eV and about 1.3 eV, where the first alloy includes III-V elements, the second alloy includes III-V elements, and the PV device is configured to operate in a thermophotovoltaic system having an operating temperature between about 1500° C. and about 3000° C.

Steiner, Myles Aaron↗

DOE OSTI2024

Two-junction photovoltaic devices

The present disclosure relates to a photovoltaic (PV) device that includes a first junction constructed with a first alloy and having a bandgap between about 1.0 eV and about 1.5 eV, and a second junction constructed with a second alloy and having a bandgap between about 0.9 eV and about 1.3 eV, where the first alloy includes III-V elements, the second alloy includes III-V elements, and the PV device is configured to operate in a thermophotovoltaic system having an operating temperature between about 1500° C. and about 3000° C.

Steiner, Myles Aaron↗

NASA NTRS1995

Nanoelectronics: Opportunities for future space applications

Further improvements in the performance of integrated electronics will eventually halt due to practical fundamental limits on our ability to downsize transistors and interconnect wiring. Avoiding these limits requires a revolutionary approach to switching device technology and computing architecture. Nanoelectronics, the technology of exploiting physics on the nanometer scale for computation and communication, attempts to avoid conventional limits by developing new approaches to switching, circuitry, and system integration. This presentation overviews the basic principles that operate on the nanometer scale that can be assembled into practical devices and circuits. Quantum resonant tunneling (RT) is used as the center-piece of the overview since RT devices already operate at high temperature (120 degrees C) and can be scaled, in principle, to a few nanometers in semiconductors. Near- and long-term applications of GaAs and silicon quantum devices are suggested for signal and information processing, memory, optoelectronics, and radio frequency (RF) communication.

Frazier, Gary↗

NASA NTRS2023

Single-Event Effects Test Report Linux Operating System Configurations on TUL PYNQ-Z2

This study was undertaken to determine the single-event functional interrupt (SEFI) susceptibility on different Linux operating system configurations. The device-under-test (DUT) was the Xilinx Zynq-7020 SoC on the TUL PYNQ-Z2 board. The device was monitored for kernel panics or hangs, classified as SEFIs, to observe any differences in the SEFI cross sections between operating system configurations. The primary purpose of this experiment was to observe if the number of drivers installed in a Linux system affects its overall execution reliability.

Seth S Roffe↗

NASA NTRS1990

Design of optimal correlation filters for hybrid vision systems

Research is underway at the NASA Johnson Space Center on the development of vision systems that recognize objects and estimate their position by processing their images. This is a crucial task in many space applications such as autonomous landing on Mars sites, satellite inspection and repair, and docking of space shuttle and space station. Currently available algorithms and hardware are too slow to be suitable for these tasks. Electronic digital hardware exhibits superior performance in computing and control; however, they take too much time to carry out important signal processing operations such as Fourier transformation of image data and calculation of correlation between two images. Fortunately, because of the inherent parallelism, optical devices can carry out these operations very fast, although they are not quite suitable for computation and control type operations. Hence, investigations are currently being conducted on the development of hybrid vision systems that utilize both optical techniques and digital processing jointly to carry out the object recognition tasks in real time. Algorithms for the design of optimal filters for use in hybrid vision systems were developed. Specifically, an algorithm was developed for the design of real-valued frequency plane correlation filters. Furthermore, research was also conducted on designing correlation filters optimal in the sense of providing maximum signal-to-nose ratio when noise is present in the detectors in the correlation plane. Algorithms were developed for the design of different types of optimal filters: complex filters, real-value filters, phase-only filters, ternary-valued filters, coupled filters. This report presents some of these algorithms in detail along with their derivations.

Rajan, Periasamy K.↗