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At least 127 records · Page 7

Technology Development and Design of a Hybrid Mars Ascent Vehicle Concept

Hybrid propulsion has been investigated as an enhancing technology for a Mars Ascent Vehicle (MAV) concept as part of potential Mars Sample Return (MSR) because of its high specific impulse, restartability, and the ability to operate and survive at extremely low temperatures. A new wax-based hybrid fuel formulation has been developed that could withstand the harsh and variable Mars environment protected solely by a minimal layer of passive insulation. This formulation could provide substantial energy savings for a notional lander and is critical for rover mobility. Preliminary thermal cycle testing has determined that the formulation can survive the expected temperature extremes and lifetime thermal testing is currently underway. A complete preliminary design using this new fuel formulation combined with a low temperature oxidizer such as Mixed Oxides of Nitrogen (MON30) is presented. Several key features associated with a complete hybrid MAV concept are investigated to determine their mission suitability (e.g. Thrust Vector Control and restartable ignition options). Potential challenges along a path towards developing such a system are outlined and future work is suggested as a means of technology maturation. The hybrid design presented here was the lowest Gross Lift Off Mass (GLOM) result of a 2015 Jet Propulsion Laboratory (JPL) led MAV concept study.

Karp, Ashley C.↗

Change of Exposure Time Mid-test in High Temperature DIC Measurement

Performing digital image correlation (DIC) at extreme temperatures has been greatly challenging due to the radiation which saturates the camera sensor. At such high temperatures, the light intensity emitted from an object is occasionally so powerful that the acquired images are overwhelmingly saturated. This induces data loss, potentially ruining the test, thus requiring the user to restart the test. For this reason, selection of an appropriate camera sensitivity plays a crucial role prior to beginning the test. Exposure time is a factor contributing to camera sensitivity and it is the easiest setting to manipulate during the test since it introduces minimal errors when comparing to other factors, especially in quasi-static tests. This paper examines the influence of changing exposure time mid-test on DIC measurement uncertainty. The investigation was conducted by rigid body motion experiments at room temperature and 1600 ◦C, respectively. Thereby, some recommendations are given to help DIC users assess their images at room temperature to extrapolate the exposure at extreme temperatures along with accompanying solutions to salvage data at high temperature.

Digital Image Correlation↗

Chemical and physical microenvironments at the Viking landing sites

Physical and chemical considerations permit the division of the near-surface regolith on Mars into at least six zones of distinct microenvironments. The zones are euphotic, duricrust/peds, tempofrost, permafrost, endolithic, and interfacial/transitional. Microenvironments vary significantly in temperature extremes, mean temperature, salt content, relative pressure of water vapor, UV and visible light irradiance, and exposure to ionizing radiation events (100 Mrad) and oxidative molecular species. From what is known of the chemistry of the atmosphere and regolith fines (soil), limits upon the aqueous chemistry of soil pastes may be estimated. Heat of wetting could reach 45 cal/g dry soil; initial pH is indeterminate between 1 and 10; ionic strength and salinity are predicted to be extremely high; freezing point depression is inadequate to provide quantities of liquid water except in special cases. The prospects for biotic survival are grim by terrestrial standards, but the extremes of biological resiliency are inaccessible to evaluation. Second-generation in situ experiments which will better define Martian microenvironments are clearly possible. Antarctic dry valleys are approximations to Martian conditions, but deviate significantly by at least half-a-dozen criteria.

Clark, B. C.↗

Data Transfer for Multiple Sensor Networks Over a Broad Temperature Range

At extreme temperatures, cryogenic and over 300 C, few electronic components are available to support intelligent data transfer over a common, linear combining medium. This innovation allows many sensors to operate on the same wire bus (or on the same airwaves or optical channel: any linearly combining medium), transmitting simultaneously, but individually recoverable at a node in a cooler part of the test area. This innovation has been demonstrated using room-temperature silicon microcircuits as proxy. The microcircuits have analog functionality comparable to componentry designed using silicon carbide. Given a common, linearly combining medium, multiple sending units may transmit information simultaneously. A listening node, using various techniques, can pick out the signal from a single sender, if it has unique qualities, e.g. a voice. The problem being solved is commonly referred to as the cocktail party problem. The human brain uses the cocktail party effect when it is able to recognize and follow a single conversation in a party full of talkers and other noise sources. High-temperature sensors have been used in silicon carbide electronic oscillator circuits. The frequency of the oscillator changes as a function of the changes in the sensed parameter, such as pressure. This change is analogous to changes in the pitch of a person s voice. The output of this oscillator and many others may be superimposed onto a single medium. This medium may be the power lines supplying current to the sensors, a third wire dedicated to data transmission, the airwaves through radio transmission, an optical medium, etc. However, with nothing to distinguish the identities of each source that is, the source separation this system is useless. Using digital electronic functions, unique codes or patterns are created and used to modulate the output of the sensor.

Krasowski, Michael↗

Performance Evaluation of High-Speed, Low-Side Gate Driver, FAN3122, over Extended Temperature Range

Emerging power metal-oxide semiconductor field-effect transistor (MOSFETs) based on silicon carbide and gallium nitride technology are finding widespread use in many electronic applications such as motor control and DC/DC converters due to their higher voltage, higher temperature tolerance, and higher frequency switching capabilities. To utilize these power devices and to meet circuit/system compactness, modularity, and operational functionality, gate drivers that provide unique attributes, such as fast switching and high-current handling capability, are needed. In addition, power systems geared for use in space mission applications require on-board devices to withstand exposure to extreme temperatures and wide thermal swings. Very little data, however, exist on the performance of such devices and circuits under extreme temperatures. In this work, the performance of a high-speed gate driver with potential use in controlling power-level transistors was evaluated under extreme temperatures and thermal cycling. The investigations were carried out to assess performance for potential use of this device in space exploration missions under extreme temperature conditions.

Wide Bandgap Semiconductors↗

Temperature-adaptive Circuits on Reconfigurable Analog Arrays

This paper describes a new reconfigurable analog array (MA) architecture and integrated circuit (IC) used to map analog circuits that can adapt to extreme temperatures under programmable control. Algorithm-driven adaptation takes place on the RAA IC. The algorithms are implemented in a separate Field Programmable Gate Array (FPGA) IC, co-located with the RAA in the extreme temperature environment. The experiments demonstrate circuit adaptation over a wide temperature range, from extremely low temperature of -180 C to high 120 C.

self recovery↗

Operation of Ultrafast, Low-Side MOSFET Driver, IXD609, over Wide Temperature Range

Electrical power and control systems designed for use in planetary exploration missions and deep space probes require electronics that are capable of efficient and reliable operation under extreme temperature conditions. In addition, space-based infrared satellites, all-electric ships, jet engines, electromagnetic launchers, magnetic levitation transport systems, and power facilities are also typical examples where system electronics are expected to be exposed to harsh temperatures and to operate under severe thermal swings. Most commercial-off-the-shelf (COTS) devices are not designed to function under such extreme conditions and very little data exist on their performance outside their specified range of operation. In this work, the performance of an ultrafast gate driver for controlling power-level transistors was evaluated under extreme temperatures and thermal cycling. The investigations were carried out to assess performance for potential use of this device in space exploration missions under extreme temperature conditions.

Boomer, Kristen↗

Flight Avionics Hardware Roadmap

The Avionics Technology Roadmap takes an 80% approach to technology investment in spacecraft avionics. It delineates a suite of technologies covering foundational, component, and subsystem-levels, which directly support 80% of future NASA space mission needs. The roadmap eschews high cost, limited utility technologies in favor of lower cost, and broadly applicable technologies with high return on investment. The roadmap is also phased to support future NASA mission needs and desires, with a view towards creating an optimized investment portfolio that matures specific, high impact technologies on a schedule that matches optimum insertion points of these technologies into NASA missions. The roadmap looks out over 15+ years and covers some 114 technologies, 58 of which are targeted for TRL6 within 5 years, with 23 additional technologies to be at TRL6 by 2020. Of that number, only a few are recommended for near term investment: 1. Rad Hard High Performance Computing 2. Extreme temperature capable electronics and packaging 3. RFID/SAW-based spacecraft sensors and instruments 4. Lightweight, low power 2D displays suitable for crewed missions 5. Radiation tolerant Graphics Processing Unit to drive crew displays 6. Distributed/reconfigurable, extreme temperature and radiation tolerant, spacecraft sensor controller and sensor modules 7. Spacecraft to spacecraft, long link data communication protocols 8. High performance and extreme temperature capable C&DH subsystem In addition, the roadmap team recommends several other activities that it believes are necessary to advance avionics technology across NASA: center dot Engage the OCT roadmap teams to coordinate avionics technology advances and infusion into these roadmaps and their mission set center dot Charter a team to develop a set of use cases for future avionics capabilities in order to decouple this roadmap from specific missions center dot Partner with the Software Steering Committee to coordinate computing hardware and software technology roadmaps and investment recommendations center dot Continue monitoring foundational technologies upon which future avionics technologies will be dependent, e.g., RHBD and COTS semiconductor technologies

Some, Raphael↗

Use of a Frequency Divider to Evaluate an SOI NAND Gate Device, Type CHT-7400, for Wide Temperature Applications

Frequency dividers constitute essential elements in designing phase-locked loop circuits and microwave systems. In addition, they are used in providing required clocking signals to microprocessors and can be utilized as digital counters. In some applications, particularly space missions, electronics are often exposed to extreme temperature conditions. Therefore, it is required that circuits designed for such applications incorporate electronic parts and devices that can tolerate and operate efficiently in harsh temperature environments. While present electronic circuits employ COTS (commercial-off- the-shelf) parts that necessitate and are supported with some form of thermal control systems to maintain adequate temperature for proper operation, it is highly desirable and beneficial if the thermal conditioning elements are eliminated. Amongst these benefits are: simpler system design, reduced weight and size, improved reliability, simpler maintenance, and reduced cost. Devices based on silicon-on-insulator (SOI) technology, which utilizes the addition of an insulation layer in the device structure to reduce leakage currents and to minimize parasitic junctions, are well suited for high temperatures due to reduced internal heating as compared to the conventional silicon devices, and less power consumption. In addition, SOI electronic integrated circuits display good tolerance to radiation by virtue of introducing barriers or lengthening the path for penetrating particles and/or providing a region for trapping incident ionization. The benefits of these parts make them suitable for use in deep space and planetary exploration missions where extreme temperatures and radiation are encountered. Although designed for high temperatures, very little data exist on the operation of SOI devices and circuits at cryogenic temperatures. In this work, the performance of a divide-by-two frequency divider circuit built using COTS SOI logic gates was evaluated over a wide temperature range and thermal cycling to determine suitability for use in space exploration missions and terrestrial fields under extreme temperature conditions.

Patterson, Richard L.↗

Evaluation of a High Temperature SOI Half-Bridge MOSFET Driver, Type CHT-HYPERION

Silicon-On-Insulator (SOI) technology utilizes the addition of an insulation layer in its structure to reduce leakage currents and to minimize parasitic junctions. As a result, SOIbased devices exhibit reduced internal heating as compared to the conventional silicon devices, consume less power, and can withstand higher operating temperatures. In addition, SOI electronic integrated circuits display good tolerance to radiation by virtue of introducing barriers or lengthening the path for penetrating particles and/or providing a region for trapping incident ionization. The benefits of these parts make them suitable for use in deep space and planetary exploration missions where extreme temperatures and radiation are encountered. Although designed for high temperatures, very little data exist on the operation of SOI devices and circuits at cryogenic temperatures. In this work, the performance of a commercial-off-the-shelf (COTS) SOI half-bridge driver integrated circuit was evaluated under extreme temperatures and thermal cycling. The investigations were carried out to establish a baseline on the functionality and to determine suitability of this device for use in space exploration missions under extreme temperature conditions.

Patterson, Richard↗

Negative extreme events in gross primary productivity and their drivers in China during the past three decades

Climate extremes have remarkable impacts on ecosystems and are expected to increase with future global warming. However, only few studies have focused on the ecological extreme events and their drivers in China. In this study, we carried out an analysis of negative extreme events in gross primary productivity (GPP) in China and the sub-regions during 1982–2015, using monthly GPP simulated by 12 process-based models (TRENDYv6) and an observation-based model (Yao-GPP). Extremes were defined as the negative 5th percentile of GPP anomalies, which were further merged into individual extreme events using a three-dimensional contiguous algorithm. Spatio-temporal patterns of negative GPP anomalies were analyzed by taking the 1000 largest extreme events into consideration. Results showed that the effects of extreme events decreased annual GPP by 2.8% (i.e. 208 TgC/year) in TRENDY models and 2.3% (i.e. 151 TgC/year) in Yao-GPP. Hotspots of extreme GPP deficits were mainly observed in North China (−53 gC/sq.m year) in TRENDY models and Northeast China (−42 gC/sq.m year) in Yao-GPP. For China as a whole, attribution analyses suggested that extreme low precipitation was associated with 40%–50% of extreme negative GPP events. Most events in northern and western China could be explained by meteorological droughts (i.e. low precipitation) while GPP extreme events in southern China were more associated with temperature extremes, in particular with cold spells. GPP was revealed to be much more sensitive to heat/drought than to cold/wet extreme events. Combined with projected changes in climate extremes in China, GPP negative anomalies caused by drought events in northern China and by temperature extremes in southern China might be more prominent in the future.

Climate change↗

Select Electronic Parts Operation at Extreme Low Temperature

The purpose of the study presented in this paper is to extend the test period of a selected set of electronics parts at cryogenic condition to dwell period of about 24 hours to demonstrate extreme cold operational capability of these components. The parts tested are tantalum polymer, BX and P90 type ceramic capacitors, thick film resistors, analog multiplexers, a digital inverter, and a D-flip-flop. These parts were tested to assist identifying candidate components that can be used for development of a cold capable telemetry board. There are several past investigations that have shown that COTS (commercial-off-the-shelf) capacitors and resistors tested at cryogenic temperatures and frequencies up to 10MHz did not exhibit significant changes in capacitance and resistance values. Also, there are several test results for active parts. These past tests collected measurements during a temperature sweep from room temperature down to cryogenic temperature with very short dwell time at cryogenic temperature, and back to room temperature. This study extends the operational dwell time to at least 24 hours and returning to room temperature operation without significant degradation in performance, thus, demonstrating the potential for longer dwell time in actual operation in these extreme cold temperatures and a method for identifying the cold operability.

Ashtijou, Mohammad↗

Use of Mechanical Heat Switch to Speed up TVAC Transitions on Flight Hardware Below 200K

Spaceflight hardware that operates at temperatures well below room temperature usually require being well isolated from their warmer environment in order to manage thermal parasitics adequately. This is especially true for spaceflight systems that rely on passive cooling such as a radiator. During ground testing, this design configuration can be problematic for TVAC cycling between operational temperature extremes, since the hardware temperatures may move extremely slowly and lengthen the duration of an already expensive and heavily staffed system-level TVAC campaign. One of the challenges of using an external means of speeding up temperature transitions is that a TVAC campaign usually also requires the simulation of flight-like environments to validate the design, and introducing a test feature to speed up transitions can disrupt the system such that flight-like environments are not achievable. Such an approach was used for the L’Ralph instrument level TVAC test. L’Ralph is a passively cooled instrument on the Lucy mission with planned flyby’s of the Trojan asteroids around 5.5 AU. The optics and visible detector are cooled below 190K, and the IR detector is cooled below 110K. During instrument TVAC qualification testing, a mechanical motor-controlled heat switch uses clamping pressure via a vise-grip mechanism to achieve faster temperature transitions by increasing the conduction to a cold sink. The heat switch system then disengages and employs zero-Q controls to achieve flight-like thermal environments for thermal balance plateaus. Results from stand-alone testing of the heat switch are discussed, including correlated on/off ratios and the expected conductance across its operational temperature range. Test data from an instrument level TVAC that successfully utilized the heat switch are also shown.

Daniel G Bae↗

Silicon Carbide Sensors and Electronics for Harsh Environment Applications

Silicon carbide (SiC) semiconductor has been studied for electronic and sensing applications in extreme environment (high temperature, extreme vibration, harsh chemical media, and high radiation) that is beyond the capability of conventional semiconductors such as silicon. This is due to its near inert chemistry, superior thermomechanical and electronic properties that include high breakdown voltage and wide bandgap. An overview of SiC sensors and electronics work ongoing at NASA Glenn Research Center (NASA GRC) will be presented. The main focus will be two technologies currently being investigated: 1) harsh environment SiC pressure transducers and 2) high temperature SiC electronics. Work highlighted will include the design, fabrication, and application of SiC sensors and electronics, with recent advancements in state-of-the-art discussed as well. These combined technologies are studied for the goal of developing advanced capabilities for measurement and control of aeropropulsion systems, as well as enhancing tools for exploration systems.

Evans, Laura J.↗

Electronic assembly thermal testing - Dwell/duration/cycling

Testing of electronic assemblies varies throughout industry, NASA, and the military. Differences include test levels, atmospheric versus vacuum testing of assemblies, dwell durations at temperature extremes (especially high temperature), and thermal cycling versus dwell testing. Of particular interest are the different philosophies of thermal cycling versus single-cycle thermal dwell. An examination of the various failure physics for electronic assemblies has been initiated at JPL. The intent is to determine which failure modes are best revealed by thermal cycling testing and which are susceptible to high-temperature dwell physics. Preliminary results of this study are presented, along with discussions of testing goals, flight environments, reliability models, and the differences between industry and JPL design/test approaches.

Gibbel, Mark↗

Development of a Temperature Sensor for Jet Engine and Space Mission Applications

Electronics for Distributed Turbine Engine Control and Space Exploration Missions are expected to encounter extreme temperatures and wide thermal swings. In particular, circuits deployed in a jet engine compartment are likely to be exposed to temperatures well exceeding 150 C. To meet this requirement, efforts exist at the NASA Glenn Research Center (GRC), in support of the Fundamental Aeronautics Program/Subsonic Fixed Wing Project, to develop temperature sensors geared for use in high temperature environments. The sensor and associated circuitry need to be located in the engine compartment under distributed control architecture to simplify system design, improve reliability, and ease signal multiplexing. Several circuits were designed using commercial-off-the-shelf as well as newly-developed components to perform temperature sensing at high temperatures. The temperature-sensing circuits will be described along with the results pertaining to their performance under extreme temperature.

Patterson, Richard L.↗