Electronic assembly thermal testing - Dwell/duration/cycling

Abstract

Testing of electronic assemblies varies throughout industry, NASA, and the military. Differences include test levels, atmospheric versus vacuum testing of assemblies, dwell durations at temperature extremes (especially high temperature), and thermal cycling versus dwell testing. Of particular interest are the different philosophies of thermal cycling versus single-cycle thermal dwell. An examination of the various failure physics for electronic assemblies has been initiated at JPL. The intent is to determine which failure modes are best revealed by thermal cycling testing and which are susceptible to high-temperature dwell physics. Preliminary results of this study are presented, along with discussions of testing goals, flight environments, reliability models, and the differences between industry and JPL design/test approaches.