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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Presentation containing an update for the Power Electronics Thermal Management project in the Electric Drive Train task funded by the Vehicle Technology Office of DOE. This presentation outlines the purpose, plan, and results of research thus far for cooling and material selection strategies to manage heat in power electronic assemblies such as inverters, converters, and chargers.
It is recognized that standing wave effects appearing in large-area, very-high-frequency capacitively coupled plasma (CCP) reactors cause center-high plasma non-uniformity. Using a high-frequency magnetic probe, we present a direct experimental diagnostic of the nonlinear standing waves and bulk ohmic electron power absorption dynamics in low pressure CCP discharges for different driving frequencies of 13.56, 30, and 60 MHz. The design, principle, calibration, and validation of the probe are described in detail. Spatial structures of the harmonics of the magnetic field, determined by the magnetic probe, were used to calculate the distributions of the harmonic current and the corresponding ohmic electron power deposition, providing insights into the behavior of nonlinear harmonics. At a low driving frequency, i.e. 13.56 MHz, no remarkable nonlinear standing waves were identified and the bulk ohmic electron power absorption was observed to be negligible. Here, the harmonic magnetic field/current was found to increase dramatically with the driving frequency, due to decreased sheath reactance and more remarkable nonlinear standing waves at a higher driving frequency, leading to the enhancements of the ohmic heating and the plasma density in the bulk, specifically at the electrode center. At a high driving frequency, i.e. 60 MHz, the high-order harmonic current density and the corresponding ohmic electron power absorption exhibited a similar node structure, with the main peak on axis, and one or more minor peaks between the electrode center and the edge, contributing to the center-high profile of the plasma density.
During the past decade, Gallium Oxide (Ga2O3) has attracted intensive research interest as an ultra-wide-bandgap (UWBG) semiconductor due to its unique characteristics, such as a large bandgap of 4.5–4.9 eV, a high critical electric field of ~8 MV/cm, and a high Baliga’s figure of merit (BFOM). Unipolar β-Ga2O3 devices such as Schottky barrier diodes (SBDs) and field-effect transistors (FETs) have been demonstrated. Recently, there has been growing attention toward developing β-Ga2O3-based heterostructures and heterojunctions, which is mainly driven by the lack of p-type doping and the exploration of multidimensional device architectures to enhance power electronics’ performance. This paper will review the most recent advances in β-Ga2O3 heterostructures and heterojunctions for power electronics, including NiOx/β-Ga2O3, β-(AlxGa1−x)2O3/β-Ga2O3, and β-Ga2O3 heterojunctions/heterostructures with other wide- and ultra-wide-bandgap materials and the integration of two-dimensional (2D) materials with β-Ga2O3. Discussions of the deposition, fabrication, and operating principles of these heterostructures and heterojunctions and the associated device performance will be provided. This comprehensive review will serve as a critical reference for researchers engaged in materials science, wide- and ultra-wide-bandgap semiconductors, and power electronics and benefits the future study and development of β-Ga2O3-based heterostructures and heterojunctions and associated power electronics.
This paper describes the design and performance of a dielectric fluid cooling concept for automotive power electronics. The concept combines a low-thermal-resistance package (which eliminates metalized ceramic substrates) with a high-performance convective cooling strategy (slot jets impinging on finned surfaces). Modeling was first used to design the cooling system to maximize thermal performance and minimize pumping power. Additionally, a prototype was then fabricated, and experiments were conducted to validate the model predictions using three fluids at various fluid flow rates (16.7 cm 3 /s [1 L/min] to 68.3 cm 3 /s [4.1 L/min]) and inlet temperatures (30C and 70C). The final design was compact (120-cm 3 total volume, including heat exchanger and conceptual power modules) and cooled 12 devices (e.g., silicon carbide). The validated model was then used to predict the junction-to-fluid thermal resistance and pumping power for various conditions, including 40C fluid temperature. The results predict thermal resistance values as low as 19 mm 2 K/W are possible using the dielectric fluid cooling approach. The dielectric fluid cooling system is predicted to provide thermal resistance and pumping power values that are approximately 56% and 90% lower, respectively, compared to an automotive power electronics cooling system.
This project conducts research to develop new power electronics thermal management technologies to increase power density, enable high WBG temperature operation, and decrease cost. One of the main challenges to achieving high power densities is associated with packaging of high-temperature (250°C) WBG devices near lower-temperature-rated components (e.g., electrical boards and capacitors). Additionally, the high junction temperatures of the WBG devices will result in large temperature gradients through the power module layers that will present reliability challenges and require higher-temperature substrates and bonding materials.
This project conducts research to develop new power electronics thermal management technologies to increase power density, enable high WBG temperature operation, and decrease cost. One of the main challenges to achieving high power densities is associated with packaging of high-temperature (up to 250 degrees C) WBG devices near lower-temperature-rated components (e.g., electrical boards and capacitors). Additionally, the high junction temperatures of the WBG devices will result in large temperature gradients through the power module layers, which will present reliability challenges and require higher-temperature substrates and bonding materials.
The Marel Power Solutions project, funded by the U.S. Department of Energy under Award DE-SC0023801, focused on advancing manufacturing techniques for power electronics in heavy-duty fuel cell vehicles. The research aimed to enhance system efficiency, reduce costs, and support broader adoption of hydrogen fuel cell technology. Key areas of investigation included power topology, thermal modeling, system architecture, and accessibility through software tools. Key Accomplishments: 1. Power Topology: - Developed an interleaved boost converter with optimized phase count, leveraging Marel’s proprietary Power Stacks. - Achieved reduced parasitic inductance and resistance, enabling high efficiency in DC-DC converters. 2. Thermal Modeling: - Integrated innovative cooling systems into compact Silicon Carbide (SiC) modules. - Simulations demonstrated the ability to dissipate significant heat (up to 7.5 kW), ensuring device reliability under heavy loads. 3. System Architecture: - Utilized simulation tools to analyze the impact of various fuel cell and vehicle parameters on efficiency. - Highlighted the role of smaller, modular improvements, such as enhanced DC-DC converters, in achieving system-wide gains. 4. Accessibility: - Evaluated and implemented MATLAB/Simulink code generation tools for real-world hardware applications. - Demonstrated the potential for rapid prototyping of custom power systems with reduced development costs. Impact and Benefits: - Efficiency and Cost Reduction: Marel’s cooling technology enhances SiC die performance, reducing the number of dies required and overall system size. - Scalability and Flexibility: The innovations support tailored solutions for diverse applications, from mass transit to mining vehicles. - Sustainability: The research promotes the integration of electrification technologies, helping meet rising energy demands sustainably. Conclusion: The project’s outcomes advance the state of power electronics for hydrogen fuel cell vehicles, enabling more efficient, compact, and cost-effective solutions. These developments lay a foundation for future innovation, contributing to the broader adoption of clean energy technologies in transportation and other industries.
The future of electrification of vehicles and other systems will require the creation of high-power density power electronics with low junction-to-fluid thermal resistance cooling solutions. One way to create this solution is to move high-heat-flux liquid cooling (single- or two-phase) as close to the power electronics components as possible. One novel approach involves submersion in dielectric fluids as the cooling solution. We first provide the range of fluid properties and develop a figure of merit (FOM) to aid in dielectric fluid selection. Next, we perform computational fluid dynamics/heat transfer (CFD/HT) modeling using single-phase cooling (submerged jet impingement on an enhanced surface) to validate the dielectric fluid FOM. Results of the study show that the developed FOM is a good representation of the performance of the fluids when compared to the results of the CFD/HT analysis. Both FOM and the CFD/HT analysis show that based on pure thermohydraulic considerations, several commercially available fluids present higher performance, on the order of 5% of water. Finally, the FOM can be used to quickly assess the thermohydraulic performance of a dielectric fluid, as well as the secondary application-specific properties such as boiling point, saturation pressure, flash point, and global warming potential, thereby allowing for fluid candidates to be readily compared.
As power electronic systems (PESs) grow increasingly complex, integrating and testing these systems in the development stages is becoming more crucial and more challenging. New modes and resource integration strategies are in development and must be tested before pilot demonstrations and mass production. This paper proposes a framework for testing of PES technologies including early validation with integration of simulated resources. The framework is demonstrated to work in two example configurations as proof of principle.
With recent advances in the state-of-the-art of power electronic devices, packaging has become one of the critical factors limiting the performance and durability of power electronics. To this end, this study investigates the feasibility of a novel integrated package assembly, which consists of copper circuit layer on an aluminum nitride (AlN) dielectric layer that is bonded to an aluminum silicon carbide (AlSiC) substrate. The entire assembly possesses a low coefficient of thermal expansion (CTE) mismatch which aids in the thermal cycling reliability of the structure. The new assembly can serve as a replacement for the conventionally used direct bonded copper (DBC) - Cu base plate - Al heat sink assembly. While improvements in thermal cycling stability of more than a factor of 18 has been demonstrated, the use of AlSiC can result in increased thermal resistance when compared to thick copper heat spreaders. To address this issue, we demonstrate that the integration of single phase liquid cooling in the AlSiC layer can result in improved thermal performance, matching that of copper heat spreading layers. This is aided by the use of heat transfer enhancement features built into the AlSiC layer. It is found that, for a given pumping power and through analytical optimization of geometries, either microchannels, pin fins and jets can be designed to yield a heat transfer coefficients of up to 65000 W m -2 K -1 , which can result in competitive device temperatures as Cu-baseplate designs, but with added reliability.
Recent advances in wide band-gap (WBG) semiconductor materials, such as silicon carbide (SiC) and gallium nitride (GaN) are enabling a new generation of power semiconductor devices that far exceed the performance of silicon-based devices. Past ARPA-E programs (ADEPT, Solar ADEPT, and SWITCHES) have enabled innovations throughout the power electronics value chain, especially in the area of WBG semiconductors. The two recently launched programs by ARPA-E (CIRCUITS and PNDIODES) continue to investigate the use of WBG semiconductors in power electronics. From materials and devices to modules and circuits to application-ready systems integration, ARPA-E projects have demonstrated the potential of WBG semiconductors to lower the cost of high-efficiency power electronics to enable broad adoption in energy applications.
New power control technologies, such as smart power (SP) and power integrated circuits (PICs), are being developed to decrease cost and increase performance of photovoltaic power arrays.
In the presence of partial shading and other mismatch factors, bypass diodes may not offer complete elimination of excessive power dissipation due to cell reverse biasing, commonly referred to as hot-spotting in photovoltaic (PV) systems. As a result, PV systems may experience higher failure rates and accelerated ageing. In this paper, a cell-level simulation model is used to assess occurrence of hot-spotting events in a representative residential rooftop system scenario featuring a moderate shading environment. The approach is further used to examine how well distributed power electronics converters mitigate the effects of partial shading and other sources of mismatch by preventing activation of bypass diodes and thereby reducing the chances of heavy power dissipation and hot-spotting in mismatched cells. The simulation results confirm that the occurrence of heavy power dissipation is reduced in all distributed power electronics architectures, and that submodule-level converters offer nearly 100% mitigation of hot-spotting. In addition, the paper further elaborates on the possibility of hot-spot-induced permanent damage, predicting a lifetime energy loss above 15%. In conclusion, this energy loss is fully recoverable with submodule-level power converters that mitigate hot-spotting and prevent the damage.
The 2017 Electrical and Electronics Technical Team Roadmap [1] proposes aggressive research and development targets aimed at improving power electronics technology to enable the mass-market penetration of electric-drive vehicles. Achieving these aggressive targets will require a decrease in cost (year 2025 cost target: $2.70/kW) and an increase in power density (year 2025 power density target: 100 kW/L) as compared with current on-road technology. Replacing traditional silicon device-based components with more efficient and higher-temperature wide-bandgap (WBG) semiconductor device-based components will enable increased power density. However, meeting the power density target will also require innovative thermal management solutions to increase the heat fluxes dissipated and allow for compact electronics packaging. This project conducts research to develop new power electronics thermal management technologies to increase power density, enable high WBG temperature operation, and decrease cost. The performance (e.g., thermal resistance, pumping power) of the power electronics cooling technologies developed in this project are compared to the performance of current, on-road technology. One of the main challenges to achieving high power densities is associated with packaging high-temperature (up to 250 degrees C) WBG devices near lower-temperature-rated components (e.g., electrical boards and capacitors).
This project developed and demonstrated a new power electronics technology for electric vehicle drivetrains, that achieved significant improvements in power density and efficiency over standard drive cycles, relative to the commercial state of the art. In particular, the prototype measured loss and efficiency curves demonstrated a reduction in total loss over the US EPA US06 drive cycle by a factor of four. Similar reductions are observed for urban (UDDS) and highway (HWFET) drive cycles. Further, the project demonstrated a significant reduction in the total film capacitor requirements, by over an order of magnitude; this was achieved through fundamental improvements in converter circuit topologies. These nonincremental technology advances can lead to significant improvements in temperature rise, reliability, cost, and cooling system size and weight. These results were achieved through a new proposed composite converter architecture, and were demonstrated in a boost-type system similar to that employed by Toyota, Ford, and Honda. A 30 kW silicon prototype achieved a US06 average efficiency of 97.5%, which represents a reduction in average loss by a factor of approximately four relative to the 92.5% average efficiency of the commercial state of the art. A silicon carbide prototype achieved similar efficiency, while also achieving power densities of 23 kW/L (volumetric) and 20 kW/kg (gravimetric) in a boost dc-dc system including magnetics and film capacitors. This was achieved with a SiC switching frequency of 240 kHz, which allowed employment of planar magnetics. These power densities are roughly four times better than the commercial state of the art, and significantly exceed the DOE APEEM 2020 goals. In addition to the composite boost system, a SiC inverter was demonstrated at the 800 V 30 kW level. This inverter was demonstrated driving a permanent magnet machine over the US 06 drive cycle. The replacement of 1200 V Si IGBTs with 1200 V SiC MOSFETs led to improvement of CAFE average efficiency from 98.7% to 99.5%, which corresponds to a reduction of average loss by a factor of approximately two. The modular nature of the composite converter architecture opens the possibility of reuse of one or more converter modules during charging operations, providing a path for onboard charging capability at significant power levels while significantly reducing the volume and weight of the added charger module. This project demonstrated an integrated Level II charger whose add-on specific weight was approximately four times better than the DOE PHEV charger 2022 targets.
Here, in this article, a broad overview of the current research trends in power-electronic innovations in cyber–physical systems (CPSs) is presented. The recent advances in semiconductor device technologies, control architectures, and communication methodologies have enabled researchers to develop integrated smart CPSs that can cater to the emerging requirements of smart grids, renewable energy, electric vehicles, trains, ships, the Internet of Things (IoT), and so on. The topics presented in this article include novel power-distribution architectures, protection techniques considering large renewable integration in smart grids, wireless charging in electric vehicles, simultaneous power and information transmission, multihop network-based coordination, power technologies for renewable energy and smart transformer, CPS reliability, transactive smart railway grid, and real-time simulation of shipboard power systems. It is anticipated that the research trends presented in this article will provide a timely and useful overview to the power-electronics researchers with broad applications in CPSs.
Russian electric propulsion technologies have recently become available on the world market. Of significant interest is the Stationary Plasma Thruster (SPT) which has a significant flight heritage in the former Soviet space program. The SPT has performance levels of up to 1600 seconds of specific impulse at a thrust efficiency of 0.50. Studies have shown that this level of performance is well suited for stationkeeping applications, and the SPT-100, with a 1.35 kW input power level, is presently being evaluated for use on Western commercial satellites. Under a program sponsored by the Innovative Science and Technology Division of the Ballistic Missile Defense Organization, a team of U.S. electric propulsion specialists observed the operation of the SPT-100 in Russia. Under this same program, power electronics were developed to operate the SPT-100 to characterize thruster performance and operation in the U.S. The power electronics consisted of a discharge, cathode heater, and pulse igniter power supplies to operate the thruster with manual flow control. A Russian designed matching network was incorporated in the discharge supply to ensure proper operation with the thruster. The cathode heater power supply and igniter were derived from ongoing development projects. No attempts were made to augment thruster electromagnet current in this effort. The power electronics successfully started and operated the SPT-100 thruster in performance tests at NASA Lewis, with minimal oscillations in the discharge current. The efficiency of the main discharge supply was measured at 0.92, and straightforward modifications were identified which could increase the efficiency to 0.94.
This paper discusses various types of failure mechanisms, precursor parameters, and accelerated aging- based procedures to estimate the remaining life of power electronic devices. Special attention has been given to summarize the different techniques typically used for measuring the junction temperature, because it plays a vital role during accelerated aging and condition monitoring. We reviewed more than 250 papers, and the references list 139 of them in order to explain and address the advantages and disadvantages of various techniques towards the reliability prognosis. Thus, this paper can be considered as an expedient reference to conduct future research on lifetime prediction of existing power electronic devices.