Power Electronics Thermal Management

Moreno, Gilberto (ORCID:0000000335654242)

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DOE OSTI · 1841354

Power Electronics Thermal Management

Moreno, Gilberto (ORCID:0000000335654242)

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Abstract

This project conducts research to develop new power electronics thermal management technologies to increase power density, enable high WBG temperature operation, and decrease cost. One of the main challenges to achieving high power densities is associated with packaging of high-temperature (up to 250 degrees C) WBG devices near lower-temperature-rated components (e.g., electrical boards and capacitors). Additionally, the high junction temperatures of the WBG devices will result in large temperature gradients through the power module layers, which will present reliability challenges and require higher-temperature substrates and bonding materials.

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ADVANCED PROPULSION SYSTEMS electric drive vehicles power density power electronics thermal management

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BibTeX RIS

Moreno, Gilberto (ORCID:0000000335654242). 2022-01-14. Power Electronics Thermal Management. https://www.osti.gov/biblio/1841354

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