Engineering Papers⌕ Search

SEARCH · Engineering Papers

Results for “interface”

Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

Quote a phrase for an exact phrase match. Source license links do not imply unrestricted reuse.

At least 1,153 records · Page 64
All sourcesNASA NTRSDOE OSTI
NASA NTRS1976

A memory-mapped output interface: Omega navigation output data from the JOLT (TM) microcomputer

A hardware interface which allows both digital and analog data output from the JOLT microcomputer is described in the context of a software-based Omega Navigation receiver. The interface hardware described is designed for output of six (or eight with simple extensions) bits of binary output in response to a memory store command from the microcomputer. The interface was produced in breadboard form and is operational as an evaluation aid for the software Omega receiver.

Lilley, R. W.↗
NASA NTRS1975

Large Space Telescope external interfaces

Key interfaces are described for all LST mission phases: ground test and integration, prelaunch and launch operations, ascent, deployment, operations, on-orbit maintenance, retrieval, deorbit and landing, and refurbishment. These interfaces can be categorized as test and integration, launch operations, Shuttle, data, and mission operations. The interface with the Shuttle and the Shuttle crew is emphasized here because the Shuttle allows a new capability: on-orbit maintenance and ground return. The LST will communicate with the ground elements of the LST system through a space link by means of the Tracking Data Relay Satellite System or directly to the stations of the Space Tracking and Data Network.

Collart, R. E.↗
NASA NTRS1976

The metal to metal interface and its effect on adhesion and friction

The paper considers the interface between two bulk metals and the effect of this interface on adhesive bonding, resistance to tangential displacements, friction and the interfacial transport from one surface to another. Using Auger emission spectroscopy, field ion microscopy, and low energy electron diffraction techniques, the influence of surface orientation, lattice registry, crystal lattice structure and defects, metal surface chemistry and alloying on the characteristics of the interface was studied for noble, platinum, transition, and Group 4B metals. With dissimilar metals in contact, epitaxial transfer of the cohesively weaker to the cohesively stronger metal has been observed. Surface chemical activity of the noble and platinum metals is shown to affect interfacial behavior as does a valence bonding in the transition metals, and the degree of metallic nature in the Group 4B elements. Alloying elements, e.g., Si and Fe, can alter interfacial behavior by segregation to the surface of metals or by altering bulk properties such as crystal transformation kinetics.

Buckley, D. H.↗
NASA NTRS1976

Rapid interface flaw extension with friction

An idealized two-dimensional example of rapid interface flow extension is described. Initially undisturbed dissimilar isotropic, homogeneous, linearly elastic half-spaces are perfectly bonded along the interface y=0. Quantities associated with the half-space or = to 0 are denoted by the prime superscript or the subscripts 3 or 4 while those in y or = to 0 carry the subscripts 1 or 2. At time t=0 adjacent material points at x=0, y= + or - 0 are forced apart horizontally with a constant relative velocity delta v. This results in a zone of bond failure which extends symmetrically along the interface at a constant rate c. The newly created flaw surfaces are in sliding contact resisted by Coulomb friction. The friction coefficient is gamma.

Brock, L. M.↗
NASA NTRS1976

Economic analysis of standard interface modules for use with the multi-mission spacecraft, volume 1

A preliminary technical and economic feasibility study was made of the use of Standardized Interstate Modules (SIM) to perform electual interfacing functions that were historically incorporated into sensors. Sensor interface functions that are capable of standardization from the set of missions planned for the NASA Multi-Mission Spacecraft (MMS) in the 1981 to 1985 time period were identified. The cost savings that could be achieved through the replacement of nonstandard sensor interface flight hardware that might be used in these missions with SIM were examined.

Source record↗
NASA NTRS1976

Atmospheric, Magnetospheric and Plasmas in Space (AMPS) spacelab payload definition study. Volume 3: Interface control documents. Part 2: AMPS payload to spacelab ICD

The AMPS to Spacelab Interface Control Document which is to be used as a guide for format and information content in generating specific AMPS Mission ICDs is presented. This document is meant to supplement the Spacelab Payload Accommodations Handbook in that it only defines interfaces which are not discussed in the handbook to the level required for design purposes. The AMPS Top Level Requirements Tree, illustrates this ICD by a shaded area and its relationship to the other AMPS technical documents. Other interface documents shown are the Level II, AMPS to Space Shuttle Vehicle ICD and the Level III, AMPS to Instruments ICD.

Source record↗
NASA NTRS1977

Auger depth profiling of Au-Al/x/Ga/1-x/As interfaces and LPE Al/x/Ga/1-x/As-GaAs heterojunctions

An attempt is made to report Auger depth profiles produced in a UHF ion-milling Auger system for intentionally 'graded' Al(x)Ga(1-x)As-GaAs heterojunctions, 'abrupt' growth heterojunctions of the same material, and Au-Al(x)Ga(1-x)As interfaces. It is found that the interface widths of the 'abrupt' growth heterojunctions did not fluctuate greatly from an average value of 110 A and that 'graded' growth samples had interface widths of about 525 to 1500 A. The results for the Au-containing samples indicate that an oxide layer was present between the Au and the Al(x)Ga(1-x)As.

Garner, C. M.↗
NASA NTRS1977

Space transportation system payload interface verification

The paper considers STS payload-interface verification requirements and the capability provided by STS to support verification. The intent is to standardize as many interfaces as possible, not only through the design, development, test and evaluation (DDT and E) phase of the major payload carriers but also into the operational phase. The verification process is discussed in terms of its various elements, such as the Space Shuttle DDT and E (including the orbital flight test program) and the major payload carriers DDT and E (including the first flights). Five tools derived from the Space Shuttle DDT and E are available to support the verification process: mathematical (structural and thermal) models, the Shuttle Avionics Integration Laboratory, the Shuttle Manipulator Development Facility, and interface-verification equipment (cargo-integration test equipment).

Everline, R. T.↗
NASA NTRS1977

Charge distributions near metal-dielectric interfaces before and after dielectric surface flashover

A technique was developed for measuring surface charge distribution near interfaces without placing any measuring apparatus near the face of the samples. The results of measurements which were made on FEP Teflon and Kapton dielectrics, before and after are given flashover, with various types of interfaces. Also given are data showing mean time between flashovers for various configurations exposed to a variety of environmental conditions. Several charge transfer mechanisms are considered as a means by which stable charge distributions may be maintained near interfaces.

Robinson, J. W.↗
NASA NTRS1978

Shape of two-dimensional solidification interface during directional solidification by continuous casting

An analysis was made of the two-dimensional solidification of an ingot being cooled and withdrawn vertically downward from a mold consisting of parallel walls of finite length. Heat transfer analysis shows how the flatness of the interface is related to the ingot thickness, the withdrawal rate, the heat addition from the superheated liquid metal, and the temperature difference available for cooling. This provides an understanding of the conditions that will yield a maximum rate of casting while achieving the desired flatness of the interface. The results are interpreted with respect to the conditions for obtaining an aligned eutectic structure by directional solidification. In this process an additional constraint must be included that relates the ingot withdrawal rate and the heat transfer rate from the liquid metal to the solidification interface.

Siegel, R.↗
NASA NTRS1979

Spacelab interface development test, volume 1, sections 1-6

Data recorded during the following tests is presented: pulse coded modulator master unit to Spacelab (S/L) interface, master timing unit to S/L interface, multiplexer-demultiplexer/serial input-output to S/L interface, and special tests.

Harris, L. H.↗
NASA NTRS1979

TMS communications software. Volume 2: Bus interface unit

A data bus communication system to support the space shuttle's Trend Monitoring System (TMS) and to provide a basis for evaluation of the bus concept is described. Installation of the system included developing both hardware and software interfaces between the bus and the specific TMS computers and terminals. The software written for the microprocessor-based bus interface units is described. The software implements both the general bus communications protocol and also the specific interface protocols for the TMS computers and terminals.

Gregor, P. J.↗
NASA NTRS1980

Stress intensity factors in two bonded elastic layers containing cracks perpendicular to and on the interface. Part 1: Analysis

The basic crack problem which is essential for the study of subcritical crack propagation and fracture of layered structural materials is considered. Because of the apparent analytical difficulties, the problem is idealized as one of plane strain or plane stress. An additional simplifying assumption is made by restricting the formulation of the problem to crack geometries and loading conditions which have a plane of symmetry perpendicular to the interface. The general problem is formulated in terms of a coupled system of four integral equations. For each relevant crack configuration of practical interest, the singular behavior of the solution near and at the ends and points of intersection of the cracks is investigated and the related characteristic equations are obtained. The edge crack terminating at and crossing the interface, the T-shaped crack consisting of a broken layer and a delamination crack, the cross-shaped crack which consists of a delamination crack intersecting a crack which is perpendicular to the interface, and a delamination crack initiating from a stress-free boundary of the bonded layers are some of the practical crack geometries considered.

Lu, M. C.↗
NASA NTRS1980

Effects of substrate deformation and sip thickness on tile/sip interface stresses for shuttle thermal protection

A nonlinear analysis was used to study the effects of substrate deformation characteristics and strain isolator pad (SIP) thickness on TILE/SIP interface stresses for the space shuttle thermal protection system. The configuration analyzed consisted of a 5.08 cm thick, 15.24 cm square tile with a 12.7 cm square SIP footprint bordered by a 1.27 cm wide filler bar and was subjected to forces and moments representative of a 20.7 kPa aerodynamic shock passing over the tile. The SIP stress deflection curves were obtained after a 69 kPa proof load and 100 cycles conditioning at 55 kPa. The TILE/SIP interface stresses increase over flat substrate values for zero to peak substrate deformation amplitudes up to 0.191 cm by up to a factor of nearly five depending on deformation amplitude, half wave length, and location. Stresses for a 0.23 cm thick SIP found to be up to 60 percent greater than for a 0.41 cm thick SIP for identical loads and substrate deformation characteristics. A simplified method was developed for approximating the substrate location which produces maximum TILE/SIP interface stresses.

Shore, C. P.↗
NASA NTRS1979

Influence of interface on composite failure

The influence of the interface on the composite system behavior is investigated by analytical modeling. The stress analysis is based on the two-dimensional finite element procedure in which twelve-node isoparametric elements with cubic shape functions are used. The location of possible failure sites is predicted by the strain energy density (SED) failure theory which assumes failure to coincide with locations of minimum SED while the locations of maximum SED correspond to regions of excessive distortion or yielding. The results of the analysis show that the way in which the modulus of elasticity varies within the interface is as important in modeling as the average interface modulus.

Sih, G. C.↗
NASA NTRS1980

Improved characterization of the Si-SiO2 interface

Refined quasi-static and conductance methods, based on effectively thin composite insulating layers, low-carrier-concentration bulk semiconductors, and low-level illumination, have been applied to an improved characterization of the (100) Si-SiO2 interface. Accurate measurement of both the total density of interface states and its major components as a function of energy in the forbidden gap have been made over four decades (10-billion to 100-trillion states/eV sq cm) on a single sample. The normal U-shaped density of states is resolved into separate valence- and conduction-band-derived contributions as well as impurity-derived contributions corresponding to concentrations on the order of 20 ppm at the interface.

Su, P.↗
NASA NTRS1982

Programable Interface Handles Many Peripherals

Microprocessor-based interface simplifies interconnection of peripheral device with common memory of network of minicomputers. Interface consists of microprocessor, bidirectional port that connects to common memory, bidirectional port that connects to user-selected peripheral, and asynchronous serial communications port. Programable interface is based around 6800 microprocessor. It is assembled from 90 integrated circuits.

Jasinski, M.↗
NASA NTRS1980

Spacelab's interface to payload experiments

The Spacelab Payload Standard Modular Electronics (SPSME) program has been designed to provide a standardized set of space-qualified low-power electronic modules from which an experimenter may economically implement a command and data management system. SPSME is based on the Computer Automated Measurement and Control (CAMAC) interface standards. To the system of CAMAC, SPSME adds Spacelab interface modules, a flight qualified system crate, and an efficient light-weight power supply to produce a system compatible with the Spacelab environments, the Spacelab Command and Data Management System interface, and any experiment.

Golemon, W. F.↗