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At least 1,081 records · Page 60

Thermal Contact Resistance

Thermal, surface, and deformation analyses for predicting thermal contact resistance for metal surface characteristics in vacuum and fluid environment

METAL SURFACE↗

Thermal contact resistance in vacuum.

Similar or dissimilar materials thermal contact resistance in vacuum with negligible film effect, obtaining constriction resistance

THERMAL CONDUCTOR↗

Preliminary metallographic studies of ball fatigue under rolling-contact conditions

The metallurgical results produced on balls tested in the rolling-contact fatigue spin rig were studied by metallographic examination. Origin and progression of fatigue failures were observed. These evaluations were made on SAE 52100 and AISI M-1 balls fatigue tested at room temperature (80 F) and 200 to 250 F. Most failures originated subsurface in shear; inclusions, structure changes, and directionalism adversely affected ball fatigue life. Structures in the maximum-shear-stress region of the balls of both materials were stable at room temperature and unstable at 200 to 250 F. Failures were of the same type as those found in full-scale bearings.

SURFACES, CONTACT - ROLLING↗

Stress-life relation of the rolling-contact fatigue spin rig

The rolling-contact fatigue spin rig was used to test groups of SAE 52100 9.16-inch-diameter balls lubricated with a mineral oil at 600,000-, 675,000-, and 750,000-psi maximum Hertz stress. Cylinders of AISI M-1 vacuum and commercial melts and MV-1 (AISI M-50) were used as race specimens. Stress-life exponents produced agree closely with values accepted in industry. The type of failure obtained in the spin rig was similar to the subsurface fatigue spells found in bearings.

SURFACES, CONTACT - ROLLING↗

Effect of Fiber Orientation on Ball Failures Under Rolling-contact Conditions

The rolling-contact fatigue spin rig was used to test bails of a bearing steel at maximum Hertz stresses of 600,000 to 750,000 psi. The effect of fiber orientation was observed with the ball track restricted to passing directly over the poles, coincident with the equator, or randomly around the ball. The polar areas were found to be weaker in fatigue than the nonpolar areas. This resulted in a much greater portion of the failures occurring in the polar areas than would be expected from a homogeneous material. The early failures are discussed.

MATERIALS, PROPERTIES - FATIGUE↗

A Comparison of Two Non-Contact Strain Measurement Techniques with Applications to Scientific Balloons

Strain measurements of scientific balloon films are necessary for evaluating the film’s material properties, validating material models, and structural evaluations of scale model balloons. This paper presents a comparison of the strain measurement techniques used by the Balloon Program Office’s Balloon Research and Development Lab at NASA Wallops Flight Facility. Two non-contact strain measurement techniques are presented for comparison, along with an assessment of measurement accuracy for both methods. The case study of a vertically oriented cylindrical balloon is presented to illustrate both systems’ performance and draw nominal conclusions of strain as a function of pressure and axial load.

Non-Contact↗

A Comparison of Two Non-Contact Strain Measurement Techniques with Applications to Scientific Balloons

Strain measurements of scientific balloon films are necessary for evaluating the film’s material properties, validating material models, and structural evaluations of scale model balloons. This paper presents a comparison of the strain measurement techniques used by the Balloon Program Office’s Balloon Research and Development Lab at NASA Wallops Flight Facility. Two non-contact strain measurement techniques are presented for comparison, along with an assessment of measurement accuracy for both methods. The case study of a vertically oriented cylindrical balloon is presented to illustrate both systems’ performance and draw nominal conclusions of strain as a function of pressure and axial load.

Non-Contact↗

Controlled Dielectric Breakdown to Form Pinhole Passivated Contacts

This contribution explores a low-temperature route to forming dielectric pinholes to form poly-Si/dielectric/c-Si passivated contacts. The method utilizes controlled dielectric breakdown to form nanoscale pinholes in a thick (non-tunnelling) dielectric which, when annealed, allows dopant atoms to pass from doped poly-Si through the dielectric and into the c-Si wafer forming conductive pathways. We show that the pinholes can be repassivated with dopants and H diffusion which results in increased PL signals after processing. The method can be expanded to optimized dielectric passivation stacks (not just a single layer) and can be formed in parallel over the faces of the wafer in selected areas (only under the grid).

controlled dielectric breakdown↗

Self-Assembled Monolayer Procedure to Pattern Silicon Passivated Contacts

We utilize hexamethyldisilazane (HMDS)-based self-assembled monolayers to pattern polysilicon (polySi) passivated contacts. We find process conditions that allow for etching frontside n/polySi between fingers, thereby increasing Jsc. Importantly, the Voc does not degrade indicating the additional process steps do not introduce defects or impurities. HMDS layers remain on the surface for metallization without detriment to transport.

hexamethyldisilazane↗