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At least 109 records · Page 6
All sourcesNASA NTRSDOE OSTI
NASA NTRS2017

Temporary Thermocouple Attachment for Thermal/Vacuum Testing at Non-Extreme Temperatures - Test Results

Post-test examination and data analysis that followed a two week long vacuum test showed that numerous self-stick thermocouples became detached from the test article. The thermocouples were reattached with thermally conductive epoxy and the test was repeated to obtain the required data. Because the thermocouple detachment resulted in significant expense and rework, it was decided to investigate the temporary attachment methods used around NASA and to perform a test to assess their efficacy. The present work describes the testing that was performed in early and mid-2017. The test article and the temporary thermocouple attachment methods tested are described. During the first test, fully half of the thermocouples detached - although the detachment showed subtly in the data for some. The second test was performed to confirm the data from the first test and to investigate the effect of test article and thermocouple grounding. The results of the testing over temperatures ranging from -150 to 200degF are detailed and preliminary recommendations are made for temporary thermocouple attachment methods.

Wright, Sarah E.↗
NASA NTRSDate not supplied

Progress Towards SiC ASICs for Extreme Temperature and Radiation Environments

This presentation describes development and demonstrations of semiconductor integrated circuits (ICs) and ceramic packaging that are arguably the most environmentally durable transistor electronics ever demonstrated. Silicon carbide (SiC) junction field effect transistor-resistor (JFET-R) ICs fabricated by NASA Glenn Research Center with two-level interconnect have successfully operated for over 1 year in 500 °C air-ambient, 60 days in 460 °C and 9.3 MPa pressure caustic Venus surface environment test chamber, and radiation exposure through 7 Mrad(Si) total ionizing dose (TID) and 86 MeV-cm2/mg heavy ion strikes. Furthermore, these ICs have also demonstrated operation from -190 °C to +812 °C (over 1000 °C temperature span) without significant change in signal (input /output) or power supply voltages. While the operating frequency and functional complexity is far below silicon-based ICs, these SiC application specific ICs (ASICs) are nevertheless becoming capable of providing unique and advantageous harsh-environment circuit functionality without cooling/sheltering overhead. With modest adjustments, the SiC JFET-R fabrication process is compatible with semiconductor mass-production tools and materials. As an initial step towards manufacture, a majority of processing steps to realize the next SiC JFET-R IC prototype wafer run have been outsourced to commercial foundry. It is expected that further upscaling combined with technology transfer to commercial production will lower investment and risk barriers to useful application deployment.

high temperature↗
NASA NTRS1989

Space vehicle thermal testing: Principles, practices and effectiveness

Component qualification and acceptance temperatures are derived from worst case thermal analyses and analytic uncertainty margin subject to certain specified temperature extremes. Temperature requirements are shown for equipment operation within specification and for survival and turn-on (need not operate within specification, but must not experience any degradation when returned to operational range). Temperature excursions for most equipment are seen to be 20 to 50 C above and below room temperature. Components without active electronics which are mounted outboard, such as solar arrays and antennas, are usually designed to withstand wider temperature excursions, particularly at the cold end. Batteries are tightly controlled at cold temperatures to increase life. Payload components such as extremely accurate clocks for precise navigation are controlled over a relatively narrow temperature range.

Gluck, Donald F.↗
NASA NTRS2001

So What's an RTG and Are They Safe?

When one considers space missions to the outer edges of our solar system and far beyond, our sun cannot be relied on to produce the required spacecraft (s/c) power. Solar energy diminishes as the square of the distance from the Sun. At Mars it is only 43% of that at earth. At Jupiter, it falls off to only 3.6% of Earth's. By the time we get out to Pluto, solar energy is only .066% what it is on Earth. Beyond the orbit of Mars, it is not practical to depend on solar power for a s/c. However, the farther out we go the more power we need to heat the s/c and to transmit data back to Earth over the long distances. On Earth, knowledge is power. In the outer solar system, power is knowledge. Solar arrays only operate at 19% efficiency, are very vulnerable to damage from radiation and temperature extremes, and cannot be used for even nearby missions that operate in extended darkness, or under the surface of a planet or moon. Twenty-six U.S. space missions, from the Transit to Cassini, have used radioisotope power systems and heater units to take s/c to the far reaches of our solar system and have demonstrated an outstanding record of safety and reliability. Radioisotope thermoelectric generators (RTG's) have proven to be safe, reliable, maintenance-free, and capable of providing both thermal and electrical power for decades under the harsh environments of deep space. RTG's have no problem operating in the high radiation belts of space, the extreme temperatures, or the severe dust storms of Mars, and they have proven to be the most reliable power source ever flown on U.S. s/c. For example, the two Pioneer s/c operated for more than two decades and the Voyager s/c may last for 40 years. RTG's are not nuclear reactors, they serve only as power generators and are not involved in the propulsion of the s/c. They operate on the principle of thermoelectric generation that converts heat directly into electricity, they have no moving parts, are extremely reliable, and have met or exceeded all safety and performance expectations. Federal laws and regulations require analysis and evaluation of the safety risks and any potential environmental impacts. Extensive safety testing of RTG's and RTG components has been performed by the U.S. Department of Energy (DOE) to demonstrate the ability to survive accidents related to Space Shuttle launches and assure that the systems would be safe under all accident conditions, including accidents at or near the launch pad or during orbital reentry. Many design improvements have been made over the four decades that RTG's have been flown on space missions. This paper outlines the operation and safety standards of RTG's and the advanced developments expected to be used on future deep space missions such as the Europa Orbiter, Pluto/Kuiper Express, Solar Probe, Europa Lander, and Titan Explorer missions.

Barret, Chris↗
NASA NTRS2004

The Morrison Bearingless Switched Reluctance Motor

Switched reluctance motors typically consist of pairs of poles protruding outward from a central rotor, surrounded by pairs of coils protruding inward from a stator. The pairs of coils, positioned a short distance from opposing sides of the rotor, are connected in series. A current runs through the coils, generating a magnetic flux between the coils. This attracts the protruding poles on the rotor, and just as the poles on the rotor approach the coils, the current to the coils is inverted, repelling the rotor s poles as they pass the coils. This current switching, back and forth, provides a continuous rotational torque to the rotor. reliability, durability, low cost, and operation in adverse environments such as high temperatures, extreme temperature variations, and high rotational speeds. However, because rotors are often manufactured with minute flaws due to imperfections in the machining process, traditional switched reluctance motors often suffer from substantial amounts of vibration. In addition, the current in the coils imparts a strong radial magnetic force on the rotor; the continuous alternating of the direction of this force also causes vibration. As a result, switched reluctance motors require bearings that, run at high speeds, can require lubrication apparatus and are subject to problems with heat and wear. My mentor s recent invention, the "Bearingless" Switched Reluctance Motor, actually uses magnetic bearings instead of traditional physical bearings. Sensors are used to continuously determine the position of the rotor. A computer reads the position sensor input, performs calculations, and outputs a current to a set of extra coils (in addition to the coils rotating the rotor). This current provides a magnetic force that counters and damps the vibration. The sense-calculate-update loop iterates more than thirty thousand times per second. For now, our goal is to have the rotor rotate at about 6000 rprn, and at that speed, the magnetic bearing is adjusting the rotor s position more than 300 times per rotation. and vibration-suppression capacity for the switched reluctance motor. Traditional switched reluctance motors possess many positive traits, including It is hoped that this new invention will increase load-carrying capacity, stiffness, and vibration-suppression capacity for the switched reluctance motor.

Wong, David S.↗
NASA NTRS2005

Reliability Assessment of Advanced Flip-clip Interconnect Electronic Package Assemblies under Extreme Cold Temperatures (-190 and -120 C)

Flip-chip interconnect electronic package boards have been assembled, underfilled, non-destructively evaluated and subsequently subjected to extreme temperature thermal cycling to assess the reliability of this advanced packaging interconnect technology for future deep space, long-term, extreme temperature missions. In this very preliminary study, the employed temperature range covers military specifications (-55 C to 100 C), extreme cold Martian (-120 C to 115 C) and asteroid Nereus (-180 C to 25 C) environments. The resistance of daisy-chained, flip-chip interconnects were measured at room temperature and at various intervals as a function of extreme temperature thermal cycling. Electrical resistance measurements are reported and the tests to date have not shown significant change in resistance as a function of extreme temperature thermal cycling. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work has been carried out to understand the reliability of flip-chip interconnect packages under extreme temperature applications (-190 C to 85 C) via continuously monitoring the daisy chain resistance. Adaptation of suitable diagnostic techniques to identify the failure mechanisms is in progress. This presentation will describe the experimental test results of flip-chip testing under extreme temperatures.

thermal cycling↗
NASA NTRS2009

A Wide Range Temperature Sensor Using SOI Technology

Silicon-on-insulator (SOI) technology is becoming widely used in integrated circuit chips for its advantages over the conventional silicon counterpart. The decrease in leakage current combined with lower power consumption allows electronics to operate in a broader temperature range. This paper describes the performance of an SOIbased temperature sensor under extreme temperatures and thermal cycling. The sensor comprised of a temperature-to-frequency relaxation oscillator circuit utilizing an SOI precision timer chip. The circuit was evaluated under extreme temperature exposure and thermal cycling between -190 C and +210 C. The results indicate that the sensor performed well over the entire test temperature range and it was able to re-start at extreme temperatures.

Patterson, Richard L.↗
NASA NTRS2012

Qualification of Engineering Camera for Long-Duration Deep Space Missions

Qualification and verification of advanced electronic packaging and interconnect technologies, and various other types of hardware elements for the Mars Exploration Rover s Spirit and Opportunity (MER)/Mars Science Laboratory (MSL) flight projects, has been performed to enhance the mission assurance. The qualification of hardware (engineering camera) under extreme cold temperatures has been performed with reference to various Mars-related project requirements. The flight-like packages, sensors, and subassemblies have been selected for the study to survive three times the total number of expected diurnal temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware, including all relevant manufacturing, ground operations, and mission phases. Qualification has been performed by subjecting above flight-like hardware to the environmental temperature extremes, and assessing any structural failures or degradation in electrical performance due to either overstress or thermal cycle fatigue. Engineering camera packaging designs, charge-coupled devices (CCDs), and temperature sensors were successfully qualified for MER and MSL per JPL design principles. Package failures were observed during qualification processes and the package redesigns were then made to enhance the reliability and subsequent mission assurance. These results show the technology certainly is promising for MSL, and especially for longterm extreme temperature missions to the extreme temperature conditions. The engineering camera has been completely qualified for the MSL project, with the proven ability to survive on Mars for 2010 sols, or 670 sols times three. Finally, the camera continued to be functional, even after 2010 thermal cycles.

Ramesham, Rajeshuni↗
NASA NTRS2025

Erosion Behavior of Ti-hBN Multifunctional Coatings in A Custom-Made Planetary Test Rig at Extreme Lunar Temperatures

Spacecraft landings and takeoffs on the lunar surface, along with extreme temperature variations between day and night (-196 to 150° C), cause high-velocity dust impacts and erosion, resulting in the premature failure of structures. Ti/2 vol% hBN coatings were deposited using atmospheric (APS) and vacuum plasma spray (VPS) using cryo-milled powder feedstock to protect the structural components. The erosion performance of coatings at extreme lunar temperature regimes (-150 to 150° C) was evaluated in a custom-made planetary erosion test rig (PETR) at low (50 mph) and high impact velocities (250 mph). The mass loss of VPS coatings was reduced by 50% compared to the APS coatings and 40% compared to the Ti6Al4V substrate. The cryogenic temperature induces brittleness in the material, rendering it susceptible to extreme conditions of material loss. The particle impact-deformation behavior was captured using a high-speed camera to study the erosion mechanism. This analysis revealed chipping in substrates and brittle APS coatings, while particles rebounding and embedding were observed in VPS coatings. Energy calculations, aided by particle trajectory tracking from the high-speed camera, have conclusively shown that VPS coatings absorb 5–10% more energy than APS coatings during erosion tests. A modified erosion index was developed incorporating the fracture toughness and temperatures. New erosion models for brittle and ductile target materials are proposed for developing erosion-resistant material systems.

Abhijith Kunneparambil Sukumaran↗
NASA NTRS2005

Evolvable hardware system at extreme low temperatures

This paper describes circuit evolutionary experiments at extreme low temperatures, including the test of all system components at this extreme environment (EE). In addition to hardening-by-process and hardening-by-design, 'hardening-by-reconfiguration ', when applicable, could be used to mitigate drifts, degradation, or damage on electronic devices (chips) in EE, by using re-configurable devices and an adaptive selfreconfiguration of their circuit topology. Conventional circuit design exploits device characteristics within a certain temperature/radiation range; when that is exceeded, the circuit function degrades. On a reconfigurable device, although component parameters change in EE, a new circuit design, suitable for new parameter values, may be mapped into the reconfigurable structure to recover the initial circuit function. This paper demonstrates this technique for circuit evolution and recovery at liquid nitrogen temperatures (-196.6 (deg)C). In addition, preliminary tests are performed to assess the survivability limitations of the evolutionary processor at extreme low temperatures.

evolvable harware↗
NASA NTRS2008

Evaluation of Silicon-on-Insulator HTOP-01 Operational Amplifier for Wide Temperature Operation

Electronics capable of operation under extreme temperatures are required in many of NASA space exploration missions. Aerospace and military applications, as well as some terrestrial industries constitute environments where electronic systems are anticipated to be exposed to extreme temperatures and wide-range thermal swings. Electronics that are able to withstand and operate efficiently in such harsh environments would simplify, if not eliminate, traditional thermal control elements and their associated structures for proper ambient operation. As a result, overall system mass would be reduced, design would be simplified, and reliability would be improved. Electronic parts that are built utilizing silicon-on-insulator (SOI) technology are known to offer better radiation-tolerance compared to their conventional silicon counterparts, provide faster switching, and consume less power. They also exhibit reduced leakage current and, thus, they are often tailored for high temperature operation. These attributes make SOI-based devices suitable for use in harsh environments where extreme temperatures and wide thermal swings are anticipated. A new operational amplifier, based on silicon-on-insulator technology and geared for high temperature well-logging applications, was recently introduced by Honeywell Corporation. This HTOP-01 dual precision operational amplifier is a low power device, operates on a single supply, and has an internal oscillator and an external clocking option [1]. It is rated for operation from -55 C to +225 C with a maximum output current capability of 50 mA. The amplifier chip is designed as a 14-pin, hermetically-sealed device in a ceramic package. Table I shows some of the device manufacturer s specifications.

Patterson, Richard↗
NASA NTRS2000

Extreme Winter/Early-Spring Temperature Anomalies in Central Europe

Extreme seasonal fluctuations of the surface-air temperature characterize the climate of central Europe, 45-60 deg North Temperature difference between warm 1990 and cold 1996 in the January-March period, persisting for more than two weeks at a time, amounted to 18 C for extensive areas. These anomalies in the surface-air temperature stem in the first place from differences in the low level flow from the eastern North-Atlantic: the value of the Index 1na of southwesterlies over the eastern North-Atlantic was 8.0 m/s in February 1990, but only 2.6 m/ s in February 1996. The primary forcing by warm advection to positive anomalies in monthly mean surface temperature produced strong synoptic-scale uplift at the 700 mb level over some regions in Europe. The strong uplift contributed in 1990 to a much larger cloud-cover over central Europe, which reduced heat-loss to space (greenhouse effect). Thus, spring arrived earlier than usual in 1990, but later than usual in 1996.

Otterman, Joseph↗
NASA NTRS2012

Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment

This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.

high density CCGA qualifications↗
NASA NTRS2011

Cryogenic Behavior of the High Temperature Crystal Oscillator PX-570

Microprocessors, data-acquisition systems, and electronic controllers usually require timing signals for proper and accurate operation. These signals are, in most cases, provided by circuits that utilize crystal oscillators due to availability, cost, ease of operation, and accuracy. Stability of these oscillators, i.e. crystal characteristics, is usually governed, amongst other things, by the ambient temperature. Operation of these devices under extreme temperatures requires, therefore, the implementation of some temperature-compensation mechanism either through the manufacturing process of the oscillator part or in the design of the circuit to maintain stability as well as accuracy. NASA future missions into deep space and planetary exploration necessitate operation of electronic instruments and systems in environments where extreme temperatures along with wide-range thermal swings are countered. Most of the commercial devices are very limited in terms of their specified operational temperature while very few custom-made and military-grade parts have the ability to operate in a slightly wider range of temperature. Thus, it is becomes mandatory to design and develop circuits that are capable of operation efficiently and reliably under the space harsh conditions. This report presents the results obtained on the evaluation of a new (COTS) commercial-off-the-shelf crystal oscillator under extreme temperatures. The device selected for evaluation comprised of a 10 MHz, PX-570-series crystal oscillator. This type of device was recently introduced by Vectron International and is designed as high temperature oscillator [1]. These parts are fabricated using proprietary manufacturing processes designed specifically for high temperature and harsh environment applications [1]. The oscillators have a wide continuous operating temperature range; making them ideal for use in military and aerospace industry, industrial process control, geophysical fields, avionics, and engine control. They exhibit low jitter and phase noise, consume little power, and are suited for high shock and vibration applications. The unique package design of these crystal oscillators offers a small ceramic package footprint, as well as providing both through-hole mounting and surface mount options.

Patterson, Richard↗
NASA NTRS2008

Development of a Temperature Sensor for Jet Engine and Space Missions Environments

Electronic systems in aerospace and in space exploration missions are expected to encounter extreme temperatures and wide thermal swings. To address the needs for extreme temperature electronics, research efforts exist at the NASA Glenn Research Center (GRC) to develop and evaluate electronics for extreme temperature operations, and to establish their reliability under extreme temperature operation and thermal cycling; conditions that are typical of both the aerospace and space environments. These efforts are supported by the NASA Fundamental Aeronautics/Subsonic Fixed Wing Program and by the NASA Electronic Parts and Packaging (NEPP) Program. This work reports on the results obtained on the development of a temperature sensor geared for use in harsh environments.

Patterson, Richard L.↗
NASA NTRS2011

TPSAS-NF1676L-11812-DND

Reducing the weight of spacecraft will reduce the fabrication costs and the launch costs . The elimination of wiring and wiring harnesses reduces the total mass of the vehicle . Wireless sensor technology can reduce the weight and therefore the costs of spacecraft . The Decadal Survey of Civil Aeronautics survey identified that "self-powered, wireless microelectromechanical sensors" warrant attention over the next decade . Current wireless sensor systems have low data rates and require batteries. The environment of aerospace vehicles is often very harsh, with temperature extremes ranging from cryogenic to very high temperatures during re-entry. For example, X-37B mini unmanned shuttle will require high temperature sensors mounted on the structure, as well as cryogenic sensors for monitoring fuel tanks. Batteries do not work well in either temperature extremes. Also, sensors are typically located in internal structures with limited access, making the periodic changing of batteries costly and time consuming. Passive wireless sensors are needed that operate across an extremely large temperature range and do not require batteries. NASA recently instrumented an all Composite Crew Module for structural testing on the ground. Wireless sensors could have reduced the time to instrument the module and check out the sensor wiring.

W (Cy) Wilson↗
NASA NTRS2016

Technology Development and Design of a Hybrid Mars Ascent Vehicle Concept

Hybrid propulsion has been investigated as an enhancing technology for a Mars Ascent Vehicle (MAV) concept as part of potential Mars Sample Return (MSR) because of its high specific impulse, restartability, and the ability to operate and survive at extremely low temperatures. A new wax-based hybrid fuel formulation has been developed that could withstand the harsh and variable Mars environment protected solely by a minimal layer of passive insulation. This formulation could provide substantial energy savings for a notional lander and is critical for rover mobility. Preliminary thermal cycle testing has determined that the formulation can survive the expected temperature extremes and lifetime thermal testing is currently underway. A complete preliminary design using this new fuel formulation combined with a low temperature oxidizer such as Mixed Oxides of Nitrogen (MON30) is presented. Several key features associated with a complete hybrid MAV concept are investigated to determine their mission suitability (e.g. Thrust Vector Control and restartable ignition options). Potential challenges along a path towards developing such a system are outlined and future work is suggested as a means of technology maturation. The hybrid design presented here was the lowest Gross Lift Off Mass (GLOM) result of a 2015 Jet Propulsion Laboratory (JPL) led MAV concept study.

MSR↗