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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 109 records · Page 6

XPS study of the Al/SiO2 interface viewed from the SiO2 side

The first nondestructive measurement of the chemical and physical characteristics of the interface between bulk SiO2 and thick aluminum films is presented. Both X-ray photoelectron spectroscopy (XPS) and electrical measurements of unannealed resistively evaporated Al films on thermal SiO2 indicate an atomically abrupt interface. Postmetallization annealing (PMA) at 450 C induces reduction of the SiO2 by the aluminum, resulting in the layer ordering SiO2/Al2O3/Si/Al. The XPS measurement is performed from the SiO2 side after removal of the Si substrate after etching with XeF2 gas and thinning of the SiO2 layer with HF:ETOH. This represents a powerful new approach to the study of metal-insulator and other interfaces.

Hecht, M. H.↗

A novel X-ray photoelectron spectroscopy study of the Al/SiO2 interface

The nondestructive measurement of the chemical and physical characteristics of the interface between bulk SiO2 and thick aluminum films is reported. Both X-ray phototelectron spectroscopy (XPS) and electrical measurements of unannealed, resistively evaporated Al films on thermal SiO2 indicate an atomically abrupt interface. Post metallization annealing at 450 C induces reduction of the SiO2 by the aluminum, at a rate consistent with the bulk reaction rate. The XPS measurement is performed from the SiO2 side after the removal of the Si substrate with XeF2 gas and thinning of the SiO2 layer with HF:ETOH. This represents a powerful new approach to the study of metal-insulator and related interfaces.

Hecht, M. H.↗

Directional Solidification of Bi-Sn on USMP-4

The experiments used MEPHISTO hardware to study the solidification and melting behavior of bismuth alloyed with 1 at% tin. Three samples, each approximately 900 mm long and 6mm in diameter, were used. A portion of each sample also included a 2 mm diameter growth capillary, to assist in the formation of a single grain. One sample provided the Seebeck voltage generated during melting and freezing processes. Another provided temperature data and Peltier pulsed demarcation of the interface shape for post flight analysis. The third sample provided resistance and growth velocity measurements, as well as additional thermal data. The third sample was also quenched at the end of the mission to preserve the composition of the liquid near the interface for post flight determination. A total of 450mm of directionally solidified samples were preserved for post mission structural and compositional characterization. Substantial differences were observed in the Seebeck signal between the ground-based experiments and the space-based experiments. The temperature gradient in the liquid for the ground-based experiments was significantly lower than the temperature gradient in the liquid for the space-based experiments.

Abbaschian, Reza↗

Understanding Thermal Transport in Polymer –Silver Nanowire Composites

Understanding thermal transport across filler-polymer interfaces and filler-filler contacts within polymer composites is of great importance for better thermal design of the composites that are widely used in high-performance heat exchangers, energy storage devices, and flexible electronics. Over the past several decades, considerable progress has been made in improving the thermal conductivity of polymer composites, but several key questions concerning the influence of interfacial thermal resistance, or Kapitza resistance, still remain. Firstly, the thermal properties of these composites are highly dependent on thermal transport through the filler network and its contacts. For metallic nanofillers, the thermal conductivity is often estimated using the Wiedemann-Franz law based on electrical conductivity; however, it remains a question whether the Wiedemann-Franz law still holds at nanoscale contacts. Through investigation of silver nanowires of varying sizes, we were able to demonstrate that the Lorenz number for silver nanowire increases with decreasing nanowire diameter. Examination of the corresponding electrical and thermal conductivities indicate that these changes are due to that the relative contribution of phonons becomes more significant as a result of elastic stiffening. Furthermore, we show that for silver nanowires, the contact thermal resistance is ~8 times lower than that of multi-walled carbon nanotube (MWCNT) of similar diameters. Additionally, through systematic studies of electrospun polymer-silver nanowire composite nanofibers, we investigated the impact of interface morphology on the thermal conductivity enhancement of the composite system and probed the value of the Kapitza resistance for individual polymer-filler interfaces. For polymer nanofibers containing continuous, single silver nanowires, the thermal conductivity increases linearly with increasing volume fraction of silver, which is consistent with the prediction of percolation theory for samples above the percolation limit. By comparing this linear trend to the measured thermal conductivities of composite nanofibers with more complex structures, we were able to determine the resistance associated with any additional polymer-filler boundaries. In doing so we find that the thermal boundary resistance for polyvinylpyrrolidone (PVP)–silver interfaces is significantly lower than that of comparable polymer-MWCNT composite systems.Together our studies provide new insights into thermal transport in polymer nanocomposites and should help facilitate the design of high performance polymeric thermal interface material.

Thermal transport↗

Flat-plate solar array project. Volume 7: Module encapsulation

The objective of the Encapsulation Task was to develop, demonstrate, and qualify photovoltaic (PV) module encapsulation systems that would provide 20 year (later decreased to 30 year) life expectancies in terrestrial environments, and which would be compatible with the cost and performance goals of the Flat-Plate Solar Array (FSA) Project. The scope of the Encapsulation Task included the identification, development, and evaluation of material systems and configurations required to support and protect the optically and electrically active solar cell circuit components in the PV module operating environment. Encapsulation material technologies summarized include the development of low cost ultraviolet protection techniques, stable low cost pottants, soiling resistant coatings, electrical isolation criteria, processes for optimum interface bonding, and analytical and experimental tools for evaluating the long term durability and structural adequacy of encapsulated modules. Field testing, accelerated stress testing, and design studies have demonstrated that encapsulation materials, processes, and configurations are available that meet the FSA cost and performance goals.

Cuddihy, E.↗

Electronic states of semiconductor-metal-semiconductor quantum-well structures

Quantum-size effects are calculated in thin layered semiconductor-metal-semiconductor structures using an ideal free-electron model for the metal layer. The results suggest new quantum-well structures having device applications. Structures with sufficiently high-quality interfaces should exhibit effects such as negative differential resistance due to tunneling between allowed states. Similarly, optical detection by intersubband absorption may be possible. Ultrathin metal layers are predicted to behave as high-density dopant sheets.

Huberman, M. L.↗

CMCs for the long run

The structural and environmental requirements for ceramic matrix composites (CMCs) are most demanding in aerospace applications involving human transport; this need for extreme reliability has led to intensive investigations of criteria for high CMC integrity. The ideal properties of a fiber-reinforced CMC have been found to depend on the use of high aspect ratio fibers capable of maximum strength retention during fabrication, uniform fiber infiltration by the matrix material, high matrix oxidation resistance in elevated temperature applications, and a fiber/matrix interface that accommodates debonding in the presence of matrix cracks.

Dicarlo, James A.↗

Forced three-dimensional magnetic reconnection due to linkage of magnetic flux tubes

During periods of southward interplanetary magnetic field (IMF) orientation the magnetic field geometry at the dayside magnetopause is susceptible to magnetic reconnection. It has been suggested that reconnection may occur in a localized manner at several patches on the magnetopause. A major problem with this picture is the interaction of magnetic flux ropes which are generated by different reconnection processes. An individual flux rope is bent elbowlike where it intersects the magnetopause and the magnetic field changes from magnetospheric to interplanetary magnetic field orientation. Multiple patches of reconnection can lead to the formation of interlinked magnetic flux tubes. Although the corresponding flux is connected to the IMF the northward and southward connected branches are hooked into each other and cannot develop independently. We have studied this problem in the framework of three-dimensional magnetohydrodynamic simulations. The results indicate that a singular current sheet forms at the interface of two interlinked flux tubes if no resistivity is present in the simulation. This current sheet is strongly tilted compared to the original current sheet. In the presence of resistivity the interaction of the two flux tubes forces a fast reconnection process which generates helically twisted closed magnetospheric flux. This linkage induced reconnection generates a boundary layer with layers of open and closed magnetospheric flux and may account for the brightening of auroral arcs poleward of the boundary between open and closed magnetic flux.

Otto, A.↗

Nickel-Graphite Composite Compliant Interface and/or Hot Shoe Material

Next-generation high-temperature thermoelectric-power-generating devices will employ segmented architectures and will have to reliably withstand thermally induced mechanical stresses produced during component fabrication, device assembly, and operation. Thermoelectric materials have typically poor mechanical strength, exhibit brittle behavior, and possess a wide range of coefficient of thermal expansion (CTE) values. As a result, the direct bonding at elevated temperatures of these materials to each other to produce segmented leg components is difficult, and often results in localized microcracking at interfaces and mec hanical failure due to the stresses that arise from the CTE mismatch between the various materials. Even in the absence of full mechanical failure, degraded interfaces can lead to increased electrical and thermal resistances, which adversely impact conversion efficiency and power output. The proposed solution is the insertion of a mechanically compliant layer, with high electrical and thermal conductivity, between the low- and high-temperature segments to relieve thermomechanical stresses during device fabrication and operation. This composite material can be used as a stress-relieving layer between the thermoelectric segments and/or between a thermoelectric segment and a hot- or cold-side interconnect material. The material also can be used as a compliant hot shoe. Nickel-coated graphite powders were hot-pressed to form a nickel-graphite composite material. A freestanding thermoelectric segmented leg was fabricated by brazing the compliant pad layer between the high-temperature p- Zintl and low-temperature p-SKD TE segments using Cu-Ag braze foils. The segmented leg stack was heated in vacuum under a compressive load to achieve bonding. The novelty of the innovation is the use of composite material that re duces the thermomechanical stresses en - countered in the construction of high-efficiency, high-temperature therm - o-electric devices. The compliant pad enables the bonding of dissimilar thermoelectric materials while maintaining the desired electrical and thermal properties essential for efficient device operation. The modulus, CTE, electrical, and thermal conductances of the composite can be controlled by varying the ratio of nickel to graphite.

Firdosy, Samad A.↗

Understanding Thermal Transport in Polymer - Silver Nanowire Composites

Understanding thermal transport across filler-polymer interfaces and filler-filler contacts within polymer composites is of great importance for better thermal design of the composites that are widely used in high-performance heat exchangers, energy storage devices, and flexible electronics. Over the past several decades, considerable progress has been made in improving the thermal conductivity of polymer composites, but several key questions concerning the influence of interfacial thermal resistance, or Kapitza resistance, still remain. Firstly, the thermal properties of these composites are highly dependent on thermal transport through the filler network and its contacts. For metallic nanofillers, the thermal conductivity is often estimated using the Wiedemann-Franz law based on electrical conductivity; however, it remains a question whether the Wiedemann-Franz law still holds at nanoscale contacts. Through investigation of silver nanowires of varying sizes, we were able to demonstrate that the Lorenz number for silver nanowire increases with decreasing nanowire diameter. Examination of the corresponding electrical and thermal conductivities indicate that these changes are due to that the relative contribution of phonons becomes more significant as a result of elastic stiffening. Furthermore, we show that for silver nanowires, the contact thermal resistance is ~8 times lower than that of multi-walled carbon nanotube (MWCNT) of similar diameters. Additionally, through systematic studies of electrospun polymer-silver nanowire composite nanofibers, we investigated the impact of interface morphology on the thermal conductivity enhancement of the composite system and probed the value of the Kapitza resistance for individual polymer-filler interfaces. For polymer nanofibers containing continuous, single silver nanowires, the thermal conductivity increases linearly with increasing volume fraction of silver, which is consistent with the prediction of percolation theory for samples above the percolation limit. By comparing this linear trend to the measured thermal conductivities of composite nanofibers with more complex structures, we were able to determine the resistance associated with any additional polymer-filler boundaries. In doing so we find that the thermal boundary resistance for polyvinylpyrrolidone (PVP)–silver interfaces is significantly lower than that of comparable polymer-MWCNT composite systems. Together our studies provide new insights into thermal transport in polymer nanocomposites and should help facilitate the design of high performance polymeric thermal interface material.

Matthew L. Fitzgerald↗

Key Durability Issues with Mullite-Based Environmental Barrier Coatings for Si-Based Ceramics

Plasma-sprayed mullite (3Al2O3 central dot 2SiO2) and mullite/yttria-stabilized-zirconia (YSZ) dual layer coatings have been developed to protect silicon-based ceramics from environmental attack. Mullite-based coating systems show excellent durability in air. However, in combustion environments, corrosive species such as molten salt or water vapor penetrate through cracks in the coating and attack the Si-based ceramics along the interface, Thus modification of the coating system for enhanced crack-resistance is necessary for long-term durability in combustion environments. Other key durability issues include interfacial contamination and coating/substrate bonding. Interfacial contamination leads to enhanced oxidation and interfacial pore formation, while weak coating/substrate bonding leads to rapid attack of the interface by corrosive species, both of which can cause premature failure of the coating. Interfacial contamination can be minimized by limiting impurities in coating and substrate materials. The interface may be modified to improve the coating/substrate bond.

Lee, Kang N.↗

Dual measurement ablation sensor

A dual measurement ablation sensor for measuring both char-interface and surface recession at a point in an ablating material is described. The sensor permits measurement of the thickness of the char layer. Char-interface recession is indicated by a drop in the resistance to a current passed through the ablation material. Surface recession is indicated by the closing of an electrical circuit when melting causes the release of a spring switch.

Gurtler, C. A.↗

Non-isothermal effects on SO2 absorption by water droplets. I - Model development. II - Results and discussion

An analytic model of SO2 absorption in a falling water droplet is developed and a simulation of SO2 washout is performed. Nonisothermic effects on drop growth, droplet physical parameters, reaction rates, and multicomponent diffusion are treated in the model. The gas-liquid interface is assumed to be at equilibrium, and interfacial resistance is negligible. Raindrops are simulated as falling from a 2 km height through an atmospheric region containing SO2. The droplets decrease in size from evaporation and cooling, and their slightly basic pH aids SO2 absorption. The simulation indicates higher SO2 absorption at higher altitudes, and desorption may occur at ground level. Isothermal effects are concluded to be significant, and quantification of effects will depend on further modelling.

Reda, M.↗

Microcracking mechanisms and interface toughening of semi-IPN polyimide matrix composites

A new research program was initiated as a preliminary phase. The following three objectives are being pursued for the overall program: to elucidate the mechanisms of microcracking for graphite fiber-reinforced semi-IPN polyimide matrix composites under mechanical and thermal cyclic loading; to devise material engineering solutions for possible improvement of fatigue damage resistance (or the increase of fatigue endurance strength) of semi-IPN matrix composites by tailoring of modulus and toughness of fiber-resin interface region; and to assess processing characteristics of the composites and their roles in controlling the resistance of composites to microcracking and the effectiveness of interface toughening. The main emphasis was placed upon the initial screening of material systems and optimization of processing conditions for semi-IPN matrix composites with tailored interface. As a first set of control material systems to study, the composites were prepared with unsized Celion 6000 graphite fiber reinforcement and the following resin matrices of varied fracture toughness: PMR-15 thermoset polyimide, semi-IPN of PNR-15 thermoset polyimide and NR150B2 thermoplastic polyimide in 75/25 ratio, and semi-IPN of PMR-15 and NR150B2 in 50/50 ratio. For the composites with the resin matrix of semi-IPN in 75/25 ratio, interface tailoring was attempted by using graphite fibers coated with the resins of systematically varied fracture toughness. In the continuing work, a broad range of interlayer toughness will be achieved by coating the fibers with reactants of semi-IPN having lower or higher content of thermoplastic constituent in comparison with the composition of surrounding resin matrix. In pursuing the objectives of the overall research program, the respective roles and interaction of critical parameters were defined.

Lee, Byung L.↗

Key Durability Issues with Mullite-Based Environmental Barrier Coatings for Si-Based Ceramics

Plasma-sprayed mullite (3Al2O3.2SiO2) and mullite/yttria-stabilized-zirconia (YSZ) dual layer coatings have been developed to protect silicon -based ceramics from environmental attack. Mullite-based coating systems show excellent durability in air. However, in combustion environments, corrosive species such as molten salt or water vapor penetrate through cracks in the coating and attack the Si-based ceramics along the interface. Thus the modification of the coating system for enhanced crack-resistance is necessary for long-term durability in combustion environments. Other key durability issues include interfacial contamination and coating/substrate bonding. Interfacial contamination leads to enhanced oxidation and interfacial pore formation, while a weak coating/substrate bonding leads to rapid attack of the interface by corrosive species, both of which can cause a premature failure of the coating. Interfacial contamination can be minimized by limiting impurities in coating and substrate materials. The interface may be modified to improve the coating/substrate bond.

Lee, Kang N.↗

Vibration-resistant PC board feedthrough

New fabrication method uses annealed-nickel ribbon loop to interface coaxial input (or output) connector to printed-wiring board. Inexpensive ribbon interface cuts vibration-induced failure between coaxial cable and printed-wiring board.

Mandel, H.↗

A Simple Thermoelectric Droplet Generator

A new design for a droplet generator capable of producing single droplets is presented. The design relies on thermoelectric heating to vaporize water at the interface between a droplet and a blunt syringe tip. While other designs require careful tuning to produce drops of varying size, this technique enables the simple creation of droplets of any size within a range. The design is of simple construction and can be completed with off-the-shelf components, and relies on resistive heating to vaporize water at or near the droplet-nozzle interface and release the droplets. We demonstrated that the design can be used to produce droplets as small as 110 µm or as large as 2 mm. Drop size is limited by the geometry of the nozzle since water must wet the tip of the nozzle and hang under gravity. Our experiments showed that released droplets have relatively small disturbances introduced by the release mechanism when compared to competing techniques. These disturbances were intermittently observed as the voltage, pulse width, and drop size were changed, and optimal settings were determined for the smallest drop sizes produced.

Andrew Work↗