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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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All sourcesNASA NTRSDOE OSTI
NASA NTRSDate not supplied

Leveraging Existing Satellite Precipitation Missions for AOS Applications Development

The Atmosphere Observing System (AOS) seeks to explore fundamental questions of how interconnections between aerosols, clouds and precipitation impact our weather and climate, addressing real-world challenges to benefit society. AOS will provide key information to enhance the communities’ ability to improve weather and air quality forecasting today, seasonal to sub-seasonal changes in the near future, and societal challenges resulting from climate change in the decades to come. A fundamental component of the AOS mission is ensuring that applications are considered to the greatest extent possible in mission design.As a result, the Applications Impact Team (AIT) was implemented to address this objective.The overarching goal of the AIT is to help improve the capacity for transitioning science to applications to make it possible to more quickly and effectively inform decisions that will directly benefit society. We seek to maximize AOS benefit to impact decisions through early engagement in the mission development phase in order to prepare stakeholders to apply observations as soon as AOS mission data becomes available.To support these efforts, we leverage existing mission applications activities and initiatives, such as NASA’s GPM and TROPICS missions, to form a framework to enhance precipitation applications for AOS. Engaging with existing missions helps identify and understand data needs, gaps and opportunities for current and future stakeholders, determine what precipitation data products are of highest value and use, and helps connect stakeholders with current mission data that can serve as AOS proxy data, among others. In this presentation, we provide an overview of AOS AIT activities and initiatives and highlight how existing satellite precipitation missions and their applications activities can play a critical role in AOS applications development during mission design.

Andrea Portier↗
NASA NTRS1999

Overview of Photonic Materials for Application in Space Environments

Future space systems will he based on components evolving from the development and refinement of new and existing photonic materials. Optically based sensors, inertial guidance, tracking systems, communications, diagnostics, imaging and high speed optical processing are but a few of the applications expected to widely utilize photonic materials. The response of these materials to space environment effects (SEE) such as spacecraft charging, orbital debris, atomic oxygen, ultraviolet irradiation, temperature and ionizing radiation will be paramount to ensuring successful space applications. The intent of this paper is to, address the latter two environments via a succinct comparison of the known sensitivities of selected photonic materials to the temperature and ionizing radiation conditions found in space and enhanced space environments Delineation of the known temperature and radiation induced responses in LiNbO3, AlGaN, AlGsAs,TeO2, Si:Ge, and several organic polymers are presented. Photonic materials are realizing rapid transition into applications for many proposed space components and systems including: optical interconnects, optical gyros, waveguide and spatial light modulators, light emitting diodes, lasers, optical fibers and fiber optic amplifiers. Changes to material parameters such as electrooptic coefficients, absorption coefficients, polarization, conductivity, coupling coefficients, diffraction efficiencies, and other pertinent material properties examined for thermo-optic and radiation induced effect. Conclusions and recommendations provide the reader with an understanding of the limitations or attributes of material choices for specific applications.

Taylor, E. W.↗
NASA NTRS2003

Development of a Thin Film Solar Cell Interconnect for the Powersphere Concept

Progressive development of microsatellite technologies has resulted in increased demand for lightweight electrical power subsystems including solar arrays. The use of thin film photovoltaics has been recognized as a key solution to meet the power needs. The lightweight cells can generate sufficient power and still meet critical mass requirements. Commercially available solar cells produced on lightweight substrates are being studied as an option to fulfill the power needs. The commercially available solar cells are relatively inexpensive and have a high payoff potential. Commercially available thin film solar cells are primarily being produced for terrestrial applications. The need to convert the solar cell from a terrestrial to a space compatible application is the primary challenge. Solar cell contacts, grids and interconnects need to be designed to be atomic oxygen resistant and withstand rapid thermal cycling environments. A mechanically robust solar cell interconnect is also required in order to withstand handling during fabrication and survive during launch. The need to produce the solar cell interconnects has been identified as a primary goal of the Powersphere program and is the topic of this paper. Details of the trade study leading to the final design involving the solar cell wrap around contact, flex blanket, welding process, and frame will be presented at the conference.

Simburger, Edward J.↗
NASA NTRS1977

The use of hybrid integrated circuit techniques in biotelemetry applications

A review is presented of some features of hybrid integrated circuits that make their use advantageous in miniature biotelemetry applications. The various techniques for fabricating resistors, capacitors and interconnections by both thin film and thick film technology are discussed. The use of chip capacitors, resistors, and especially standard IC chips on substrates with fired-on interconnection patterns is emphasized. The review is designed primarily to acquaint biotelemetry users and designers with an overview of this fabrication technique so that they can better communicate their needs with an understanding of its limitations and advantages to facilities specializing in hybrid construction.

Fryer, T. B.↗
NASA NTRS1987

Surface inspection: Research and development

Surface inspection techniques are used for process learning, quality verification, and postmortem analysis in manufacturing for a spectrum of disciplines. First, trends in surface analysis are summarized for integrated circuits, high density interconnection boards, and magnetic disks, emphasizing on-line applications as opposed to off-line or development techniques. Then, a closer look is taken at microcontamination detection from both a patterned defect and a particulate inspection point of view.

Batchelder, J. S.↗
NASA NTRS1996

A proposed application programming interface for a physical volume repository

The IEEE Storage System Standards Working Group (SSSWG) has developed the Reference Model for Open Storage Systems Interconnection, Mass Storage System Reference Model Version 5. This document, provides the framework for a series of standards for application and user interfaces to open storage systems. More recently, the SSSWG has been developing Application Programming Interfaces (APIs) for the individual components defined by the model. The API for the Physical Volume Repository is the most fully developed, but work is being done on APIs for the Physical Volume Library and for the Mover also. The SSSWG meets every other month, and meetings are open to all interested parties. The Physical Volume Repository (PVR) is responsible for managing the storage of removable media cartridges and for mounting and dismounting these cartridges onto drives. This document describes a model which defines a Physical Volume Repository, and gives a brief summary of the Application Programming Interface (API) which the IEEE Storage Systems Standards Working Group (SSSWG) is proposing as the standard interface for the PVR.

Jones, Merritt↗
NASA NTRS2005

Process Developed for Generating Ceramic Interconnects With Low Sintering Temperatures for Solid Oxide Fuel Cells

Solid oxide fuel cells (SOFCs) have been considered as premium future power generation devices because they have demonstrated high energy-conversion efficiency, high power density, and extremely low pollution, and have the flexibility of using hydrocarbon fuel. The Solid-State Energy Conversion Alliance (SECA) initiative, supported by the U.S. Department of Energy and private industries, is leading the development and commercialization of SOFCs for low-cost stationary and automotive markets. The targeted power density for the initiative is rather low, so that the SECA SOFC can be operated at a relatively low temperature (approx. 700 C) and inexpensive metallic interconnects can be utilized in the SOFC stack. As only NASA can, the agency is investigating SOFCs for aerospace applications. Considerable high power density is required for the applications. As a result, the NASA SOFC will be operated at a high temperature (approx. 900 C) and ceramic interconnects will be employed. Lanthanum chromite-based materials have emerged as a leading candidate for the ceramic interconnects. The interconnects are expected to co-sinter with zirconia electrolyte to mitigate the interface electric resistance and to simplify the processing procedure. Lanthanum chromites made by the traditional method are sintered at 1500 C or above. They react with zirconia electrolytes (which typically sinter between 1300 and 1400 C) at the sintering temperature of lanthanum chromites. It has been envisioned that lanthanum chromites with lower sintering temperatures can be co-fired with zirconia electrolyte. Nonstoichiometric lanthanum chromites can be sintered at lower temperatures, but they are unstable and react with zirconia electrolyte during co-sintering. NASA Glenn Research Center s Ceramics Branch investigated a glycine nitrate process to generate fine powder of the lanthanum-chromite-based materials. By simultaneously doping calcium on the lanthanum site, and cobalt and aluminum on the chromium site, we could sinter the materials below 1400 C. The doping concentrations were adjusted so that the thermal expansion coefficient matched that of the zirconia electrolyte. Also, the investigation was focused on stoichiometric compositions so that the materials would have better stability. Co-sintering and chemical compatibility with zirconia electrolyte were examined by X-ray diffraction, scanning electron microscopy, and energy dispersive spectroscopy (line scanning and dot map). The results showed that the materials bond well, but do not react, with zirconia electrolyte. The electric conductivity of the materials measured at 900 C in air was about 20 S/cm.

Zhong, Zhi-Min↗
NASA NTRS1991

Explicit construction of quadratic Lyapunov functions for the small gain, positivity, circle, and Popov theorems and their application to robust stability

Lyapunov function proofs of sufficient conditions for asymptotic stability are given for feedback interconnections of bounded real and positive real transfer functions. Two cases are considered: (1) a proper bounded real (resp., positive real) transfer function with a bounded real (resp., positive real) time-varying memoryless nonlinearity; and (2) two strictly proper bounded real (resp., positive real) transfer functions. A similar treatment is given for the circle and Popov theorems. Application of these results to robust stability with time-varying bounded real, positive real, and sector-bounded uncertainty is discussed.

Haddad, Wassim M.↗
NASA NTRS1981

Multijunction high-voltage solar cell

Multijunction cell allows for fabrication of high-voltage solar cell on single semiconductor wafer. Photovoltaic energy source using cell is combined on wafer with circuit it is to power. Cell consists of many voltage-generating regions internally or externally interconnected to give desired voltage and current combination. For computer applications, module is built on silicon wafer with energy for internal information processing and readouts derived from external light source.

Evans, J. C., Jr.↗
NASA NTRS1984

Mathematical synthesization of complex structures

A mathematical synthesization approach for rapidly modeling and analyzing complex structures comprised of hundreds or thousands of repeating individual structural members, interconnecting hardware, and other components was described. The techniques are applicable to any structure with repeating structural members. The capabilities are embodied within the Interactive Design and Evaluation of Advanced Spacecraft (IDEAS) computer-aided design system. IDEAS has a full range of integrated spacecraft modeling, design, analysis, performance, and cost estimating capabilities which include about 40 technical program and executive, data base, and file management systems. With IDEAS, a single user at an interactive terminal can create, design, analyze, and conduct parametric studies of Earth orbiting spacecraft in a timely, cost-efficient manner. The system is particularly useful in the conceptual design phases of advanced space missions when a multiplicity of concepts must be evaluated. The IDEAS interactive finite-element modeling capabilities are discussed. The mathematical synthesization programs were structured not only to provide a detailed finite-element model of the structure but also to automatically perform the many auxiliary computations needed to analyze the spacecraft in its orbital operational environment.

Garrett, L. B.↗
NASA NTRS1998

OhioView: Distribution of Remote Sensing Data Across Geographically Distributed Environments

Various issues associated with the distribution of remote sensing data across geographically distributed environments are presented in viewgraph form. Specific topics include: 1) NASA education program background; 2) High level architectures, technologies and applications; 3) LeRC internal architecture and role; 4) Potential GIBN interconnect; 5) Potential areas of network investigation and research; 6) Draft of OhioView data model; and 7) the LeRC strategy and roadmap.

Ramos, Calvin T.↗
NASA NTRS2010

NASA Tech Briefs, June 2010

Topics covered include: Situational Awareness from a Low-Cost Camera System; Data Acquisition System for Multi-Frequency Radar Flight Operations Preparation; Mercury Toolset for Spatiotemporal Metadata; Social Tagging of Mission Data; Integrating Radar Image Data with Google Maps; Demonstration of a Submillimeter-Wave HEMT Oscillator Module at 330 GHz; Flexible Peripheral Component Interconnect Input/Output Card; Interface Supports Lightweight Subsystem Routing for Flight Applications; MMIC Amplifiers and Wafer Probes for 350 to 500 GHz; Public Risk Assessment Program; Particle Swarm Optimization Toolbox; Telescience Support Center Data System Software; Update on PISCES; Ground and Space Radar Volume Matching and Comparison Software; Web-Based Interface for Command and Control of Network Sensors; Orbit Determination Toolbox; Distributed Observer Network; Computer-Automated Evolution of Spacecraft X-Band Antennas; Practical Loop-Shaping Design of Feedback Control Systems; Fully Printed High-Frequency Phased-Array Antenna on Flexible Substrate; Formula for the Removal and Remediation of Polychlorinated Biphenyls in Painted Structures; Integrated Solar Concentrator and Shielded Radiator; Water Membrane Evaporator; Modeling of Failure for Analysis of Triaxial Braided Carbon Fiber Composites; Catalyst for Carbon Monoxide Oxidation; Titanium Hydroxide - a Volatile Species at High Temperature; Selective Functionalization of Carbon Nanotubes: Part II; Steerable Hopping Six-Legged Robot; Launchable and Retrievable Tetherobot; Hybrid Heat Exchangers; Orbital Winch for High-Strength, Space-Survivable Tethers; Parameterized Linear Longitudinal Airship Model; and Physics of Life: A Model for Non-Newtonian Properties of Living Systems.

Source record↗
NASA NTRS2017

Thermal cycling testing to failure of a ceramic column grid array package for space applications

Ceramic column grid array (CCGA) packages have been used increasingly in logic and microprocessor functions, telecommunications, flight avionics boards, payload electronics boards, engineering navigational and science cameras, electronic assemblies, and other applications, because of their inherent advantages such as high electrical interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount technology (SMT) packaging assembly processes. Because these advanced electronic packages tend to have less solder-joint strain-relief than do leaded flat-pack electronic packages, the reliability of CCGA packages in challenging thermal environments is a very important consideration for their short- and long-term use in JPL-NASA space missions. In this study, we assembled daisy chains of polyimide printed wiring boards from CCGA-interconnect packages, inspected the boards nondestructively, and then subjected them to thermal cycling to assess their reliability in thermal environments from +125°C to -40°C±25°C. The test hardware consists of a CCGA 1752 package (CN version). The package was divided into four daisy-chained sections that were electrically monitored for their continuity during thermal cycling. The CCGA 1752 package is roughly 45 mm × 45 mm with a 42-mm × 42-mm array of 80%/20% Pb/Sn columns on a 1.00-mm pitch. The resistance of the daisy-chained CCGA interconnects was continuously monitored during thermal cycling in a gaseous nitrogen environment. Electrical continuity resistance measurements as a function of thermal cycling are reported here; tests to date have shown significant change to an open circuit in daisy-chain resistance as a function of thermal cycling. The change in interconnect resistance becomes increasingly noticeable with increasing number of thermal cycles. This paper describes the experimental thermal-cycling test results of CCGA 1752 package reliability testing under an extremely wide temperature range. The first failure was observed at 1479th thermal cycle. We report the thermal-cycle reliability test data for ~2500 thermal cycles.

Ramesham, Rajeshuni↗
NASA NTRS2010

Advanced Flip Chips in Extreme Temperature Environments

The use of underfill materials is necessary with flip-chip interconnect technology to redistribute stresses due to mismatching coefficients of thermal expansion (CTEs) between dissimilar materials in the overall assembly. Underfills are formulated using organic polymers and possibly inorganic filler materials. There are a few ways to apply the underfills with flip-chip technology. Traditional capillary-flow underfill materials now possess high flow speed and reduced time to cure, but they still require additional processing steps beyond the typical surface-mount technology (SMT) assembly process. Studies were conducted using underfills in a temperature range of -190 to 85 C, which resulted in an increase of reliability by one to two orders of magnitude. Thermal shock of the flip-chip test articles was designed to induce failures at the interconnect sites (-40 to 100 C). The study on the reliability of flip chips using underfills in the extreme temperature region is of significant value for space applications. This technology is considered as an enabling technology for future space missions. Flip-chip interconnect technology is an advanced electrical interconnection approach where the silicon die or chip is electrically connected, face down, to the substrate by reflowing solder bumps on area-array metallized terminals on the die to matching footprints of solder-wettable pads on the chosen substrate. This advanced flip-chip interconnect technology will significantly improve the performance of high-speed systems, productivity enhancement over manual wire bonding, self-alignment during die joining, low lead inductances, and reduced need for attachment of precious metals. The use of commercially developed no-flow fluxing underfills provides a means of reducing the processing steps employed in the traditional capillary flow methods to enhance SMT compatibility. Reliability of flip chips may be significantly increased by matching/tailoring the CTEs of the substrate material and the silicon die or chip, and also the underfill materials. Advanced packaging interconnects technology such as flip-chip interconnect test boards have been subjected to various extreme temperature ranges that cover military specifications and extreme Mars and asteroid environments. The eventual goal of each process step and the entire process is to produce components with 100 percent interconnect and satisfy the reliability requirements. Underfill materials, in general, may possibly meet demanding end use requirements such as low warpage, low stress, fine pitch, high reliability, and high adhesion.

Ramesham, Rajeshuni↗
NASA NTRS2008

Initial Performance Results on IBM POWER6

The POWER5+ processor has a faster memory bus than that of the previous generation POWER5 processor (533 MHz vs. 400 MHz), but the measured per-core memory bandwidth of the latter is better than that of the former (5.7 GB/s vs. 4.3 GB/s). The reason for this is that in the POWER5+, the two cores on the chip share the L2 cache, L3 cache and memory bus. The memory controller is also on the chip and is shared by the two cores. This serializes the path to memory. For consistently good performance on a wide range of applications, the performance of the processor, the memory subsystem, and the interconnects (both latency and bandwidth) should be balanced. Recognizing this, IBM has designed the Power6 processor so as to avoid the bottlenecks due to the L2 cache, memory controller and buffer chips of the POWER5+. Unlike the POWER5+, each core in the POWER6 has its own L2 cache (4 MB - double that of the Power5+), memory controller and buffer chips. Each core in the POWER6 runs at 4.7 GHz instead of 1.9 GHz in POWER5+. In this paper, we evaluate the performance of a dual-core Power6 based IBM p6-570 system, and we compare its performance with that of a dual-core Power5+ based IBM p575+ system. In this evaluation, we have used the High- Performance Computing Challenge (HPCC) benchmarks, NAS Parallel Benchmarks (NPB), and four real-world applications--three from computational fluid dynamics and one from climate modeling.

Saini, Subbash↗
NASA NTRS2004

Power Actuation and Switching Module Development

The Deep Space Avionics (DSA) Project is developing a Power Actuation and Switching Module (PASM). This component enables a modular and scalable design approach for power switching applications, which can result in a wide variety of power switching architectures using this simple building block. The PASM is designed to provide most of the necessary power switching functions of spacecraft for various Deep Space missions including future missions to Mars, comets, Jupiter and its moons. It is fabricated using an A SIC process that is tolerant of high radiation. The development includes two application specific integrated circuits (ASICs) and support circuitry all packaged using High Density Interconnect (HDI) technology. It can be operated in series or parallel with other PASMs, It can be used as a high-side or low-side switch and it can drive thruster valves, pyrotechnic devices such as NASA standard initiators, bus shunt resistors, and regular spacecraft component loads. Each PASM contains two independent switches with internal current limiting and over-current trip-off functions to protect the power subsystem from load faults. During turnon and turnoff each switch can limit the rate of current change (di/dt) to a value determined by the user. Threeway majority-voted On/Off commandability and full switch status telemetry (both analog and digital) are built into the module. This paper describes the development process used to design, model, fabricate, and test these compact and versatile power switches. Preliminary test results from prototype HDI PASM hardware are also discussed.

Power Actuation and Switching Module (PASM)↗
NASA NTRS1995

Constructing Scientific Applications from Heterogeneous Resources

A new model for high-performance scientific applications in which such applications are implemented as heterogeneous distributed programs or, equivalently, meta-computations, is investigated. The specific focus of this grant was a collaborative effort with researchers at NASA and the University of Toledo to test and improve Schooner, a software interconnection system, and to explore the benefits of increased user interaction with existing scientific applications.

Schichting, Richard D.↗