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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 901 records · Page 50
All sourcesNASA NTRSDOE OSTI
NASA NTRS1980

Fiber-optic rotation sensor technology

A concept for an all-waveguide fiber-optic rotation sensor is discussed, and the results of preliminary tests of key elements are described. A single channel waveguide coupler design provides the functions of an optical switch, a 3-dB beam splitter, a phase retarder, and a signal modulator, all of which may be formed on the same chip and interconnected by channel single-mode waveguides. Preliminary test results for the waveguide coupler and for a rotation sensor without the coupler are presented. Signal processing, polarization control, and interconnection of the waveguide components are discussed.

Goss, W. C.↗
NASA NTRS1982

Automated Solar-Array Assembly

Large arrays are rapidly assembled from individual solar cells by automated production line developed for NASA's Jet Propulsion Laboratory. Apparatus positions cells within array, attaches interconnection tabs, applies solder flux, and solders interconnections. Cells are placed in either straight or staggered configurations and may be connected either in series or in parallel. Are attached at rate of one every 5 seconds.

Soffa, A.↗
NASA NTRS1980

Automated solar module assembly line

The solar module assembly machine which Kulicke and Soffa delivered under this contract is a cell tabbing and stringing machine, and capable of handling a variety of cells and assembling strings up to 4 feet long which then can be placed into a module array up to 2 feet by 4 feet in a series of parallel arrangement, and in a straight or interdigitated array format. The machine cycle is 5 seconds per solar cell. This machine is primarily adapted to 3 inch diameter round cells with two tabs between cells. Pulsed heat is used as the bond technique for solar cell interconnects. The solar module assembly machine unloads solar cells from a cassette, automatically orients them, applies flux and solders interconnect ribbons onto the cells. It then inverts the tabbed cells, connects them into cell strings, and delivers them into a module array format using a track mounted vacuum lance, from which they are taken to test and cleaning benches prior to final encapsulation into finished solar modules. Throughout the machine the solar cell is handled very carefully, and any contact with the collector side of the cell is avoided or minimized.

Bycer, M.↗
NASA NTRS1976

Evaluation of advanced microelectronic fluxless solder-bump contacts for hybrid microcircuits

Technology for interconnecting monolithic integrated circuit chips with other components is investigated. The advantages and disadvantages of the current flip-chip approach as compared to other interconnection methods are outlined. A fluxless solder-bump contact technology is evaluated. Multiple solder-bump contacts were formed on silicon integrated circuit chips. The solder-bumps, comprised of a rigid nickel under layer and a compliant solder overlayer, were electroformed onto gold device pads with the aid of thick dry film photomasks. Different solder alloys and the use of conductive epoxy for bonding were explored. Fluxless solder-bump bond quality and reliability were evaluated by measuring the effects of centrifuge, thermal cycling, and high temperature storage on bond visual characteristics, bond electrical continuity, and bond shear tests. The applicability and suitability of this technology for hybrid microelectronic packaging is discussed.

Mandal, R. P.↗
NASA NTRS1981

Spacecraft automatic umbilical system

An umbilical system design is described that incorporates all the features specified for a power system to payload interconnect capability. A proof-of-concept prototype of the umbilical system was built to determine experimentally the suitability of the threading characteristics of the ram mechanism and to verify freedom from cross threading. It is concluded that Berthing systems that utilize remote manipulator systems (RMS) can be simplified by using RMS targets, closed circuit TV cameras, tie into the RMS control system, and grapple-fixture and end-effector-like capture and secure mechanisms. To effect a remotely controlled umbilical interconnect in proximity with a manned spacecraft and to provide for extravehicular activity backup and maintenance capabilities, 18 different mechanisms are found to be necessary. The weight impact of proving for maintenance capability in a large multiple connector umbilical system was found to be in the order of +60 percent.

Goldin, R. W.↗
NASA NTRS1981

Low cost solar array project production process and equipment task: A Module Experimental Process System Development Unit (MEPSDU)

Several major modifications were made to the design presented at the PDR. The frame was deleted in favor of a "frameless" design which will provide a substantially improved cell packing factor. Potential shaded cell damage resulting from operation into a short circuit can be eliminated by a change in the cell series/parallel electrical interconnect configuration. The baseline process sequence defined for the MEPSON was refined and equipment design and specification work was completed. SAMICS cost analysis work accelerated, format A's were prepared and computer simulations completed. Design work on the automated cell interconnect station was focused on bond technique selection experiments.

Source record↗
NASA NTRS1980

Distributed parameter system coupled ARMA expansion identification and adaptive parallel IIR filtering - A unified problem statement

A novel interconnection of distributed parameter system (DPS) identification and adaptive filtering is presented, which culminates in a common statement of coupled autoregressive, moving-average expansion or parallel infinite impulse response configuration adaptive parameterization. The common restricted complexity filter objectives are seen as similar to the reduced-order requirements of the DPS expansion description. The interconnection presents the possibility of an exchange of problem formulations and solution approaches not yet easily addressed in the common finite dimensional lumped-parameter system context. It is concluded that the shared problems raised are nevertheless many and difficult.

Johnson, C. R., Jr.↗
NASA NTRS1981

Architecture for VLSI design of Reed-Solomon encoders

The logic structure of a universal VLSI chip called the symbol-slice Reed-Solomon (RS) encoder chip is discussed. An RS encoder can be constructed by cascading and properly interconnecting a group of such VLSI chips. As a design example, it is shown that a (255,223) RD encoder requiring around 40 discrete CMOS ICs may be replaced by an RS encoder consisting of four identical interconnected VLSI RS encoder chips. Besides the size advantage, the VLSI RS encoder also has the potential advantages of requiring less power and having a higher reliability.

Liu, K. Y.↗
NASA NTRS1982

Silicon dendritic web material

The development of a low cost and reliable contact system for solar cells and the fabrication of several solar cell modules using ultrasonic bonding for the interconnection of cells and ethylene vinyl acetate as the potting material for module encapsulation are examined. The cells in the modules were made from dendritic web silicon. To reduce cost, the electroplated layer of silver was replaced with an electroplated layer of copper. The modules that were fabricated used the evaporated Ti, Pd, Ag and electroplated Cu (TiPdAg/Cu) system. Adherence of Ni to Si is improved if a nickel silicide can be formed by heat treatment. The effectiveness of Ni as a diffusion barrier to Cu and the ease with which nickel silicide is formed is discussed. The fabrication of three modules using dendritic web silicon and employing ultrasonic bonding for interconnecting calls and ethylene vinyl acetate as the potting material is examined.

Meier, D. L.↗
NASA NTRS1982

Application of In Situ Fiberization for fabrication of improved strain isolation pads and graphite epoxy composites

The feasibility of applying the in situ fiberization process to the fabrication of strain isolation pads (SIP) for the Space Shuttle and to the fabrication of graphite-epoxy composites was evaluated. The ISF process involves the formation of interconnected polymer fiber networks by agitation of dilute polymer solutions under controlled conditions. High temperature polymers suitable for SIP use were fiberized and a successful fiberization of polychloro trifluoroethylene, a relatively high melting polymer, was achieved. Attempts to fiberize polymers with greater thermal stability were unsuccessful, apparently due to characteristics caused by the presence of aromaticity in the backbone of such materials. Graphite-epoxy composites were fabricated by interconnecting two dimensional arrays of graphite fiber with polypropylene IS fibers with subsequent epoxy resin impregnation. Mechanical property tests were performed on laminated panels of this material to evaluate intralaminar and interlaminar shear strength, and thus fracture toughness. Test results were generally unpromising.

Rosser, R. W.↗
NASA NTRS1981

Low cost, high concentration ratio solar cell array for space applications

A miniaturized Cassegrainian-type concentrator solar array concept for space applications is described. In-orbit cell operating temperatures near 80 C are achieved with purely passive cell cooling and a net concentration ratio of 100. A multiplicity of miniaturized, rigid solar cell concentrator subassemblies are electrically interconnected in conventional fashion and mounted into rigid frames to form concentrator solar panel assemblies approximately 14-mm thick. A plurality of such interconnected panels forms a stowable and deployable solar cell blanket. It is projected that for 20% efficient silicon cells an array of 500 kW beginning-of-life output capability, including orbiter cradle structures, can be transported by a single shuttle orbiter flight into low earth orbit. In-orbit array specific performance is calculated to be approximately 100 W/sq m and 20 W/kg, including all stowage, deployment and array figure control equipment designed for a 30-year orbital life. Higher efficiency gallium arsenide and multiple band gap solar cells will improve these performance factors correspondingly.

Patterson, R. E.↗
NASA NTRS1982

Architecture for VLSI design of Reed-Solomon encoders

A description is given of the logic structure of the universal VLSI symbol-slice Reed-Solomon (RS) encoder chip, from a group of which an RS encoder may be constructed through cascading and proper interconnection. As a design example, it is shown that an RS encoder presently requiring approximately 40 discrete CMOS ICs may be replaced by an RS encoder consisting of four identical, interconnected VLSI RS encoder chips, offering in addition to greater compactness both a lower power requirement and greater reliability.

Liu, K. Y.↗
NASA NTRS1982

Oxidation stability of advanced reaction-bonded Si3N4 materials

Four slip-cast, injection-molded and isostatically-pressed specimens of reaction-bonded silicon nitride (RBSN) were subjected to static oxidation tests at 900 C for 10 hours. Specimens containing 8-10% interconnected open porosity of size greater than one micron exhibited a 20-30% decrease in average room temperature four-point flexure strength, while those with 10% open porosity of magnitudes much smaller than one micron as well as those with 2-4% interconnected open porosity of about one micron did not decrease in strength after 900 C exposure. It was determined that preoxidation treatment at 1350 C prevents the 20-30% strength degradation due to internal oxidation, and evidence is presented which suggests that surface pit formation in some RBSN may result from contamination by the furnace environment rather than any intrinsic material properties.

Lindberg, L. J.↗
NASA NTRS1982

Photovoltaic array reliability optimization

An overview of the photovoltaic array reliability problem is presented, and a high reliability/minimum cost approach to this problem is presented. Design areas covered are cell failure, interconnect fatigue, and electrical insulation breakdown, and three solution strategies are discussed. The first involves controlling component failures in the solar cell (cell cracking, cell interconnects) and at the module level (must be statistically treated). Second, a fault tolerant circuit is designed which reduces array degradation, improves module yield losses, and controls hot-spot heating. Third, cost optimum module replacement strategies are also effective in reducing array degradation. This can be achieved by minimizing the life-cycle energy cost of the photovoltaic system. The integration of these solutions is aimed at reducing the 0.01% failure rate.

Ross, R. G., Jr.↗
NASA NTRS1984

Processes for VLSI Circuits

Four-volume document reviews key technologies for interconnecting in very-large-scale integrated (VLSI) circuits. Document also discusses current and proposed research into novel fabrication techniques for interconnections.

Wade, T. E.↗
NASA NTRS1982

Blanket technology

It was concluded that systems requirements would force a reassessment of the conventional approach to interconnecting cells into blanket or array modules. Defense applications (hardening) were identified as the key requirement that would force a movement away from the standard method (solder) of forming array circuits. The panel also agreed that requirements associated with the impending NASA Space Station and in-bound missions would lead to alternative interconnecting approaches. It was concluded that the diverse requirements of future space missions (high temperature and extended thermal cycling) might not be met by one approach, such as parallel-gap resistance welding. The panel suggested that other options such as high temperature solders and brazing be considered for the various mission requirements that were anticipated. The panel agreed that blanket technology was potentially suitable for in-orbit annealing to temperatures of 200 C provided that conventional soldered connecting techniques were replaced by "welding".

Scott-Monck, J.↗
NASA NTRS1983

Reaction of cobalt in SO2 atmospheric at elevated temperatures

The reaction rate of cobalt in SO2 argon environments was measured at 650 C, 700 C, 750 C and 800 C. Product scales consist primarily of an interconnected sulfide phase in an oxide matrix. At 700 C to 800 C a thin sulfide layer adjacent to the metal is also observed. At all temperatures, the rapid diffusion of cobalt outward through the interconnected sulfide appears to be important. At 650 C, the reaction rate slows dramatically after five minutes due to a change in the distribution of these sulfides. At 700 C and 750 C the reaction is primarily diffusion controlled values of diffusivity of cobalt (CoS) calculated from this work show favorable agreement with values of diffusivity of cobalt (CoS) calculated from previous sulfidation work. At 800 C, a surface step becomes rate limiting.

Jacobson, N. S.↗
NASA NTRS1982

U.S. welding technology - Constraints to space implementation

U.S. and European efforts to develop welding techniques for satellite solar arrays are described. Soldering practices in the U.S. have benefitted from Mo solders, which are well fitted to Si solar cell material thermal characteristics. Analyses have indicated that welds are the preferred method for interconnections and bonds. Extensive work has been done with the parallel gap resistance method (RW), which involves process heat generated by passing a current through resistive layers. Confining the primary heat input to the interconnector/cell contact interface results in welds being formed beneath both electrodes. Pulse welding has become the dominant RW technique in Europe, while ultrasonic welding is used in the U.S.; silver is employed as the interconnect material on both continents. The bonding techniques have been developed empirically instead of theoretically. An IR inspection technique has been produced for monitoring the weld temperature.

Stella, P. M.↗