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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 91 records · Page 5

Thermoelectric coolers for high-power-density 3D electronics heat management

Future advancements in three-dimensional (3D) electronics require robust thermal management methodology. Thermoelectric coolers (TECs) are reliable and solid-state heat pumping devices with high cooling capacity that can meet the requirements of emerging 3D microelectronic devices. In this work, we first provide the design of TECs for electronics cooling using a computational model and then experimentally validate the main predictions. Key device parameters such as device thickness, leg density, and contact resistance were studied to understand their influence on the performance of TECs. Our results show that it is possible to achieve high cooling power density through optimization of TE leg height and packing density. Scaling of TECs is shown to provide ultra-high cooling power density.

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATI↗

Dielectrics for Power Electronics Applications

This presentation discusses the role of dielectric materials in power electronic packages. Two dielectric technologies - a dielectric material film-based substrate for insulation and a dielectric coolant - are discussed. The thermal performance benefits of dielectric film-based substrate in comparison with traditional direct-bond-copper substrates are studied through finite element analysis. Also, a novel cooling concept based on dielectric liquids that can contact electrically active surfaces are presented.

30 DIRECT ENERGY CONVERSION↗

Electron thermalization and relaxation in laser-heated nickel by few-femtosecond core-level transient absorption spectroscopy

Direct measurements of photoexcited carrier dynamics in nickel are made using few-femtosecond extreme ultraviolet (XUV) transient absorption spectroscopy at the nickel M 2,3 edge. It is observed that the core-level absorption line shape of photoexcited nickel can be described by a Gaussian broadening (σ) and a red shift (ω s ) of the ground-state absorption spectrum. Theory predicts and the experimental results verify that after initial rapid carrier thermalization, the electron temperature increase (ΔT ) is linearly proportional to the Gaussian broadening factor σ, providing quantitative real-time tracking of the relaxation of the electron temperature. Measurements reveal an electron cooling time for 50 nm thick polycrystalline nickel films of 640 ± 80 fs. With hot thermalized carriers, the spectral red shift exhibits a power-law relationship with the change in electron temperature of ω s ∝ ΔT 1.5 . Rapid electron thermalization via carrier-carrier scattering accompanies and follows the nominal 4-fs photoexcitation pulse until the carriers reach a quasithermal equilibrium. Entwined with a <6 fs instrument response function, carrier thermalization times ranging from 34 fs to 13 fs are estimated from experimental data acquired at different pump fluences and it is observed that the electron thermalization time decreases with increasing pump fluence. Here, the study provides an initial example of measuring electron temperature and thermalization in metals in real time with XUV light, and it lays a foundation for further investigation of photoinduced phase transitions and carrier transport in metals with core-level absorption spectroscopy.

75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND↗

Beam physics research with the IOTA electron lens

The electron lens in the Fermilab Integrable Optics Test Accelerator (IOTA) will enable new research in nonlinear integrable optics, space-charge compensation, electron cooling, and the stability of intense beams. This research addresses scientific questions on high-brightness beams and operational challenges of high-power accelerators for nuclear and particle physics. We review the roles that electron lenses play in this field and the physical principles behind their applications. The design criteria and specifications for the IOTA storage ring and electron lens are then discussed. We conclude with a description of the components of the apparatus.

43 PARTICLE ACCELERATORS↗

Designing Energy-Efficient Quantum Computers Through Prediction and Reduction of Cooling Requirements for Cryogenic Electronics

Quantum computing has been identified as a “wild card” by the International Energy Agency in predicting future global data center energy usage. This is primarily because both uncertainty in the extent to which quantum computing will be adopted, and uncertainty in the power consumption of individual quantum data centers. Unlike the classical counterparts, quantum computers need to be maintained at near absolute zero, requiring energy-intensive cryogenic cooling systems. Therefore, as quantum computers scale up from existing 50 qubit technology demonstrations to the 10,000 to 100,000 qubit systems that will be able to solve complex problems, the energy consumption of both the electronics and the required cooling systems will also increase. To predict this scaling, this work analyzes the energy requirements for both computation and cooling of quantum hardware. We show that the energy requirements for cooling of quantum computers is determined by several computing system parameters, including the number and type of physical qubits, the operating temperature, the packaging efficiency of the system, and the split between circuits operating at cryogenic temperatures and those operating at room temperature. The energy requirements can then be found based on thermal system parameters such as cooling efficiency and cryostat heat transfer. Analysis of these parameters shows that the energy required for cooling is significantly larger than that required for computation, a reversal from energy usage patterns seen in conventional computing. The results and discussions provide a road-map for creating energy efficient quantum computers through the selection of computer architectures and cryogenic system configurations that minimize cooling requirements.

energy efficiency↗

Modular Coaxial Power Converter for High-Density Integration into Medium-Voltage Cables

This work proposes to combine the functionality benefits of power electronics with the power density benefits of medium-voltage cables to create a streamlined, high-density power electronics solution that seamlessly integrates with medium-voltage cables. Located at the ends of a medium- or high-voltage line, the proposed converter uses a cascade of coaxial power conversion cells to gradually step down the voltage, and excels in high step-down applications. By mimicking the coaxial geometry of medium-voltage cables, the converter preserves the axisymmetric electric field of the cable which, when combined with a solid insulating dielectric, provides a voltage scaling advantage over conventional planar and PCB-based converter solutions. Similar to medium voltage cables, the converter is fully passively cooled. A passive cooling strategy allows for combined installation with existing medium voltage cable systems without the added cost, maintenance needs, infrastructure, and reliability concerns associated with active cooling systems. The scalability of the modular structure in combination with the integration benefits provide a flexible power electronics system that can adapt to the evolving demands of the grid.

coaxial power conversion cells↗

An Integrated Traction Drive with a High Speed Surface Permanent Magnet External Rotor Motor for Electric Vehicles

This work presents the detailed design of an outer rotor motor and integrated drive for passenger electric vehicles. The motor uses non-heavy rare earth permanent magnets and operates at a top speed of 20,000rpm. In-slot ceramic heat exchangers are utilized for the cooling of the windings. The external rotor configuration of the motor leaves a significant amount of space in the stator bore, which is leveraged for the integration of the power electronics. A high speed external rotor motor creates a number of mechanical, thermal and assembly challenges and this work presents detailed thermal, mechanical and rotordynamics analysis.

ADVANCED PROPULSION SYSTEMS↗

SRF E - Beam Accelerator for Metal Additive Manufacturing [Patent]

A system and apparatus for electron beam melting comprises a superconducting radio frequency accelerator configured to produce an electron beam, a conduction cooling system configured to cool the superconducting radio frequency accelerator, and an electron beam melting system wherein the electron beam melts power in a build chamber of the electron beam melting apparatus.

43 PARTICLE ACCELERATORS↗

SRF e-beam accelerator for metal additive manufacturing

A system and apparatus for electron beam melting comprises a superconducting radio frequency accelerator configured to produce an electron beam, a conduction cooling system configured to cool the superconducting radio frequency accelerator, and an electron beam melting system wherein the electron beam melts power in a build chamber of the electron beam melting apparatus.

Thangaraj, Jayakar C.↗

Electron subband degeneracy heat pump for cryogenic cooling

An unconventional method of solid-state cryogenic cooling utilizing the electron subband degeneracy of semiconductor heterostructures is discussed in this Letter. The working principle of using the electrons as the working medium to perform cyclic heat pumping under electrostatic subband "expansion" and "compression" is discussed. The calculated base temperature can reach below dilution refrigeration temperatures with the fundamental limit set by electron-phonon interaction. Using an ultra-wide GaAs quantum well as an example, the cooling power per unit volume is estimated to reach $0.85\ \rm \mu W/cm^3$ at $25\ \rm mK$ with a hot-side temperature of $42.5\ \rm mK$, suitable for applications such as quantum computing.

Wang, Chulin↗

Thermal and Mechanical Design of a High-Voltage Power Electronics Package

This paper presents the thermal and mechanical design aspects of a power electronics package with 5-kV GaN devices. Through finite element analyses, we investigated the impact of different cooling configurations and device locations on the thermal performance and reliability of the package. We found that placing the devices closer to the direct bond copper substrate as opposed to a centered approach in the proposed double-sided cooling configuration resulted in improved heat dissipation. This approach also reduced the total number of attachment layers, thereby likely improving the reliability of the package. Furthermore, simulations revealed that the device location had a negligible impact on the thermomechanical behavior of the attachment layers, as they are more prone to the local coefficient of thermal expansion mismatch.

electronic packaging↗

High Energy ERLs for Electron Cooling

Future electron-ion colliders such as the recently approved eRHIC collide high-intensity ion beams with high current electron beams. The electron beams take advantage of synchrotron radiation to damp emittances but the ion beams must be cooled via some beam-cooling mechanism, including electron cooling. The ion energies are typically a few hundreds of GeV per nucleon. At this energy, a DC cooler powered by an electrostatic accelerator, the preferred cooling approach on existing machines, is not feasible. An ERL, in principle, can provide the high current and brightness to cool these high-brightness ion beams. The beam quality requirements are much different from previous ERLs designs used for FELs. The cooling bunch must be very long to match the ion beam and the relative energy spread must be very small. Incoherent cooling can be enhanced with magnetized beams, but the magnetization must be maintained throughout the ERL. An alternate cooling mechanism, the so-called Coherent Electron Cooling, is, in principle, stronger and can be done with non-magnetized beams. We will present two applications of an ERL to high energy electron cooling and describe some of the technical challenges that must be overcome to operate such an ERL

Benson, Stephen↗

High efficiency compact microwave sources using electrostatic potential depression

In this article, we report theoretical and design studies on the application of an electrostatic potential depression (EPD) on two types of traditional microwave sources, the klystron and the inductive output tube (IOT), both operating in the UHF band. Additionally, the EPD is implemented by a section of the metallic beam pipe on which a direct current (dc) negative high voltage is applied. Inside the EPD section, the modulated electron beam develops into bunches over a very short longitudinal distance, indicating a possible design approach for a compact device. With the application of an EPD, the peak value of the first harmonic current in a microwave tube can be further increased compared to that in a conventional design, suggesting higher circuit efficiency. As the electron beam leaves the EPD section, the reacceleration of the beam provides a longitudinal cooling effect. With the addition of an EPD, circuit power extraction efficiency above 80% is achieved in both the modified design of the IOT and the novel conceptual circuit design of the klystron.

42 ENGINEERING↗

Higher-order phonon scattering: advancing the quantum theory of phonon linewidth, thermal conductivity and thermal radiative properties

Phonon scattering plays a central role in the quantum theory of phonon linewidth, which in turn governs important properties including infrared spectra, Raman spectra, lattice thermal conductivity, thermal radiative properties, and also signifi- cantly affects other important processes such as hot electron relaxation. Since Maradudin and Fein’s classic work in 1962, three-phonon scattering had been considered as the dominant intrinsic phonon scattering mechanism and has seen tremendous advances. However, the role of the higher-order four-phonon scattering had been persistently unclear and so was ignored. The tremendous complexity of the formalism and computational challenges stood in the way, prohibiting the direct and quantitative treatment of four-phonon scattering. In 2016, a rigorous four-phonon scattering formalism was developed, and the prediction was realized using empirical potentials. In 2017, the method was extended using first-principles calculated force constants, and the thermal conductivities of boron arsenides (BAs), Si and diamond were predicted. The predictions for BAs were later confirmed by several independent experiments. Four-phonon scattering has since been investigated in a range of materials and established as an important intrinsic scattering mechanism for thermal transport and radiative properties. Specifically, four-phonon scattering is important when the fourth-order scattering potential or phase space becomes relatively large. The former scenario includes: (i) nearly all materials when the temperature is high; (ii) strongly anharmonic (low thermal conductivity) materials, including most rocksalt compounds, halides, hydrides, chalcogenides and oxides. The latter scenario includes: (iii) materials with large acoustic–optical phonon band gaps, such as XY compounds with a large atomic mass ratio between X and Y; (iv) two- dimensional materials with reflection symmetry, such as single-layer graphene, single-layer boron nitride and carbon nanotubes; and (v) phonons with a large density of states, such as optical phonons, which are important for Raman, infrared and thermal radiative properties. Four-phonon scattering is expected to gain broad interest in various technologically important materials for thermoelectrics, thermal barrier coatings, thermal energy storage, phase change, nuclear power, ultra-high temperature ceramics, infrared spectra, Raman spectra, radiative transport, hot electron relaxation and radiative cooling. Four-phonon scattering has been, and will continue to be, established as an important intrinsic phonon scattering mechanism beyond three-phonon scattering. The prediction of four-phonon scattering will transition from a breakthrough to a new routine in the next decade.

Feng, Tianli↗

Nb$_{3}$Sn SRF Photogun High Power Test at Cryogenic Temperatures

Superconducting RF (SRF) photoguns are emerging as promising candidates to produce highly stable electrons for Ultra fast Electron Diffraction/Microscopy (EUD/UEM) applications due to the ultrahigh shot-to-shot stability compared to room temperature RF photoguns. SRF technology was prohibitively expensive for industrial use until two recent advancements: Nb 3 Sn and conduction cooling. SRF gun can provide a CW operation capability while consuming only several Watts of RF power which eliminates the need of an expensive high power RF system and saves a facility footprint. Euclid is developing a continuous wave (CW), 1.5-cell, MeV-scale SRF conduction cooled photogun operating at 1.3 GHz. Here, in this paper, we present first high power results of the gun covered with Nb 3 Sn.

43 PARTICLE ACCELERATORS↗

Thermal and Mechanical Design of a High-Voltage Power Electronics Package: Preprint

Thermal and mechanical design aspects of a power electronic package with 5-kV GaN devices are presented. Through finite element analyses, the impact of different cooling configurations and device location on the thermal performance and reliability of the package was investigated. It was found that placing the devices closer to the direct-bond-copper substrate as opposed to a centered approach in the proposed double-sided-cooling configuration resulted in improved heat dissipation. This approach also reduced the total number of attachment layers, thereby likely improving the reliability of the package. Furthermore, simulations revealed that the device location had a negligible impact on the thermomechanical behavior of the attachment layers, as they are more prone to the local coefficient of thermal expansion mismatch.

27 ARPA - Advanced Research Projects Agency-Energy↗

An ultrafast laser pulse picker technique for high-average-current high-brightness photoinjectors

Beam diagnostics in high brightness photoinjectors requires that optical pulses from a high-power drive laser be picked up with an ultrahigh pulse contrast ratio and without temporal profile distortion. In high-average-current high-brightness photoinjectors, high-power drive lasers are routinely operated at GHz-level pulse repetition rate and it is challenging to achieve pulse picking without any pulse distortion. Here, we report on a new ultrafast pulse picker technique for beam diagnostics in high-average-current high-brightness photoinjectors. By efficiently combining an ultrafast low-power electro-optic modulator, high-power fiber laser amplifiers, a high-power Pockels Cell, and a frequency doubling module, we have successfully demonstrated optical bunch (30 pulses per bunch) pickup from a 704 MHz high-power drive laser and achieved a 10 6 :1 pulse contrast ratio and nearly zero pulse distortion. The performance of this pulse picking technique has been verified through beam characterization and electron cooling in the low energy RHIC electron cooling accelerator at Brookhaven National Laboratory.

43 PARTICLE ACCELERATORS↗

Experimental study of a thermal energy storage-integrated heat pump system for load shifting in space cooling and heating

This study experimentally investigates an all-season thermal energy storage-integrated heat pump (TES-HP) system developed to enhance building energy efficiency and support grid-interactive operation through load shifting in both cooling and heating. A 4-ton commercial rooftop air-source heat pump was modified by integrating a hydronic thermal energy storage (TES) unit containing a phase change material (PCM) with a melting temperature of 22.0 °C. The system employs two reversing valves and three electronic expansion valves to enable six operating modes, including normal, TES charging, and TES discharging in both cooling and heating seasons. A subcooling-controlled electronic expansion valve was implemented to mitigate refrigerant maldistribution caused by unequal internal volumes among the heat exchangers. Compared with a baseline heat pump, the TES-HP reduced power consumption by 30–50% during cooling at an ambient temperature of 40.6 °C, and by up to 60% during heating at −15.0 °C, while maintaining high performance under cold-climate conditions. Additionaly to experimental evaluation, a simplified annualized on-peak analysis was conducted to compare the TES-HP with the baseline system, indicating an on-peak electricity reduction of approximately 876 kWhₑ per unit per year and associated on-peak cost savings under time-of-use pricing. These results demonstrate that the TES-HP effectively decouples HP operation from adverse ambient conditions, improving flexibility, resilience, and energy efficiency. This work advances prior research by experimentally proving the integration of PCM-based TES for a year-round, load-flexible HVAC operation.

42 ENGINEERING↗