Dielectrics for Power Electronics Applications

Paret, Paul P

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DOE OSTI · 1600919

Dielectrics for Power Electronics Applications

Paret, Paul P

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Abstract

This presentation discusses the role of dielectric materials in power electronic packages. Two dielectric technologies - a dielectric material film-based substrate for insulation and a dielectric coolant - are discussed. The thermal performance benefits of dielectric film-based substrate in comparison with traditional direct-bond-copper substrates are studied through finite element analysis. Also, a novel cooling concept based on dielectric liquids that can contact electrically active surfaces are presented.

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30 DIRECT ENERGY CONVERSION dielectric cooling dielectric material direct-bond-copper finite element analysis power electronics

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Paret, Paul P. 2020-02-13. Dielectrics for Power Electronics Applications. https://www.osti.gov/biblio/1600919

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