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At least 91 records · Page 5

A New Method of Metallization for Silicon Solar Cells

A low cost ohmic contact on silicon solar cells based on molybdenum-tin metal systems was developed. The approach is based on the formulation of a screenable ink composed from molybdenum oxide and tin mixture. The reduction of Mo03 into Mo and the establishment of Mo 03:Sn ratio is studied. Both tasks were done in an experimental station constructed for this purpose. The results show that molybdenum was formed from its oxide at 800 C. and improved in bonding to silicon at 900 C. A 20% Mo03-80%Sn mixture was converted into metallic coating within this temperature range.

Macha, M.↗

Nonmetallic materials handbook. Volume 1: Epoxy materials

Thermochemical and other properties data is presented for the following types of epoxy materials: adhesives, coatings finishes, inks, electrical insulation, encapsulants, sealants, composite laminates, tapes, and thermal insulators.

Podlaseck, S. E.↗

Development of Economical Improved Thick Film Solar Cell Contact

Materials were surveyed to provide candidates for an all metal electrode paste system. These consisted of a major constituent metal powder, a low melting metal powder suitable for a liquid phase sintering medium, and a powder material suitable as an etchant for silicon dioxide at sintering temperatures. By means of thermal gravimetric analysis a suitable binder was identified for low temperature fired inks.

Ross, B.↗

A New Method of Metallization for Silicon Solar Cells

The determination of the firing cycle in a horizontal tube furnace for MoO3: Sn ink composition applied by silk screening process on P or N structured solar cells is presented. In comparison with the strip heater used to determine the reaction mechanism, the reduction of MoO3 in the tube furnace progresses at a much faster rate and the Sn:Mo alloy forms at a much lower temperature. The device characteristics determined by the V-I curve showed a high resistance (approx. 10 Ohms) at peak temperatures between 600 C and 800 C. The high series resistance is attributed to the lack of formation of MoSi2 within the used temperature range.

Macha, M.↗

A new method of metallization for silicon solar cells

The new metallization process based on Mo-Sn system was studied. The reaction mechanism of MoO3 and its mixture with Sn was examined. The basic ink composition was modified in order to obtain a low ohmic contact to the cell. The electrical characteristics of the cells were comparable with the existing metallization processes. However, in comparison with the standard processes using silver as the contacting metal, the saving obtained by the use of the new process was substantial.

Macha, M.↗

Effects of hypokinesia and hypodynamia on the intraorganic arteries of the heart

The experiments were performed on rabbits kept in small cages for 2-12 weeks. Their motor activity was greatly restricted. The arteries of the heart were injected with an India ink-gelatine mass; injection was directly into the coronary arteries. After fixation in 10% formaline solution 120 micron sections were cut. These were cleared by the Malygin method and examined with a light microscope. After exposure to hypokinetic conditions the picture of the cardiac arterial bed changed. During the first weeks the capillaries of the myocardium were significantly constricted, their course becoming sinuous. With prolonged exposure to hypokinetic conditions the vessels were found to dilate gradually and myocardial architectonics changed.

Aleksina, L. A.↗

Assembling Multicolor Printing Plates

Improved joining method uses wave-soldering techniques developed for integrated-circuit-board assemblies. Thermosetting plastic is replaced by wave soldering, which applies a thin even coat of solder to mating copper surfaces. This is done after ink holes and channels have been protected by water-soluble, high-temperature solder mask which prevents wetting and clogging.

Waters, W. J.↗

A cause of the non-solderability of ceramic capacitor terminations

The results of an analysis into the cause of the non-solderability of multiple defective part lots from two capacitor manufacturers are described. This analysis consisted of visual, scanning electron microscopic, surface, and metalographic examinations and analyses. The results indicated that non-solderability results from areas of excess porosity in the termination which are caused by segregation of ink constituents during manufacturing. This segregation can be minimized by proper monitoring and control of process variables; where excess porosity does occur, solderability can be improved by proper precleaning of parts.

Cozzolino, M. J.↗

Proceedings of the Second International Colloquium on Drops and Bubbles

Applications of bubble and drop technologies are discussed and include: low gravity manufacturing, containerless melts, microballoon fabrication, ink printers, laser fusion targets, generation of organic glass and metal shells, and space processing. The fluid dynamics of bubbles and drops were examined. Thermomigration, capillary flow, and interfacial tension are discussed. Techniques for drop control are presented and include drop size control and drop shape control.

Lecroissette, D. H.↗

Plated Metal Powders for Electrode Pastes

Metal grains to be sintered precoated with frit metal. Coated metal powders used to make ink-like electrode pastes for printing and sintering electrode-fabrication process. Grains of base metal coated with lowmelting-point--, lead or tin-- by electroless deposition.

Bickler, D. B.↗

Comparison of visualized turbine endwall secondary flows and measured heat transfer patterns

Various flow visualization techniques were used to define the secondary flows near the endwall in a large heat transfer data. A comparison of the visualized flow patterns and the measured Stanton number distribution was made for cases where the inlet Reynolds number and exit Mach number were matched. Flows were visualized by using neutrally buoyant helium-filled soap bubbles, by using smoke from oil soaked cigars, and by a few techniques using permanent marker pen ink dots and synthetic wintergreen oil. Details of the horseshoe vortex and secondary flows can be directly compared with heat transfer distribution. Near the cascade entrance there is an obvious correlation between the two sets of data, but well into the passage the effect of secondary flow is not as obvious.

Gaugler, R. E.↗

A new surface-streamline flow-visualization technique

This paper describes a new surface-streamline flow-visualization technique that is suitable for use in low-speed wind tunnels or other low-speed gas flows. The technique provides a permanent record of ink traces that show surface-streamline direction and shape. The visualization of the endwall surface flow of the horseshoe-vortex system formed around the base of a cylinder by a separating turbulent boundary layer is used as an example. The results of the new technique are compared with those obtained from a conventional flow-visualization technique. Good agreement was found between the two, with the new technique appearing to give more-accurate surface streamlines.

Langston, L. S.↗

Comparison of visualized turbine endwall secondary flows and measured heat transfer patterns

Various flow visualization techniques were used to define the seondary flows near the endwall in a large heat transfer data. A comparison of the visualized flow patterns and the measured Stanton number distribution was made for cases where the inlet Reynolds number and exit Mach number were matched. Flows were visualized by using neutrally buoyant helium-filled soap bubbles, by using smoke from oil soaked cigars, and by a few techniques using permanent marker pen ink dots and synthetic wintergreen oil. Details of the horseshoe vortex and secondary flows can be directly compared with heat transfer distribution. Near the cascade entrance there is an obvious correlation between the two sets of data, but well into the passage the effect of secondary flow is not as obvious. Previously announced in STAR as N83-14435

Gaugler, R. E.↗

Melt Stirring by Horizontal Crucible Vibration

Horizontal vibration suggested as technique for more effective stirring of melts in crystal-growth apparatus. Vibrational technique may replace accelerated crucible rotation. Potential superiority of vibrational technique shown by preliminary experiments in which ink stirred into water.

Wolf, M. F.↗

MOD silver metallization for photovoltaics

The development of flat plate solar arrays is reported. Photovoltaic cells require back side metallization and a collector grid system on the front surface. Metallo-organic decomposition (MOD) silver films can eliminate most of the present problems with silver conductors. The objectives are to: (1) identify and characterize suitable MO compounds; (2) develop generic synthesis procedures for the MO compounds; (3) develop generic fabrication procedures to screen printable MOD silver inks; (4) optimize processing conditions to produce grid patterns and photovoltaic cells; and (5) develop a model which describes the adhesion between the fired silver film and the silicon surface.

Vest, G. M.↗

Multipurpose Scribing and Drawing Tool

Two-part tool reconfigured for variety of jobs. Tool performs several functions useful in layout. Lines, curves, and angles made visible as either bright scribe marks or as dark pencil (or ink) marks. Multipurpose tool speeds up laying out of patterns on sheet metal, wood, plastic, or paper. Tool is carried in pocket, then quickly assembled for service as height gauge, pair of dividers, protractor, surface gauge, or square.

Ellis, J. M.↗

Thermally-Activated Metal-to-Glass Bonding

Hermetic seals formed easily by use of metallo-organic film. Metallo-organic film thermally bonded to glass and soldered or welded to form hermetic seal. Film applied as ink consisting of silver neodecanoate in xylene. Relative amounts of ingredients selected to obtain desired viscosity. Material applied by printing or even by scribing with pen. Sealing technique useful in making solar-cell modules, microelectronic packages, and other hermetic silicon devices.

Gallagher, B. D.↗

Smoother Scribing of Silicon Wafers

Proposed new tool used to scribe silicon wafers into chips more smoothly than before. New scriber produces surface that appears ductile. Scribed groove cuts have relatively smooth walls. Scriber consists of diamond pyramid point on rigid shaft. Ethanol flows through shaft and around point, like ink in ballpoint pen. Ethanol has significantly different effect for scribing silicon than water, used in conventional diamond scribers.

Danyluk, S.↗