NASA NTRS · 19810000237
Assembling Multicolor Printing Plates
Abstract
Improved joining method uses wave-soldering techniques developed for integrated-circuit-board assemblies. Thermosetting plastic is replaced by wave soldering, which applies a thin even coat of solder to mating copper surfaces. This is done after ink holes and channels have been protected by water-soluble, high-temperature solder mask which prevents wetting and clogging.
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Waters, W. J.. 1982-11-01. Assembling Multicolor Printing Plates. https://ntrs.nasa.gov/citations/19810000237
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