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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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DOE OSTI2018

Enabling Advanced Power Electronics Technologies for the Next Generation Electric Utility Grid (Workshop Summary Report)

The role of power electronics in the utility grid is continually expanding. As converter design processes mature and new advanced materials become available, the pace of industry adoption is poised to accelerate. Looking forward, we can envision a future in which power electronics are as integral to grid functionality as the transformer is today. The Enabling Advanced Power Electronics Technologies for the Next Generation Electric Utility Grid Workshop was organized by Sandia National Laboratories and held in Albuquerque, New Mexico, July 17 - 18, 2018 . The workshop helped attendees to gain a broader understanding of power electronics R&D needs—from materials to systems—for the next generation electric utility grid. This report summarizes discussions and presentations from the workshop and identifies opportunities for future efforts.

24 POWER TRANSMISSION AND DISTRIBUTION↗

DOE OSTI2015

Advanced Power Electronics and Electric Motors Annual Report -- 2013

This report describes the research into advanced liquid cooling, integrated power module cooling, high temperature air cooled power electronics, two-phase cooling for power electronics, and electric motor thermal management by NREL's Power Electronics group in FY13.

30 DIRECT ENERGY CONVERSION↗

DOE OSTI2026

NREL Overview of Grid-Tied Power Electronics

This presentation focuses on the power electronics related research efforts carried out by researchers at the Power Systems Engineering Center at NREL.

24 POWER TRANSMISSION AND DISTRIBUTION↗

NASA NTRS1992

The 10 kW power electronics for hydrogen arcjets

A combination of emerging mission considerations such as 'launch on schedule', resource limitations, and the development of higher power spacecraft busses has resulted in renewed interest in high power hydrogen arcjet systems with specific impulses greater than 1000 s for Earth-space orbit transfer and maneuver applications. Solar electric propulsion systems with about 10 kW of power appear to offer payload benefits at acceptable trip times. This work outlines the design and development of 10 kW hydrogen arcjet power electronics and results of arcjet integration testing. The power electronics incorporated a full bridge switching topology similar to that employed in state of the art 5 kW power electronics, and the output filter included an output current averaging inductor with an integral pulse generation winding for arcjet ignition. Phase shifted, pulse width modulation with current mode control was used to regulate the current delivered to arcjet, and a low inductance power stage minimized switching transients. Hybrid power Metal Oxide Semiconductor Field Effect Transistors were used to minimize conduction losses. Switching losses were minimized using a fast response, optically isolated, totem-pole gate drive circuit. The input bus voltage for the unit was 150 V, with a maximum output voltage of 225 V. The switching frequency of 20 kHz was a compromise between mass savings and higher efficiency. Power conversion efficiencies in excess of 0.94 were demonstrated, along with steady state load current regulation of 1 percent. The power electronics were successfully integrated with a 10 kW laboratory hydrogen arcjet, and reliable, nondestructive starts and transitions to steady state operation were demonstrated. The estimated specific mass for a flight packaged unit was 2 kg/kW.

Hamley, John A.↗

DOE OSTI2023

Power Electronics Cooling Technology Research at NREL

This presentation describes power electronics thermal management technologies used for on-road EVs. Examples are provided and heat exchangers are described. Advanced cooling technologies developed are NREL to enable increased power density and enable high WBG temperature operation are then presented. The performance (e.g., thermal resistance, pumping power) of the advanced power electronics cooling technologies are compared to the performance of current, on-road technology.

DIRECT ENERGY CONVERSION↗

DOE OSTI2020

Automotive Power Electronics and Electric Machine Thermal Management

The transition to modular and scalable electrified vehicle transportation requires technologies to improve power density within cost and reliability constraints to maximize vehicle platform flexibility. Key research challenges arise due to the limited packaging space, coolant distribution, electrical connections, and ambient temperatures. Challenges include thermal management for compact power-dense electric machines and the associated power electronics for power management within the vehicle. High-temperature silicon and wide-bandgap (WBG) based power electronics systems are of interest to enable compact and efficient electric drive systems. The higher temperatures present packaging challenges for thermal management and reliability. In this work, we provide an overview of research for thermal characteristics of materials, packages and thermal management approaches for enabling compact power dense automotive electric drive systems.

DIRECT ENERGY CONVERSION↗

DOE OSTI2022

Automotive Power Electronics Cooling Technology Research at NREL

ADVANCED PROPULSION SYSTEMS↗

NASA NTRS2001

A Survey of Power Electronics Applications in Aerospace Technologies

The insertion of power electronics in aerospace technologies is becoming widespread. The application of semiconductor devices and electronic converters, as summarized in this paper, includes the International Space Station, satellite power system, and motor drives in 'more electric' technology applied to aircraft, starter/generators and reusable launch vehicles. Flywheels, servo systems embodying electromechanical actuation, and spacecraft on-board electric propulsion are discussed. Continued inroad by power electronics depends on resolving incompatibility of using variable frequency for 400 Hz-operated aircraft equipment. Dual-use electronic modules should reduce system development cost.

Kankam, M. David↗

DOE OSTI2015

Subcooled Boiling Heat Transfer for Cooling of Power Electronics in Hybrid Electric Vehicles

At present, single-phase liquid, forced convection cooled heat sinks with fins are used to cool power electronics in hybrid electric vehicles (HEVs). Although use of fins in the cooling channels increases heat transfer rates considerably, a second low-temperature radiator and associated pumping system are still required in HEVs. This additional cooling system adds weight and cost while decreasing the efficiency of HEVs. With the objective of eliminating this additional low-temperature radiator and pumping system in HEVs, an alternative cooling technology, subcooled boiling in the cooling channels, was investigated in the present study. Numerical heat transfer simulations were performed using subcooled boiling in the power electronics cooling channels with the coolant supplied from the existing main engine cooling system. Results show that this subcooled boiling system is capable of removing 25% more heat from the power electronics than the conventional forced convection cooling technology, or it can reduce the junction temperature of the power electronics at the current heat removal rate. With the 25% increased heat transfer option, high heat fluxes up to 250 W/cm(2) (typical for wideband-gap semiconductor applications) are possible by using the subcooled boiling system.

Heat transfer simulations↗

DOE OSTI2022

Start-up Optimization Considering Integrated Power Electronic Systems

The startup of systems composed of power electronic systems is becoming more complex. As the systems grow, standard pre-configuration sequencing methods will struggle. This work proposes a linear programming optimization method to couple power electronic systems in a series of startup commands. This formulation is demonstrated in a real-time implementation on hardware.

Starke, Michael↗

DOE OSTI2023

Automated Design-for-Reliability of a Power Electronics Module

The design of a power electronics module is a multiphysics problem and involves electrical, thermal, and reliability targets and constraints. Although the electrical and thermal design consider multiple aspects such as materials, geometry, and energy losses, reliability design is often limited to the selection of the attachment materials and electrical interconnect types. In this paper, we incorporate reliability metrics in the design phase by investigating the impact of package geometry on the thermomechanical behavior of the die-attachment material. To this end, we conducted thermal and power cycling simulations of a commercial six-pack power module with silicon carbide devices to compute junction temperature and strain energy density per cycle, respectively. We performed multiple simulations with different geometric dimensions and established a correlation between input features and output variables using subspace-based dimension reduction. The machine learning-based dimension reduction method serves as a surrogate model, which can be employed to identify the optimal module design from a thermal and reliability standpoint.

design-for-reliability↗

DOE OSTI2022

A 1kV, 480V Power Electronics Hub for DER Integration in Commercial Buildings

Power electronic (PE) systems are increasingly being integrated into distribution and sub-distribution networks in support of distributed energy resource integration (DERs), electric vehicle (EV) charging (particularly in the case of fast charging infrastructure), and improvement in power quality for high performance computing and/or servers farms. This provides an opportunity to research and develop integrated PE systems that can function as single systems thereby bringing additional functionality and benefits to the overall system. The goal of this paper is to demonstrate foundational technologies and capabilities for a multiport power electronics energy hub that can intelligently coordinate and control integrated sources and loads. The focus for this digest is on a commercial building use case which is demonstrated in hardware.

Starke, Michael↗

NASA NTRS2008

Development of a Power Electronics Controller for the Advanced Stirling Radioisotope Generator

Under a U.S. Department of Energy program for radioisotope power systems, Lockheed Martin is developing an Engineering Unit of the Advanced Stirling Radioisotope Generator (ASRG). This is an advanced version of the previously reported SRG110 generator. The ASRG uses Advanced Stirling Convertors (ASCs) developed by Sunpower Incorporated under a NASA Research Announcement contract. The ASRG makes use of a Stirling controller based on power electronics that eliminates the tuning capacitors. The power electronics controller synchronizes dual-opposed convertors and maintains a fixed frequency operating point. The controller is single-fault tolerant and uses high-frequency pulse width modulation to create the sinusoidal currents that are nearly in phase with the piston velocity, eliminating the need for large series tuning capacitors. Sunpower supports this effort through an extension of their controller development intended for other applications. Glenn Research Center (GRC) supports this effort through system dynamic modeling, analysis and test support. The ASRG design arrived at a new baseline based on a system-level trade study and extensive feedback from mission planners on the necessity of single-fault tolerance. This paper presents the baseline design with an emphasis on the power electronics controller detailed design concept that will meet space mission requirements including single fault tolerance.

Leland, Douglas K.↗

DOE OSTI2019

Networked Control and Optimization for Widescale Integration of Power Electronic Devices in Residential Homes

Power electronics devices are emerging at residential houses, including electric vehicles, energy storage systems, solar photovoltaic systems, and variable-speed air conditioners. Little work has been done on scalable and end-to-end architectures for integrating and engaging large number of residential behind-the-meter assets to provide grid services. In this paper, a framework for integration of a demand management system, home energy management system, and residential smart inverters is presented. Full measured results of inverter response to control signals is also presented.

Starke, Michael↗

DOE OSTI2024

A graphical user interface platform to support power electronic converters and integrated systems

Power Electronic Systems have grown in size and complexity over the past years. Therefore, users require interfaces to properly configure, develop, and deploy these systems. This work presents a Graphical User Interface that dynamically adapts to the system and allows the user to control and monitor its operation. This GUI uses networked communication and open-source Python libraries to allow the user to interact with the system at its different hierarchical layers, as well as visualize the interconnection of the full system. This is demonstrated by showing the user interface applied to a megawatt class charging station that consists of various energy resources.

Dean, Ben↗

DOE OSTI2023

Jet impingement manifolds for cooling power electronics modules

The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.

Moreno, Gilberto↗

DOE OSTI2019

Flexible Intelligent Real-time dc-ac grid Emulator (FIRE): Power Electronic Hardware-in-the-Loop (PE-HIL) Amplifier

Grid modernization efforts are leading to increased penetration of power electronics in the existing alternating current (ac) bulk power systems (BPS). Some examples of power electronics based applications that are being developed in BPS include high-voltage direct current (HVdc) systems, renewable generation systems, energy storage systems, and others. One of the requirements to succeed in the goals of grid modernization (like increased efficiency and reliability) is to setup a platform that can evaluate basic building blocks of such systems. For example, the basic building block of a modular multilevel converter (MMC)-based HVdc system is a submodule (SM). The evaluation platform will provide means to innovate new SM circuit architectures, new semiconductor devices in the SM, new gate-drivers, new controllers, and others. The flexible intelligent real-time dc-ac grid emulator (FIRE) platform incorporates the evaluation capability to evaluate the basic building blocks. The FIRE platform incorporates this evaluation capability through the power electronic hardware-in-the-loop (PE-HIL) concept. The PE-HIL for MMC-HVdc system can evaluate SMs in the MMC. In this paper, the design of amplifier required to perform PE-HIL simulation is presented. Experimental results of the amplifier and the simulation results of the PE-HIL concept utilizing the amplifier are presented.

Debnath, Suman↗

DOE OSTI2020

Parametric Design Study of a Power Electronics Package for Improving Solder Joint Reliability

The lifetime of a power electronics package is, to a large extent, determined by the reliability of its bonded interfaces under major loading conditions in an operational environment. Based on the application-level requirements of the package, bonded interface material is selected based on the results obtained from accelerated tests such as thermal cycling and power cycling. In addition to evaluating the reliability through accelerated tests, it is important to consider the impact of other component layers on the thermomechanical performance of the interface material, both from a material and geometric perspective. The co-efficient of thermal expansion (CTE) mismatch introduced by the use of different materials within a package and its structural design plays a critical role in determining the interface material reliability. In this paper, we present the results of a parametric modeling study of a power electronics package under thermal cycling in which the materials and geometric design of the different component layers were varied with respect to a baseline design to understand their impact on the reliability of the interface material. We chose the volume-averaged strain energy density per cycle computed at the corner region of the interface material as the metric for the reliability comparisons. Our results indicate that in addition to the CTE mismatch, the stiffness of individual component layers has a major impact on reliability. Among the different baseplates that we studied, aluminum silicon-carbide baseplates offered superior reliability over their copper and aluminum counterparts. We also found that the magnitude of the impact of stiffness variation—amongst the adjacent layers—on the reliability of the solder joint is dependent on the inherent CTE mismatch between the layers.

47 OTHER INSTRUMENTATION↗