DOE OSTI · 2222299
Jet impingement manifolds for cooling power electronics modules
Abstract
The present disclosure describes techniques for cooling power electronics in automotive applications. The present disclosure utilizes a jet impingement of a dielectric fluid on electrical interconnections to cool power electronics.
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Moreno, Gilberto, Narumanchi, Sreekant Venkat, Bennion, Kevin Scott, Kotecha, Ramchandra Mahendrabhai, Paret, Paul Philip, Feng, Xuhui. 2023-09-05. Jet impingement manifolds for cooling power electronics modules. https://www.osti.gov/biblio/2222299
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