Development of a microelectronic module Final report
Feasibility of operating gallium arsenide devices in high temperature microelectronic circuits
Doerbeck, F.↗
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Results for “Microelectronics”
Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.
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Microwave microelectronic techniques applied to phase shifters and other control devices Final report, 29 May - 29 Nov. 1968
Microwave microelectronic techniques applied to phase shifters and other control devices
Robinson, G. H.↗
Study of failure and reliability of microelectronic devices Quarterly report, 1 Oct. - 31 Dec. 1968
Environmental test of microelectronic devices for surface defects
Source record↗
Reliability assessment of microcircuits and microelectronic systems.
Microcircuit components and microelectronic systems reliability assessment including short term testing, noting digital systems, packaging, production controls, etc
Hall, E. C.↗
Microelectronic data and control transmission system for dynamic wind-tunnel testing.
Microelectronic data and remote control function transmission system for wind tunnel testing of aircraft dynamic response to gusts and turbulence
Nichols, C. D.↗
Characterization of ceramic materials for microelectronic applications, part 3 Final summary report, 13 Mar. 1968 - 12 Mar. 1969
Surface and grain boundary properties of ceramic materials for microelectronics
Mountvala, A. J.↗
Internal visual workmanship standard for microelectronic devices /NASA STD XX-2/ and training manual, volume 1
Internal visual workmanship standards for monolithic microelectronic devices - criteria definitions
De Miranda, W. R. R.↗
Internal visual workmanship standard for microelectronic devices /NASA STD XX-2/ and training manual, volume 2
Internal visual workmanship standards for monolithic microelectronic devices - training manual
Gaffney, J.↗
Microwave microelectronic techniques applied to phase shifters and other control devices Final report, 29 Jan. 1968 - 29 Aug. 1969
Microwave phase shifters and microwave control devices in microelectronic form
Robinson, G. H.↗
Design and development of microelectronic circuits for stabilization of a gas bearing gyro servo loop Phase completion report
Microelectronic servoamplifier design, tests, and evaluation for stabilizing gas bearing gyro servo loops
Friedman, B.↗
Rotating shaft-mounted microelectronic data system
Microelectronic data system mounted on rotating shaft
Lesco, D. J.↗
Development of an advanced microelectronic connection welding system Final report
Development of microelectronic connection welding system using infrared feedback control
Braswell, R. R.↗
Research achievements review, Volume 3. Report 11 - Microelectronics research for shuttle and space station
Microelectronic research and technology for shuttle and space station
Source record↗
Microelectronic power supplies Final report
Microelectronic power supply circuits for aerospace applications
Source record↗
Uses of ceramics in microelectronics: A survey
The properties and behavior of ceramic materials used in components for electronic circuitry are examined to appraise the present and future directions for microelectronics, and to suggest further product development, and how innovations may be useful in other technologies. Ceramic and glass insulators, resistors, capacitors, and the use of ceramics and glasses in microcircuitry are discussed along with technology transfer to nonaerospace uses.
Bratschun, W. R.↗
Development of a container for handling, testing, and storing discrete microelectronic components
A container has been developed for handling, testing, burning-in, and storing discrete microelectronic components without removal from the protective package. The package was designed to accommodate the leadless inverted device and other carrier-mounted active devices and chip-type discrete resistors and capacitors. Before the indicated development, components were handled and tested in various ways, some of which resulted in damage or contamination. The basic design of the container utilizes precision machined printed circuit boards and chemically milled (photoetched) contact springs. Included in this design for protection is an O-ring-sealed cover. Methods of fabrication and limitations of the current hardware are presented. Current applications of and possible extensions to the technology are discussed.
Filip, G. L.↗
Development of a hybrid microelectronics solid state relay for 2500 volts isolation and minus 120 C to 80 C thermal cycling range
A hybrid microelectronics solid state relay was developed in a TO-116 package for the MINX project. The relay provides 2500 Vdc input to output isolation and operated from a MHTL logic signal to switch a load of 400 Vdc at 2 mA. The relay is designed to operate in space and survive 1000 thermal cycles of 120 C to 80 C. The use of X-rays for failure analysis in small hybrid circuits proved valuable and the applications of vacuum deposited Parylene as a dielectric coating proved extremely valuable.
Sater, B. L.↗
Microelectronics packaging technique: A Concept
Plug-in flat packs and flat conductor cable (FCC) can be used to make compact, lightweight, external monitoring system requiring minimum of hard wiring. Microelectronic monitoring panel includes replaceable integrated or hybrid circuit flat packs and FCC.
Stringer, E. J.↗